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1. 发明授权

US09429427B2 Inductive inertial sensor architecture and fabrication in packaging build-up layers 有权
标题翻译：感应惯性传感器结构和制造在包装堆积层
公开(公告)号：US09429427B2
公开(公告)日：2016-08-30
申请号：US13720876
申请日：2012-12-19
申请人： Qing Ma , Feras Eid , Kevin Lin , Johanna M. Swan , Weng Hong Teh , Valluri R. Rao
发明人： Qing Ma , Feras Eid , Kevin Lin , Johanna M. Swan , Weng Hong Teh , Valluri R. Rao
IPC分类号： G01C19/00 , G01C19/56 , G01C19/5776
CPC分类号： G01C19/56 , G01C19/5776
摘要： This invention relates to inductive inertial sensors employing a magnetic drive and/or sense architecture. In embodiments, translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. In embodiments, the vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity. In embodiments, self-inductances associated with a pair of meandering coils vary as a function of an angular velocity in a second dimension. In embodiments, package build-up layers are utilized to fabricate the inductive inertial sensors, enabling package-level integrated inertial sensing advantageous in small form factor computing platforms, such as mobile devices.
摘要翻译：本发明涉及采用磁驱动和/或感测架构的感应惯性传感器。在实施例中，平移陀螺仪利用在第一维度中制成的导电线圈作为在存在磁场的情况下驱动通过线圈的时变电流的函数。感应线圈记录在第二维度上作为角速度的函数变化的电感。在实施例中，振动线圈使得感测线圈中的第一和第二互感器作为角速度的函数彼此偏离。在实施例中，与一对曲折线圈相关联的自感量作为第二维度中的角速度的函数而变化。在实施例中，使用封装积层来制造感应惯性传感器，使得能够在诸如移动设备的小尺寸计算平台中有利的封装级集成惯性感测。

2. 发明申请

US20140083858A1 HETEROGENEOUS INTEGRATION OF MICROFLUIDIC DEVICES IN PACKAGE STRUCTURES 有权
标题翻译：微型流体装置在包装结构中的异质整合
公开(公告)号：US20140083858A1
公开(公告)日：2014-03-27
申请号：US13624288
申请日：2012-09-21
申请人： Weng Hong Teh , Kevin Lin , Feras Eid , Qing Ma
发明人： Weng Hong Teh , Kevin Lin , Feras Eid , Qing Ma
IPC分类号： B01D43/00 , H05K3/30
CPC分类号： H05K1/0272 , H01L21/568 , H01L24/19 , H01L24/20 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2924/1815 , H01L2924/18162 , H05K1/0212 , H05K1/185 , H05K3/0097 , H05K2201/097 , H05K2203/1536 , H05K2203/308 , Y10T29/4913
摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.
摘要翻译：描述了形成微电子封装结构的方法及由此形成的相关结构。这些方法可以包括将微流体管芯附接到封装结构，其中微流体管芯包括可以与设置在封装结构内的信号焊盘耦合的多个不对称电极。

3. 发明授权

US09297824B2 Techniques, systems and devices related to acceleration measurement 有权
标题翻译：与加速度测量相关的技术，系统和设备
公开(公告)号：US09297824B2
公开(公告)日：2016-03-29
申请号：US13618003
申请日：2012-09-14
申请人： Qing Ma , Valluri Rao , Feras Eid , Kevin Lin , Weng Hong Teh , Johanna Swan , Robert Sankman
发明人： Qing Ma , Valluri Rao , Feras Eid , Kevin Lin , Weng Hong Teh , Johanna Swan , Robert Sankman
IPC分类号： G01P15/105 , G01P15/08 , G01P15/097 , G01P15/18
CPC分类号： G01P15/097 , G01P15/105 , G01P15/18
摘要： An accelerometer includes a mass, suspended by a beam, and associated conductive paths. Each conductive path is subjected to a magnetic field, such that, when a time varying signal is applied to the conductive paths, a characteristic resonant frequency is produced, and when the mass experiences an acceleration, a respective change in the resonant frequency is produced that may be interpreted as acceleration data. Embodiments include methods of manufacturing an accelerometer and systems and devices incorporating the accelerometer.
摘要翻译：加速度计包括由梁悬挂的质量块和相关联的导电路径。每个导电路径受到磁场的影响，使得当对导电路径施加时变信号时，产生特性谐振频率，并且当质量经历加速度时，产生谐振频率的相应变化，可以解释为加速度数据。实施例包括制造加速度计的方法和结合有加速度计的系统和装置。

4. 发明申请

US20140002178A1 SEMICONDUCTOR PACKAGE WITH MECHANICAL FUSE 有权
标题翻译：具有机械保险丝的半导体封装
公开(公告)号：US20140002178A1
公开(公告)日：2014-01-02
申请号：US13537573
申请日：2012-06-29
申请人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
发明人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
IPC分类号： H01L29/84 , H01H85/48
CPC分类号： H01L24/19 , H01H1/0036 , H01H59/0009 , H01L23/5382 , H01L23/5389 , H01L2224/04105 , H01L2224/73267 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor package having a mechanical fuse therein and methods to form a semiconductor package having a mechanical fuse therein are described. For example, a semiconductor structure includes a semiconductor package. A semiconductor die is housed in the semiconductor package. A microelectromechanical system (MEMS) device is housed in the semiconductor package. The MEMS device has a suspended portion. A mechanical fuse is housed in the semiconductor package and either coupled to, or decoupled from, the suspended portion of the MEMS device.
摘要翻译：描述了具有机械熔断器的半导体封装以及形成其中具有机械熔丝的半导体封装的方法。例如，半导体结构包括半导体封装。半导体管芯被容纳在半导体封装中。微机电系统（MEMS）装置容纳在半导体封装中。 MEMS器件具有悬挂部分。机械保险丝容纳在半导体封装中，并且耦合到MEMS器件的悬置部分或从MEMS器件的悬挂部分解耦。

5. 发明授权

US08633551B1 Semiconductor package with mechanical fuse 有权
标题翻译：半导体封装带机械保险丝
公开(公告)号：US08633551B1
公开(公告)日：2014-01-21
申请号：US13537573
申请日：2012-06-29
申请人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
发明人： Weng Hong Teh , Kevin L. Lin , Feras Eid , Qing Ma
IPC分类号： H01L27/14
CPC分类号： H01L24/19 , H01H1/0036 , H01H59/0009 , H01L23/5382 , H01L23/5389 , H01L2224/04105 , H01L2224/73267 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor package having a mechanical fuse therein and methods to form a semiconductor package having a mechanical fuse therein are described. For example, a semiconductor structure includes a semiconductor package. A semiconductor die is housed in the semiconductor package. A microelectromechanical system (MEMS) device is housed in the semiconductor package. The MEMS device has a suspended portion. A mechanical fuse is housed in the semiconductor package and either coupled to, or decoupled from, the suspended portion of the MEMS device.
摘要翻译：描述了具有机械熔断器的半导体封装以及形成其中具有机械熔丝的半导体封装的方法。例如，半导体结构包括半导体封装。半导体管芯被容纳在半导体封装中。微机电系统（MEMS）装置容纳在半导体封装中。 MEMS器件具有悬挂部分。机械保险丝容纳在半导体封装中，并且耦合到MEMS器件的悬置部分或从MEMS器件的悬挂部分解耦。

6. 发明申请

US20140000377A1 SEMICONDUCTOR PACKAGE WITH AIR PRESSURE SENSOR 有权
标题翻译：带空气压力传感器的半导体封装
公开(公告)号：US20140000377A1
公开(公告)日：2014-01-02
申请号：US13536210
申请日：2012-06-28
申请人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
发明人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
IPC分类号： H01L29/84 , G01L9/00
CPC分类号： G01L9/0042 , B81B7/0058 , B81B7/0077 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81C1/00246 , G01L9/0047 , G01L9/007 , G01L9/0073 , H01L24/19 , H01L29/84 , H01L2224/04105 , H01L2224/24137 , H01L2924/1461 , H01L2924/18162
摘要： A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity. Also described are various approaches to fabricating a semiconductor package having a hermetically sealed region.
摘要翻译：描述了具有空气压力传感器的半导体封装和形成具有气压传感器的半导体封装的方法。例如，半导体封装包括多个堆积层。空腔设置在一个或多个堆积层中。空气压力传感器设置在多个积聚层中，并且包括空腔和设置在空腔上方的电极。还描述了制造具有气密密封区域的半导体封装的各种方法。

7. 发明申请

US20160076961A1 SEMICONDUCTOR PACKAGE WITH AIR PRESSURE SENSOR 审中-公开
标题翻译：带空气压力传感器的半导体封装
公开(公告)号：US20160076961A1
公开(公告)日：2016-03-17
申请号：US14951422
申请日：2015-11-24
申请人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
发明人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
IPC分类号： G01L9/00 , B81B7/00
CPC分类号： G01L9/0042 , B81B7/0058 , B81B7/0077 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81C1/00246 , G01L9/0047 , G01L9/007 , G01L9/0073 , H01L24/19 , H01L29/84 , H01L2224/04105 , H01L2224/24137 , H01L2924/1461 , H01L2924/18162
摘要： A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity. Also described are various approaches to fabricating a semiconductor package having a hermetically sealed region.
摘要翻译：描述了具有空气压力传感器的半导体封装和形成具有气压传感器的半导体封装的方法。例如，半导体封装包括多个堆积层。空腔设置在一个或多个堆积层中。空气压力传感器设置在多个积聚层中，并且包括空腔和设置在空腔上方的电极。还描述了制造具有气密密封区域的半导体封装的各种方法。

8. 发明授权

US09200973B2 Semiconductor package with air pressure sensor 有权
标题翻译：半导体封装带气压传感器
公开(公告)号：US09200973B2
公开(公告)日：2015-12-01
申请号：US13536210
申请日：2012-06-28
申请人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
发明人： Kevin L. Lin , Qing Ma , Feras Eid , Johanna Swan , Weng Hong Teh
IPC分类号： G01L9/16 , G01L9/00 , B81B7/00 , B81C1/00 , H01L29/84
CPC分类号： G01L9/0042 , B81B7/0058 , B81B7/0077 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81C1/00246 , G01L9/0047 , G01L9/007 , G01L9/0073 , H01L24/19 , H01L29/84 , H01L2224/04105 , H01L2224/24137 , H01L2924/1461 , H01L2924/18162
摘要： A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity. Also described are various approaches to fabricating a semiconductor package having a hermetically sealed region.
摘要翻译：描述了具有空气压力传感器的半导体封装和形成具有气压传感器的半导体封装的方法。例如，半导体封装包括多个堆积层。空腔设置在一个或多个堆积层中。空气压力传感器设置在多个积聚层中，并且包括空腔和设置在空腔上方的电极。还描述了制造具有气密密封区域的半导体封装的各种方法。

9. 发明申请

US20140169800A1 OPTICAL INTERCONNECT ON BUMPLESS BUILD-UP LAYER PACKAGE 有权
标题翻译：无障碍建筑层包装的光学互连
公开(公告)号：US20140169800A1
公开(公告)日：2014-06-19
申请号：US13717185
申请日：2012-12-17
申请人： Feras Eid , Johanna Swan , Weng Hong Teh
发明人： Feras Eid , Johanna Swan , Weng Hong Teh
IPC分类号： H04B10/40 , F21V21/00 , H01L33/00
CPC分类号： H01S5/02272 , H01L21/568 , H01L24/18 , H01L24/19 , H01L25/167 , H01L2224/04105 , H01L2224/16145 , H01L2924/12042 , H01S5/02248 , H01S5/02276 , H01S5/02284 , H01S5/02288 , H01S5/02292 , H01S5/183 , H01S5/18305 , H01L2924/00
摘要： This disclosure relates generally to an electronic package that can include a die and a dielectric layer at least partially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the dielectric layer. An optical emitter can be electrically coupled to the die with a first one of the electrical interconnects and configured to emit light from a first major surface of the electronic package. A solder bump can be electrically coupled to the die with a second one of the electrical interconnects and positioned on a second major surface of the electronic package different from the first major surface.
摘要翻译：本公开一般涉及一种电子封装，其可以包括至少部分地包封管芯的管芯和电介质层。电互连可以电耦合到管芯并且至少部分地通过电介质层。光发射器可以用电互连的第一个电耦合到管芯，并且被配置为从电子封装的第一主表面发射光。焊料凸块可以用电互连的第二个电耦合到管芯，并且位于电子封装的不同于第一主表面的第二主表面上。

10. 发明申请

US20190214328A1 STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT 审中-公开
公开(公告)号：US20190214328A1
公开(公告)日：2019-07-11
申请号：US15866793
申请日：2018-01-10
申请人： Feras Eid , Shrenik Kothari , Chandra M. Jha , Johanna M. Swan , Michael J. Baker , Shawna M. Liff , Thomas L. Sounart , Betsegaw K. Gebrehiwot , Shankar Devasenathipathy , Taylor Gaines , Digvijay Ashokkumar Raorane
发明人： Feras Eid , Shrenik Kothari , Chandra M. Jha , Johanna M. Swan , Michael J. Baker , Shawna M. Liff , Thomas L. Sounart , Betsegaw K. Gebrehiwot , Shankar Devasenathipathy , Taylor Gaines , Digvijay Ashokkumar Raorane
IPC分类号： H01L23/433 , H01L25/00 , H01L21/56 , H01L23/29 , H01L25/18
CPC分类号： H01L23/4334 , H01L21/56 , H01L23/04 , H01L23/16 , H01L23/295 , H01L23/367 , H01L23/42 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2225/06513 , H01L2225/06517 , H01L2225/06568 , H01L2225/06582 , H01L2225/06589
摘要： A semiconductor device that has a semiconductor die coupled to a substrate. A mold compound encapsulates the semiconductor die, and at least one thermal conductive material section extends from adjacent the semiconductor die through the mold compound. The at least one conductive material section thus conveys heat from the semiconductor die through the mold compound.

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