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1. 发明申请

US20110095367A1 ESD/ANTENNA DIODES FOR THROUGH-SILICON VIAS 有权
标题翻译： ESD /天线二极管
公开(公告)号：US20110095367A1
公开(公告)日：2011-04-28
申请号：US12605102
申请日：2009-10-23
申请人： Qing Su , Min Ni , Zongwu Tang , Jamil Kawa , James D. Sproch
发明人： Qing Su , Min Ni , Zongwu Tang , Jamil Kawa , James D. Sproch
IPC分类号： H01L27/06 , G06F17/50 , H01L21/336
CPC分类号： G06F17/5068 , H01L23/481 , H01L23/60 , H01L23/62 , H01L27/0207 , H01L27/0255 , H01L2225/06541 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要： Roughly described, an antenna diode is formed at least partially within the exclusion zone around a TSV, and is connected to the TSV by way of a metal 1 layer conductor at the same time that the TSV is connected to either the gate poly or a diffusion region of one or more transistors placed outside the exclusion zone.
摘要翻译：粗略地描述，天线二极管至少部分地形成在TSV周围的排阻区内，并且通过金属1层导体连接到TSV，同时TSV连接到栅极多晶硅或扩散层放置在排除区外的一个或多个晶体管的区域。

2. 发明授权

US08877638B2 ESD/antenna diodes for through-silicon vias 有权
标题翻译：用于穿硅通孔的ESD /天线二极管
公开(公告)号：US08877638B2
公开(公告)日：2014-11-04
申请号：US13567922
申请日：2012-08-06
申请人： Jamil Kawa , Min Ni , James D. Sproch , Qing Su , Zongwu Tang
发明人： Jamil Kawa , Min Ni , James D. Sproch , Qing Su , Zongwu Tang
IPC分类号： H01L21/44 , H01L23/48 , H01L23/62 , H01L27/02 , H01L23/60 , G06F17/50
CPC分类号： G06F17/5068 , H01L23/481 , H01L23/60 , H01L23/62 , H01L27/0207 , H01L27/0255 , H01L2225/06541 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要： Roughly described, an antenna diode is formed at least partially within the exclusion zone around a TSV, and is connected to the TSV by way of a metal 1 layer conductor at the same time that the TSV is connected to either the gate poly or a diffusion region of one or more transistors placed outside the exclusion zone.
摘要翻译：粗略地描述，天线二极管至少部分地形成在TSV周围的排阻区内，并且通过金属1层导体连接到TSV，同时TSV连接到栅极多晶硅或扩散层放置在排除区外的一个或多个晶体管的区域。

3. 发明申请

US20120295433A1 ESD/ANTENNA DIODES FOR THROUGH-SILICON VIAS 有权
标题翻译： ESD /天线二极管
公开(公告)号：US20120295433A1
公开(公告)日：2012-11-22
申请号：US13567922
申请日：2012-08-06
申请人： Qing Su , Min Ni , Zongwu Tang , Jamil Kawa , James D. Sproch
发明人： Qing Su , Min Ni , Zongwu Tang , Jamil Kawa , James D. Sproch
IPC分类号： H01L21/28
CPC分类号： G06F17/5068 , H01L23/481 , H01L23/60 , H01L23/62 , H01L27/0207 , H01L27/0255 , H01L2225/06541 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要： Roughly described, an antenna diode is formed at least partially within the exclusion zone around a TSV, and is connected to the TSV by way of a metal 1 layer conductor at the same time that the TSV is connected to either the gate poly or a diffusion region of one or more transistors placed outside the exclusion zone.
摘要翻译：粗略地描述，天线二极管至少部分地形成在TSV周围的排阻区内，并且通过金属1层导体连接到TSV，同时TSV连接到栅极多晶硅或扩散层放置在排除区外的一个或多个晶体管的区域。

4. 发明授权

US08264065B2 ESD/antenna diodes for through-silicon vias 有权
标题翻译：用于穿硅通孔的ESD /天线二极管
公开(公告)号：US08264065B2
公开(公告)日：2012-09-11
申请号：US12605102
申请日：2009-10-23
申请人： Qing Su , Min Ni , Zongwu Tang , Jamil Kawa , James D. Sproch
发明人： Qing Su , Min Ni , Zongwu Tang , Jamil Kawa , James D. Sproch
IPC分类号： H01L29/40 , H01L23/053 , H01L23/12 , H01L23/48 , H01L23/52 , H01L23/62
CPC分类号： G06F17/5068 , H01L23/481 , H01L23/60 , H01L23/62 , H01L27/0207 , H01L27/0255 , H01L2225/06541 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要： Roughly described, an antenna diode is formed at least partially within the exclusion zone around a TSV, and is connected to the TSV by way of a metal 1 layer conductor at the same time that the TSV is connected to either the gate poly or a diffusion region of one or more transistors placed outside the exclusion zone.
摘要翻译：粗略地描述，天线二极管至少部分地形成在TSV周围的排阻区内，并且通过金属1层导体连接到TSV，同时TSV连接到栅极多晶硅或扩散层放置在排除区外的一个或多个晶体管的区域。

5. 发明授权

US08458635B2 Convolution computation for many-core processor architectures 有权
标题翻译：多核处理器架构的卷积计算
公开(公告)号：US08458635B2
公开(公告)日：2013-06-04
申请号：US12631167
申请日：2009-12-04
申请人： Min Ni , Zongwu Tang , Qing Su
发明人： Min Ni , Zongwu Tang , Qing Su
IPC分类号： G06F17/50
CPC分类号： G06F17/5072 , G06F17/50 , G06F2217/68
摘要： A convolution of the kernel over a layout in a multi-core processor system includes identifying a sector, called a dynamic band, of the layout including a plurality of evaluation points. Layout data specifying the sector of the layout is loaded in shared memory, which is shared by a plurality of processor cores. A convolution operation of the kernel and the evaluation points in the sector is executed. The convolution operation includes iteratively loading parts of the basis data set, called a stride, into space available in shared memory given the size of the layout data specifying the sector. A plurality of threads is executed concurrently using the layout data for the sector and the currently loaded part of the basis data set. The iteration for the loading basis data set proceeds through the entire data set until the convolution operation is completed.
摘要翻译：内核在多核处理器系统中的布局的卷积包括识别包括多个评估点的布局的称为动态带的扇区。指定布局扇区的布局数据被加载到由多个处理器核共享的共享存储器中。执行内核和扇区中评估点的卷积运算。卷积操作包括在给定指定扇区的布局数据的大小的情况下，将称为步幅的基础数据集的部分迭代地加载到共享存储器中可用的空间中。使用用于扇区的布局数据和基础数据集的当前加载的部分来同时执行多个线程。加载基础数据集的迭代通过整个数据集进行，直到卷积操作完成。

6. 发明授权

US09331045B2 Semiconductor die laminating device with independent drives 有权
标题翻译：具有独立驱动器的半导体模具贴合装置
公开(公告)号：US09331045B2
公开(公告)日：2016-05-03
申请号：US14399495
申请日：2012-05-07
申请人： Wei Gu , Zhong Lu , Cheeman Yu , Chin-Tien Chiu , En-Yong Tai , Min Ni
发明人： Wei Gu , Zhong Lu , Cheeman Yu , Chin-Tien Chiu , En-Yong Tai , Min Ni
IPC分类号： H01L23/00 , H01L23/544 , H01L23/31 , H01L21/56 , H01L25/065
CPC分类号： H01L24/75 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/3121 , H01L23/544 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/97 , H01L25/0657 , H01L2223/5442 , H01L2223/54426 , H01L2223/54486 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49 , H01L2224/73265 , H01L2224/753 , H01L2224/75301 , H01L2224/75702 , H01L2224/75753 , H01L2224/7598 , H01L2224/83132 , H01L2224/83193 , H01L2224/83203 , H01L2224/83856 , H01L2224/83862 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2224/83 , H01L2924/00012 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.
摘要翻译：公开了用于将基板上的半导体管芯（220）层压在基板（200）上的层压装置（230）和方法。层压装置（230）包括层叠单元（234,236,238,240），其彼此独立地操作，使得半导体管芯（220）的行或列可以独立地层压到基板的行或列上。

7. 发明申请

US20170124317A1 Interception-Proof Authentication and Encryption System and Method 审中-公开
公开(公告)号：US20170124317A1
公开(公告)日：2017-05-04
申请号：US15249355
申请日：2016-08-27
申请人： Min Ni
发明人： Min Ni
IPC分类号： G06F21/36 , H04L9/32
CPC分类号： G06F21/36 , H04L9/3226 , H04L63/0435 , H04L63/083
摘要： An interception-proof authentication and encryption system and method is provided that utilizes passcodes with individual pins that are made up of symbols from a set of symbols, and tokens that contain at least two symbols from the set of symbols used for the passcode. Multiple tokens (a “token set”) are presented to a user, with some or all of a user's pre-selected pins (symbols) randomly inserted into some or all of the tokens. The user selects a token from the token set for each pin position in the passcode. The user is authenticated based on the selected tokens. Because each selected token may or may not contain one of the pre-selected pins in the user's passcode, and also contains other randomly generated symbols that are not one of the pre-selected pins in the user's passcode, someone that observes which tokens the user has chosen cannot determine what the user's actual passcode is.

8. 发明申请

US20150115479A1 SEMICONDUCTOR DIE LAMINATING DEVICE WITH INDEPENDENT DRIVES 有权
标题翻译：具有独立驱动的半导体封装设备
公开(公告)号：US20150115479A1
公开(公告)日：2015-04-30
申请号：US14399495
申请日：2012-05-07
申请人： Wei Gu , Zhong Lu , Cheeman Yu , Chin-Tien Chiu , En-Yong Tai , Min Ni
发明人： Wei Gu , Zhong Lu , Cheeman Yu , Chin-Tien Chiu , En-Yong Tai , Min Ni
IPC分类号： H01L23/00 , H01L23/31 , H01L21/56
CPC分类号： H01L24/75 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/3121 , H01L23/544 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/97 , H01L25/0657 , H01L2223/5442 , H01L2223/54426 , H01L2223/54486 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49 , H01L2224/73265 , H01L2224/753 , H01L2224/75301 , H01L2224/75702 , H01L2224/75753 , H01L2224/7598 , H01L2224/83132 , H01L2224/83193 , H01L2224/83203 , H01L2224/83856 , H01L2224/83862 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2224/83 , H01L2924/00012 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.
摘要翻译：公开了用于将基板上的半导体管芯（220）层压在基板（200）上的层压装置（230）和方法。层压装置（230）包括层叠单元（234,236,238,240），其彼此独立地操作，使得半导体管芯（220）的行或列可以独立地层压到基板的行或列上。

9. 发明授权

US10289830B2 Interception-proof authentication and encryption system and method 有权
公开(公告)号：US10289830B2
公开(公告)日：2019-05-14
申请号：US15249355
申请日：2016-08-27
申请人： Min Ni
发明人： Min Ni
IPC分类号： H04L29/06 , G06F21/00 , G06F21/36 , H04L9/32
摘要： An interception-proof authentication and encryption system and method is provided that utilizes passcodes with individual pins that are made up of symbols from a set of symbols, and tokens that contain at least two symbols from the set of symbols used for the passcode. Multiple tokens (a “token set”) are presented to a user, with some or all of a user's pre-selected pins (symbols) randomly inserted into some or all of the tokens. The user selects a token from the token set for each pin position in the passcode. The user is authenticated based on the selected tokens. Because each selected token may or may not contain one of the pre-selected pins in the user's passcode, and also contains other randomly generated symbols that are not one of the pre-selected pins in the user's passcode, someone that observes which tokens the user has chosen cannot determine what the user's actual passcode is.

10. 发明授权

US09460280B1 Interception-proof authentication and encryption system and method 有权
标题翻译：拦截验证和加密系统及方法
公开(公告)号：US09460280B1
公开(公告)日：2016-10-04
申请号：US14931613
申请日：2015-11-03
申请人： Min Ni
发明人： Min Ni
IPC分类号： H04L29/06 , G06F21/00 , G06F21/36
CPC分类号： G06F21/36 , H04L9/3226 , H04L63/0435 , H04L63/083
摘要： An interception-proof authentication and encryption system and method is provided that utilizes passcodes with individual pins that are made up of symbols from a set of symbols, and tokens that contain at least two symbols from the set of symbols used for the passcode. Multiple tokens (a “token set”) are presented to a user, with some or all of a user's pre-selected pins (symbols) randomly inserted into some or all of the tokens. The user selects a token from the token set for each pin position in the passcode. The user is authenticated based on the selected tokens. Because each selected token may or may not contain one of the pre-selected pins in the user's passcode, and also contains other randomly generated symbols that are not one of the pre-selected pins in the user's passcode, someone that observes which tokens the user has chosen cannot determine what the user's actual passcode is.
摘要翻译：提供了一种拦截防范认证和加密系统和方法，其利用由来自一组符号的符号组成的各个引脚的密码以及从用于密码的符号集合中包含至少两个符号的令牌。将多个令牌（“令牌集”）呈现给用户，其中一些或全部用户的预先选择的引脚（符号）随机插入到某些或所有令牌中。用户从密码中的每个引脚位置的令牌集中选择令牌。用户根据所选令牌进行身份验证。因为每个所选择的令牌可以包含或可以不包含用户密码中的一个预选择的引脚，并且还包含其他随机生成的符号，其不是用户密码中的预先选择的引脚之一，观察到哪个令牌用户已经选择不能确定用户的实际密码是什么。

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