专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPH09241084A BALLAST DEPOSIT 失效
公开(公告)号：JPH09241084A
公开(公告)日：1997-09-16
申请号：JP4917596
申请日：1996-03-06
申请人： RAILWAY TECHNICAL RES INST , HITACHI KASEI POLYMER CO LTD , NISHIYAMA KK
发明人： KOSEKI MASANOBU , ANDO KATSUTOSHI , NAKASAKA YUKINORI , MIFUNE NAOTO , OBA HISAE , KOJIMA TAKAMITSU , OKAJI HIROYO , KANEIWA TETSUYA
IPC分类号： C04B41/63
摘要： PROBLEM TO BE SOLVED: To prevent a ballast deposit for railway tracks from sinking by using a ballast the surface of which is coated with a specified thin polymer emulsion film. SOLUTION: In construction to install railway tracks, a ballast the surface of which is preliminarily coated with a polymer emulsion film having 5 to 300μm thickness is used for the ballast deposit to stabilize the road base. Thereby, each ballast has no contact point but a proper contact area with other ballasts, which largely improves sinking of the ballast deposit. Further, the obtd. ballast can be deposited under the same working conditions as those of a conventional ballast without decreasing the tamping property. As for the polymer emulsion, a styrene-butadiene copolymer is generally used, and a dipping process is excellent as a coating method.

2. 发明专利

JPH09242003A STABILIZING METHOD FOR BALAST RAILWAY 失效
公开(公告)号：JPH09242003A
公开(公告)日：1997-09-16
申请号：JP4917496
申请日：1996-03-06
申请人： RAILWAY TECHNICAL RES INST , NISHIYAMA KK , HITACHI KASEI POLYMER CO LTD
发明人： KOSEKI MASANOBU , ANDO KATSUTOSHI , NAKASAKA YUKINORI , MIFUNE NAOTO , OKAJI HIROYO , KANEIWA TETSUYA , OBA HISAE , KOJIMA TAKAMITSU
IPC分类号： E01B29/00
摘要： PROBLEM TO BE SOLVED: To remarkably reduce the number of correction working times for eneven sink by inserting a member for spraying coating material in an existing ballast, and then spraying the coating material to coat the surface of ballast therewith to thereby forming a film thereon. SOLUTION: Replenishment of ballast 3 required for correcting an uneven sink of railway 1 generating in an existing ballast is carried out and tamping is applied thereto by use of tie tamper. Next, a pressure insertion rod 23 is pressure inserted into the bottom of the ballast 3 while vibrating the rod 23 by a vibrator. Then, a valve 27 is opened to operate a pamp 26 to thereby pressure supply coating material from a coating material tank 25 for spraying the coating material from a plurality of nozzles 29 through a flow path 28 formed inside the rod 23, resulting in the application of coating material to the surface of the ballast 3. Thereafter, the pump 26 is stopped in its operation, the valve 27 is closed, and the rod 23 is pulled out. Finally the coating material is dried naturally to form the film thereon.

3. 发明专利

JP2009253213A Adhesive composition for flexible printed wiring board, adhesive film for flexible printed wiring board using the adhesive composition, and cover ray film for flexible printed wiring board 审中-公开
标题翻译：用于柔性印刷线路板的粘合组合物，用于柔性印刷电路板的粘合膜，以及用于柔性印刷线路板的覆盖膜
公开(公告)号：JP2009253213A
公开(公告)日：2009-10-29
申请号：JP2008102618
申请日：2008-04-10
申请人： Hitachi Kasei Polymer Co Ltd , 日立化成ポリマー株式会社
发明人： SUGANO HIDEJI , OBA HISAE
IPC分类号： H05K3/38 , C09J7/00 , C09J161/06 , C09J163/02 , C09J163/04 , C09J183/04 , C09J201/00 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for a flexible printed wiring board, which is fire-resistant, can reduce resin flow-out during press processing and has reflow solder heat resistance capable of corresponding to lead-free soldering, and to provide an adhesive film and a cover ray film.
SOLUTION: The adhesive composition for the flexible printed wiring board contains elastomer (A), a heat curing component (B), a curing agent (C), an inorganic filler (D), and a silicon oligomer (E) uses a mixture of at least one of bisphenol A type epoxy resin and bisphenol F type epoxy resin and novolak type epoxy resin, and phenol resin as the heat curing component (B).
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供耐火的柔性印刷电路板用粘合剂组合物，可以减少压制加工期间的树脂流出，并且具有能够对应于无铅焊接的回流焊料耐热性，并提供粘合膜和覆盖光线膜。解决方案：用于柔性印刷线路板的粘合剂组合物包含弹性体（A），热固化组分（B），固化剂（C），无机填料（D）和硅低聚物（E）双酚A型环氧树脂和双酚F型环氧树脂和酚醛清漆型环氧树脂中的至少一种的混合物和酚醛树脂作为热固化组分（B）。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2009073971A Adhesive film with separator and adhesive film for flexible printed wiring board using it 审中-公开
标题翻译：带有分离器和粘合膜的粘合膜使用它的柔性印刷线路板
公开(公告)号：JP2009073971A
公开(公告)日：2009-04-09
申请号：JP2007245370
申请日：2007-09-21
申请人： Hitachi Kasei Polymer Co Ltd , 日立化成ポリマー株式会社
发明人： OBA HISAE , TAN MASAO , OIKAWA FUTOSHI
IPC分类号： C09J7/02 , C09J201/00 , H05K1/03 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide an adhesive film with a separator having appropriate mold release force, exhibiting excellent handling ease in peeling work and the like and having excellent slit property and punching workability, and to provide an adhesive film for a flexible printed wiring board using it.
SOLUTION: In the adhesive film with a separator, an adhesive film layer is provided on the side, to which a mold release agent is applied, in the separator formed by layering a film coated with alkyd resin-based mold release agent and paper. The adhesive film layer is formed of an adhesive comprising (A) an elastomer, (B) a thermosetting resin, and (C) a curing agent. The mold release force between the separator and the adhesive film layer is preferably 50-150 mN/10 mm in a peel test.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有合适的脱模力的隔膜的粘合剂膜，在剥离加工等方面表现出优异的处理容易性并且具有优异的狭缝性能和冲压加工性，并且提供了一种用于柔性的粘合剂膜印刷线路板使用它。解决方案：在具有隔膜的粘合膜中，在通过层压涂覆有醇酸树脂基脱模剂的膜而形成的隔板中，在其上施加有脱模剂的侧面上设置粘合膜层，以及纸。粘合膜层由包含（A）弹性体，（B）热固性树脂和（C）固化剂）的粘合剂形成。在剥离试验中，隔片和粘合膜层之间的脱模力优选为50-150mN / 10mm。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2001262041A AQUEOUS PRIMER COMPOSITION 失效
公开(公告)号：JP2001262041A
公开(公告)日：2001-09-26
申请号：JP2000118712
申请日：2000-03-16
申请人： HITACHI KASEI POLYMER CO LTD
发明人： HASEGAWA KATSURO , OBA HISAE
IPC分类号： C09D113/02 , C09D5/00 , C09D167/00 , C09D193/04
摘要： PROBLEM TO BE SOLVED: To provide an aqueous primer composition for sticking a polyolefin expanded material to a steel plate, suitable for preliminarily applying on a polyolefin expanded material used as an insulating material for a roof and a wall material, etc., and heat actively bonding to a steel plate, excellent in blocking resistance, adhesiveness, and water resistance, and low in bubbling property and good in wettability to the polyolefin expanded material. SOLUTION: This aqueous primer composition comprises 100 pts.wt. carboxylated chloroprene latex (A), 10-200 pts.wt. rosin resin emulsion (B) having a resin softening point of 80-170 deg.C, 5-30 pts.wt. polyster dispersion (C), and a total 0.1-10 pts.wt. acetylenediol (D) and acetylenediol ethylene oxide (E) at a 1/3-3/1 pt.wt. ratio of the acetylenediol (D) to the acetylenediol ethylene oxide (E) adduct in an effective component equivalent.

6. 发明专利

JP2012180472A Adhesive composition for flexible printed wiring board and coverlay film using the same 有权
标题翻译：用于柔性印刷线路板的胶粘组合物和使用其的覆盖膜
公开(公告)号：JP2012180472A
公开(公告)日：2012-09-20
申请号：JP2011045041
申请日：2011-03-02
申请人： Hitachi Kasei Polymer Co Ltd , 日立化成ポリマー株式会社
发明人： OBA HISAE , SUGANO HIDEJI
IPC分类号： C09J133/00 , C09J7/02 , C09J11/04 , C09J11/06 , C09J183/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for a flexible printed wiring board having halogen-free flame retardancy and high heat resistance compatible with lead-free solder, and a coverlay film.SOLUTION: The adhesive composition for a flexible printed wiring board comprises an acrylic elastomer (A), a thermosetting component (B), pyrogallol (C), a metal phosphinate (D), an inorganic filler (E), and a silicone oligomer (F). The metal phosphinate (D) is one or more selected from aluminum phosphinate, calcium phosphinate and zinc phosphinate.
摘要翻译：要解决的问题：提供一种具有无卤阻燃性和与无铅焊料兼容的高耐热性的柔性印刷线路板的粘合剂组合物和覆盖膜。解决方案：用于柔性印刷线路板的粘合剂组合物包括丙烯酸类弹性体（A），热固性组分（B），连苯三酚（C），金属次膦酸盐（D），无机填料（E）和硅氧烷低聚物（F）。金属次膦酸盐（D）是选自次膦酸铝，次膦酸钙和次膦酸锌中的一种或多种。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2009007442A Adhesive composition for flexible printed wiring board and adhesive film for flexible printed wiring board obtained using the same 审中-公开
标题翻译：用于柔性印刷线路板的胶粘组合物和使用其的柔性印刷线路板的粘合膜
公开(公告)号：JP2009007442A
公开(公告)日：2009-01-15
申请号：JP2007168912
申请日：2007-06-27
申请人： Hitachi Kasei Polymer Co Ltd , 日立化成ポリマー株式会社
发明人： KUWABARA NORIKO , OBA HISAE , TAKANO MARE
IPC分类号： C09J201/08 , C09J7/00 , C09J109/02 , C09J161/06 , C09J163/00 , C09J183/00 , C09J183/02 , C09J183/04
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for flexible printed wiring boards that hardly suffers from resin flow-out at the time of press, has reflowed-solder heat resistance coping with lead-free solder and exhibits excellent heat aging resistance, and an adhesive film.
SOLUTION: The adhesive composition for flexible printed wiring boards comprises a carboxy group-containing elastomer (A), an acrylonitrile-butadiene rubber (B) having a bound acrylonitrile content of 30-60 wt.%, a thermosetting component (C), an inorganic filler (D), a curing agent (E), and a silicone oligomer (F).
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供在压制时几乎不受树脂流出的柔性印刷线路板的粘合剂组合物，具有应对无铅焊料的回流焊料耐热性并且显示出优异的耐热老化性，和粘合膜。解决方案：柔性印刷电路板用粘合剂组合物包含含羧基的弹性体（A），结合丙烯腈含量为30-60重量％的丙烯腈 - 丁二烯橡胶（B），热固性组分（C ），无机填料（D），固化剂（E）和硅氧烷低聚物（F）。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2006328145A Adhesive composition for coverlay of flexible printed circuit board and the flexible printed circuit board given by using the same 有权
标题翻译：柔性印刷电路板用粘合剂组合物及使用该柔性印刷电路板的柔性印刷电路板
公开(公告)号：JP2006328145A
公开(公告)日：2006-12-07
申请号：JP2005150942
申请日：2005-05-24
申请人： Hitachi Kasei Polymer Co Ltd , 日立化成ポリマー株式会社
发明人： OBA HISAE , TAKAYAMA MURAKI , TAN MASAO , KOTANI JUNICHI , TAKANO MARE
IPC分类号： C09J201/00 , C09J11/04 , C09J161/10 , C09J163/00 , C09J183/04 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for a coverlay, free from halogen, excellent in resistance to migration, flame retardancy, and peeling strength, and used in a flexible printed circuit board, and to provide the flexible printed circuit board given by using the same.
SOLUTION: This halogen-free adhesive composition is used for the coverlay of the flexible printed circuit board, wherein the adhesive composition for the coverlay contains an elastomer (A), a thermosetting component (B), a metal hydroxide, (D) a curing agent, and (E) a silicone oligomer. The elastomer (A) preferably has one or more functional groups reactive with a thermosetting resin of the thermosetting component (B). Further, a surface of the metal hydroxide (C) is preferably treated with the silicone oligomer (E).
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种无卤素，耐迁移性，阻燃性和剥离强度优异的覆盖物用粘合剂组合物，并用于柔性印刷电路板，并提供柔性印刷电路板使用相同。解决方案：该无卤素粘合剂组合物用于柔性印刷电路板的覆盖层，其中用于覆盖层的粘合剂组合物包含弹性体（A），热固性组分（B），金属氢氧化物（D ）固化剂，和（E）聚硅氧烷低聚物。弹性体（A）优选具有与热固性组分（B）的热固性树脂反应的一种或多种官能团。此外，金属氢氧化物（C）的表面优选用硅氧烷低聚物（E）处理。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2002265906A ADHESIVE COMPOSITION FOR LAMINATION USED IN FLEXIBLE PRINTED CIRCUIT BOARD AND ADHESIVE FILM 失效
公开(公告)号：JP2002265906A
公开(公告)日：2002-09-18
申请号：JP2001110610
申请日：2001-03-06
申请人： HITACHI KASEI POLYMER CO LTD
发明人： HASEGAWA KATSURO , SHIRAISHI SHIGEFUMI , KOTANI JUNICHI , OBA HISAE , MATSUMIYA HISAO
IPC分类号： C09J7/00 , C09J133/00 , C09J161/06 , C09J163/00 , C09J177/00 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition for lamination used in a flexible printed circuit board that has excellent thermal impact resistance and press workability, and an adhesive film. SOLUTION: This adhesive film is composed of an adhesive composition for lamination used in a flexible printed circuit board comprising (a) an acrylic rubber having a carboxylic acid functional group, (b) an epoxy resin, (c) a polyamide amine, (d) a phenol resin, and (e) a curing agent or curing catalyst, wherein the added amount of component (c) is 0.1-10 pts.wt. per 100 pts.wt. of component (b).

10. 发明专利

JP2001291964A ADHESIVE AGENT COMPOSITION AND ADHESIVE FILM FOR FLEXIBLE PRINTED WIRING BOARD LAMINATION 失效
公开(公告)号：JP2001291964A
公开(公告)日：2001-10-19
申请号：JP2000142538
申请日：2000-04-07
申请人： HITACHI KASEI POLYMER CO LTD
发明人： OBA HISAE , MATSUMIYA HISAO , KOTANI JUNICHI
IPC分类号： C09J7/00 , C09J133/04 , C09J161/06 , C09J163/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an adhesive agent composition and an adhesive film for FPM lamination for improved press workability, heat resistance and adhesibility. SOLUTION: In the adhesive film for FPC lamination, using the adhesive agent composition for FPC lamination composed of poly-N-glycidyl amine type rubber crosslinking agent (b) in 0.01-5 wt.% with respect to 100 wt.% acrylic rubber (a), containing carboxylic acid as functional group, epoxy resin (c), phenol resin (d) and a hardener or a curing catalyst (e), the melt viscosity of an adhesive film layer is 102 to 107 Pa.S (170 deg.C) and hold releasing papers are laminated.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式