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1. 发明申请

WO2003025652A1 HERMETICALLY SEALED PACKAGE CONTAINER FOR OPTICAL MODULE 审中-公开
标题翻译：用于光学模块的密封封装容器
公开(公告)号：WO2003025652A1
公开(公告)日：2003-03-27
申请号：PCT/KR2002/001729
申请日：2002-09-16
申请人： RAPIDUS, INC. , YOO, Myoung Ki , LEE, Seung Ick , HAN, Ki Woo , WON, Dong Mook
发明人： YOO, Myoung Ki , LEE, Seung Ick , HAN, Ki Woo , WON, Dong Mook
IPC分类号： G02B6/42
CPC分类号： G02B6/4201 , G02B6/4248 , G02B6/4251 , G02B6/4253 , G02B6/4255 , G02B6/4267 , G02B6/4268 , G02B6/4271 , G02B6/428
摘要： In order to minimize thermal deformation of a package caused by joining, brazing or soldering process between different materials, exterior environments or on/off operation of an optical module, the present invention provides a hermetically sealed package container for optical module, comprising; a heat-dissipating bottom plate which an optical-semiconductor element including laser diode element, photodiode element and printed circuit board, and an electronic cooling element installed directly under the optical-semiconductor element for cooling the optical-semiconductor element are installed, wherein the bottom plate is made from tungsten-copper composite material and dissipates heat from the optical-semiconductor element and/or the electronic cooling element outside of the bottom surface of the package; a heat-dissipating frame perpendicular to the bottom plate for constituting the package wherein the frame is made from tungsten-copper composite material to form a one-body with the bottom plate and dissipates heat from the optical-semiconductor element and/or the electronic cooling element outside of the side surface of the package; a ceramic part for insulating the frame and/or the bottom plate from a lead frame incoming from outside for actuating the optical-semiconductor element; a pipe installed in the frame for transmitting/receiving optical signals from outside.
摘要翻译：为了最小化由不同材料之间的接合，钎焊或焊接工艺导致的包装材料的热变形，外部环境或光学模块的开/关操作，本发明提供一种用于光学模块的气密密封包装容器，包括：安装了包括激光二极管元件，光电二极管元件和印刷电路板的光半导体元件和直接安装在用于冷却光半导体元件的光半导体元件下方的电子冷却元件的散热底板，其中底部板由钨铜复合材料制成，并且从封装的底表面外部的光半导体元件和/或电子冷却元件散发热量; 用于构成封装的垂直于底板的散热框架，其中框架由钨 - 铜复合材料制成，以与底板形成一体并且散发来自光半导体元件的热量和/或电子冷却元件外侧的表面; 用于使框架和/或底板与从外部进入的引线框架绝缘以致动光学半导体元件的陶瓷部件; 安装在框架中的用于从外部发送/接收光信号的管道。

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