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    • 3. 发明申请
    • ELECTRICAL DEVICES WITH REMOVABLE ACTUATOR FRAMES
    • 具有可拆卸执行机构框架的电气设备
    • US20110259722A1
    • 2011-10-27
    • US12768600
    • 2010-04-27
    • R. David AldersonMichael D. Williams
    • R. David AldersonMichael D. Williams
    • H01H23/02
    • H01H23/04H01H23/145H02G3/14
    • In one embodiment, a system may include an electrical device, an actuator for the electrical device, and an interchangeable frame configured to be removeably attached to the electrical device and to hold the actuator. The frame may be adapted to pivotally engage the electrical device. In another embodiment, an electrical device may have an interface adapted to enable a frame to be attached to and removed from the electrical device, an opening in the electrical device, a subactuator arranged to actuate a switch in the electrical device through the opening, and to engage an actuator on the frame when the frame is attached to the electrical device, and a first rim disposed about the opening. The subactuator may include a second rim arranged to overlap the first rim.
    • 在一个实施例中,系统可以包括电气设备,用于电气设备的致动器以及被配置为可移除地附接到电气设备并且保持致动器的可互换框架。 框架可以适于枢转地接合电气装置。 在另一个实施例中,电气设备可以具有适于使框架能够附接到电气设备和电气设备中的接口,电气设备中的开口,被布置成通过开口致动电子设备中的开关的子致动器,以及 当框架附接到电气设备时,将致动器接合在框架上,以及围绕开口设置的第一边缘。 子致动器可以包括布置成与第一边缘重叠的第二边缘。
    • 5. 发明授权
    • Electrical devices with removable actuator frames
    • 具有可移动执行器框架的电气设备
    • US09082569B2
    • 2015-07-14
    • US12768600
    • 2010-04-27
    • R. David AldersonMichael D. Williams
    • R. David AldersonMichael D. Williams
    • H01H23/02H05K5/03H01H23/04H02G3/14H01H23/14
    • H01H23/04H01H23/145H02G3/14
    • In one embodiment, a system may include an electrical device, an actuator for the electrical device, and an interchangeable frame configured to be removeably attached to the electrical device and to hold the actuator. The frame may be adapted to pivotally engage the electrical device. In another embodiment, an electrical device may have an interface adapted to enable a frame to be attached to and removed from the electrical device, an opening in the electrical device, a subactuator arranged to actuate a switch in the electrical device through the opening, and to engage an actuator on the frame when the frame is attached to the electrical device, and a first rim disposed about the opening. The subactuator may include a second rim arranged to overlap the first rim.
    • 在一个实施例中,系统可以包括电气设备,用于电气设备的致动器以及被配置为可移除地附接到电气设备并且保持致动器的可互换框架。 框架可以适于枢转地接合电气装置。 在另一个实施例中,电气设备可以具有适于使框架能够附接到电气设备和电气设备中的接口,电气设备中的开口,被布置成通过开口致动电子设备中的开关的子致动器,以及 当框架附接到电气设备时,将致动器接合在框架上,以及围绕开口设置的第一边缘。 子致动器可以包括布置成与第一边缘重叠的第二边缘。
    • 7. 发明授权
    • Method of forming open-network polishing pads
    • 形成开网抛光垫的方法
    • US08801949B2
    • 2014-08-12
    • US13239951
    • 2011-09-22
    • Hamed LakroutBen W SchaeferMichael D. Williams
    • Hamed LakroutBen W SchaeferMichael D. Williams
    • C23F1/02B24B37/22B24D11/00B24B37/26
    • B24B37/22B24B37/26B24D11/003
    • The method forms forming an open-network polishing pad useful for polishing magnetic, semiconductor and optical substrates. The method provides a polymer sheet or film of a curable polymer and exposes the polymer sheet or film to an energy source to create an exposure pattern in the polymer sheet or film. The exposure pattern having elongated sections exposed to the energy source. After attaching the polymer sheet or film to an open-network substrate, the method removes polymer adjacent from the exposed polymer sheet or film of the intermediate structure with a solvent. This forms elongated channels through the polymer sheet or film in a texture pattern that corresponds to the exposure pattern with the open-network supporting the polymer. The elongated channels extending through the thickness of the polymer sheet or film to form the open-network polishing pad.
    • 该方法形成用于抛光磁性,半导体和光学衬底的开放网络抛光垫。 该方法提供可固化聚合物的聚合物片材或膜,并将聚合物片材或膜暴露于能量源以在聚合物片材或膜中产生曝光图案。 曝光图案具有暴露于能量源的细长部分。 在将聚合物片或膜连接到开放网络基板上之后,该方法用溶剂除去与暴露的聚合物片或中间结构的膜相邻的聚合物。 这形成通过聚合物片材或膜的细长通道,其以对应于曝光图案的纹理图案与支撑聚合物的开放网络形成。 细长通道延伸穿过聚合物片或薄膜的厚度以形成开放式网状抛光垫。
    • 8. 发明授权
    • Lead-free primers
    • 无铅底漆
    • US08216401B1
    • 2012-07-10
    • US13267009
    • 2011-10-06
    • John W. FronabargerMichael D. Williams
    • John W. FronabargerMichael D. Williams
    • C06B25/00C06B25/34D03D23/00D03D43/00
    • C06C7/00F42B3/124F42B3/128
    • Embodiments of the present subject matter provide an improved percussion primer composition and improved hot-wire igniter acceptor, wherein lead styphnate is replaced with a lead-free material, 4,6-dinitro-7-hydroxybenzofuroxan, potassium salt (KDNP). Embodiments of the percussion primer composition include KDNP, a sensitizer, an oxidizer, calcium silicide, a fuel, and a binder. Embodiments of the hot-wire igniter device include a bridgewire, an acceptor, and an output, where KDNP is the acceptor. Power supply may be in the form of constant current/voltage or current flow from a capacitor discharge. Certain embodiments utilize a variety of output formulations, such as BKNO3, black powder, and Red Dot double base propellant.
    • 本发明的实施方案提供了改进的冲击底漆组合物和改进的热丝点火器受体,其中使用无铅材料,4,6-二硝基-7-羟基苯并呋喃,钾盐(KDNP)替代苯氧基铅。 冲击底漆组合物的实施方案包括KDNP,敏化剂,氧化剂,硅化钙,燃料和粘合剂。 热丝点火装置的实施例包括桥接器,接收器和输出端,其中KDNP是受电器。 电源可以是来自电容器放电的恒定电流/电压或电流的形式。 某些实施方案利用各种输出配方,例如BKNO3,黑粉和红点双基推进剂。
    • 9. 发明申请
    • LEAD-FREE PRIMERS
    • 无铅PRIMERS
    • US20120152140A1
    • 2012-06-21
    • US13267009
    • 2011-10-06
    • John W. FronabargerMichael D. Williams
    • John W. FronabargerMichael D. Williams
    • F42B3/12
    • C06C7/00F42B3/124F42B3/128
    • Embodiments of the present subject matter provide an improved percussion primer composition and improved hot-wire igniter acceptor, wherein lead styphnate is replaced with a lead-free material, 4,6-dinitro-7-hydroxybenzofuroxan, potassium salt (KDNP). Embodiments of the percussion primer composition include KDNP, a sensitizer, an oxidizer, calcium silicide, a fuel, and a binder. Embodiments of the hot-wire igniter device include a bridgewire, an acceptor, and an output, where KDNP is the acceptor. Power supply may be in the form of constant current/voltage or current flow from a capacitor discharge. Certain embodiments utilize a variety of output formulations, such as BKNO3, black powder, and Red Dot double base propellant.
    • 本发明的实施方案提供了改进的冲击底漆组合物和改进的热丝点火器受体,其中使用无铅材料,4,6-二硝基-7-羟基苯并呋喃,钾盐(KDNP)替代苯氧基铅。 冲击底漆组合物的实施方案包括KDNP,敏化剂,氧化剂,硅化钙,燃料和粘合剂。 热丝点火装置的实施例包括桥接器,接收器和输出端,其中KDNP是受电器。 电源可以是来自电容器放电的恒定电流/电压或电流的形式。 某些实施方案利用各种输出配方,例如BKNO3,黑粉和红点双基推进剂。
    • 10. 发明授权
    • Lead-free primary explosive composition and method of preparation
    • 无铅初级炸药组合物及其制备方法
    • US08071784B2
    • 2011-12-06
    • US12900531
    • 2010-10-08
    • John W. FronabargerMichael D. WilliamsWilliam B Sanborn
    • John W. FronabargerMichael D. WilliamsWilliam B Sanborn
    • C07D257/04
    • C06B49/00C07D257/06
    • Embodiments of the present subject matter provide a compound and material that may be used as a lead-free primary explosive. An embodiment of the present subject matter provides the compound copper(I) nitrotetrazolate. Certain embodiments of the present subject matter provide methods for preparing lead-free primary explosives. The method includes: providing cuprous salt; providing water; providing 5-nitrotetrazolate salt; combining the cuprous salt, water and 5-nitrotetrazolate salt to form a mixture; and heating the mixture. The method may also include providing cuprous chloride and providing sodium 5-nitrotetrazolate. Certain embodiments of the present subject matter also provide methods for preparing copper(I) nitrotetrazolate. The method includes: providing cuprous salt; providing water; providing 5-nitrotetrazolate salt; combining the cuprous salt, water and 5-nitrotetrazolate salt to form a mixture; and heating the mixture. The method may also include providing cuprous chloride and providing sodium 5-nitrotetrazolate.
    • 本主题的实施方案提供可用作无铅初级炸药的化合物和材料。 本主题的一个实施方案提供了复合铜(I)硝基四氮烯酸盐。 本主题的某些实施例提供了制备无铅初级炸药的方法。 该方法包括:提供亚铜盐; 提供水; 提供5-硝基四氮唑盐; 结合亚铜盐,水和5-硝基四氮唑盐形成混合物; 并加热混合物。 该方法还可以包括提供氯化亚铜和提供5-硝基四氮唑钠。 本发明的某些实施方案还提供了制备硝基四氮烯酸铜(I)的方法。 该方法包括:提供亚铜盐; 提供水; 提供5-硝基四氮唑盐; 结合亚铜盐,水和5-硝基四氮唑盐形成混合物; 并加热混合物。 该方法还可以包括提供氯化亚铜和提供5-硝基四氮唑钠。