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1. 发明申请

US20130255929A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20130255929A1
公开(公告)日：2013-10-03
申请号：US13586902
申请日：2012-08-16
申请人： QIAO-LONG CHEN , ZI-FU YANG , MENG FU , CHUN-CHI CHEN
发明人： QIAO-LONG CHEN , ZI-FU YANG , MENG FU , CHUN-CHI CHEN
IPC分类号： F28F7/00 , B23P15/26
CPC分类号： H01L23/4006 , F28D15/0275 , F28F1/32 , F28F2275/14 , H01L21/4878 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat dissipation device includes a base and a plurality of fins. Two latch parts project from a top surface of the base, the two latch parts cooperatively define a recess therebetween. Each fin defines a tenon at a bottom portion. The tenon has a configuration in complement with that of the recess. The latch parts located between two neighboring fins is punched to make the fins fix on the base.
摘要翻译：散热装置包括基座和多个翅片。两个闩锁部件从基座的顶表面突出，两个闩锁部件协作地在它们之间限定凹部。每个翅片在底部限定榫头。这个榫头有一个配置与这个凹槽的配合。位于两个相邻翅片之间的闩锁部件被冲压以使翅片固定在基座上。

2. 发明申请

US20130240190A1 HEAT SINK AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：散热器及其制造方法
公开(公告)号：US20130240190A1
公开(公告)日：2013-09-19
申请号：US13650499
申请日：2012-10-12
申请人： QIAO-LONG CHEN , MENG FU , ZI-FU YANG , CHUN-CHI CHEN
发明人： QIAO-LONG CHEN , MENG FU , ZI-FU YANG , CHUN-CHI CHEN
IPC分类号： F28F3/00 , B23P11/00
CPC分类号： B23P15/26 , B23P11/00 , B23P2700/10 , F28F3/048 , F28F3/06 , F28F2275/122 , H01L21/4878 , H01L23/3672 , H01L2924/0002 , Y10T29/49908 , H01L2924/00
摘要： An exemplary method for manufacturing a heat sink includes steps: providing a base with a plurality of spaced protrusions formed thereon; providing a plurality of fins and bending a distal end of each fin to form a connecting end; fitting each fin between two adjacent protrusions correspondingly and attaching the connecting end of each fin to the base; and deforming each protrusion to press the connecting ends of two adjacent fins.
摘要翻译：用于制造散热器的示例性方法包括以下步骤：提供具有在其上形成的多个间隔开的突起的基部; 提供多个翅片并弯曲每个翅片的远端以形成连接端; 将两个相邻突起之间的每个翅片相应地安装，并将每个翅片的连接端连接到基座; 并且使每个突起变形以按压两个相邻翅片的连接端。

3. 发明申请

US20080173430A1 HEAT DISSIPATION DEVICE WITH HEAT PIPES 审中-公开
标题翻译：带热管的散热装置
公开(公告)号：US20080173430A1
公开(公告)日：2008-07-24
申请号：US11626059
申请日：2007-01-23
申请人： ZHAO JIN , MENG FU , CHUN-CHI CHEN
发明人： ZHAO JIN , MENG FU , CHUN-CHI CHEN
IPC分类号： F28D15/00 , B32B1/08
CPC分类号： F28D15/0233 , H01L23/427 , H01L2023/4081 , H01L2924/0002 , Y10T428/13 , H01L2924/00
摘要： A heat dissipation device includes a base and a fin set thermally contacting the base. The base has a receiving portion for contacting to and absorbing heat from an electronic device and an extension portion surrounding the receiving portion. A first heat pipe is thermally engaged with the base. The first heat pipe is sinuous and includes a plurality of sections thermally engaged with the extension portion and the receiving portion of the base. A second heat pipe is thermally engaged with the extension portion and the receiving portion of the base. A middle linear section of the first heat pipe and an adjacent linear section of the second heat pipe are mounted to the base and located corresponding to the receiving portion of the base.
摘要翻译：散热装置包括底座和与底座热接触的翅片组。基座具有用于接触和吸收来自电子设备的热量的接收部分和围绕接收部分的延伸部分。第一热管与基座热接合。第一热管是弯曲的并且包括与基部的延伸部分和接收部分热接合的多个部分。第二热管与基座的延伸部分和接收部分热接合。第一热管的中间线性部分和第二热管的相邻直线部分安装到基部并且对应于基部的接收部分定位。

4. 发明申请

US20100259897A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20100259897A1
公开(公告)日：2010-10-14
申请号：US12503021
申请日：2009-07-14
申请人： XU-XIN MIN , MENG FU , CHUN-CHI CHEN
发明人： XU-XIN MIN , MENG FU , CHUN-CHI CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader.
摘要翻译：散热装置散发由安装在顶面印刷电路板上的发热电子元件产生的热量。印刷电路板限定多个第一通孔。散热装置包括位于印刷电路板顶侧的散热器。散热器分别限定与第一通孔相对应的多个第二通孔。第一散热器位于散热器上方，并且多个第二散热器位于印刷电路板的底侧。多个热管延伸穿过散热器的第二通孔和印刷电路板的第一通孔，以将第一和第二散热器热连接到散热器。

5. 发明申请

US20100116462A1 HEAT DISSIPATION SYSTEM 审中-公开
标题翻译：散热系统
公开(公告)号：US20100116462A1
公开(公告)日：2010-05-13
申请号：US12432739
申请日：2009-04-29
申请人： MENG FU , JIE-CHENG DENG , CHUN-CHI CHEN
发明人： MENG FU , JIE-CHENG DENG , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： H01L23/467 , F28F3/02 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation system comprises a printed circuit board and at least a heat dissipation device mounted on the printed circuit board for dissipating heat generated by an electronic member mounted on the printed circuit board. The at least a heat dissipation device comprises a base, a plurality of fins extending upwardly from the base and an air guiding member located at a corner of the base. These fins are spaced from each other to define a plurality of heat exchange passages. Non-fins are disposed at a side of the base to define a cooling air passage. The cooling air passage is parallel to the heat exchange passages of the fins. The air guiding member is located in the cooling air passage for controlling open and close of the cooling air passage.
摘要翻译：散热系统包括印刷电路板和至少一个安装在印刷电路板上的用于散发由安装在印刷电路板上的电子部件产生的热量的散热装置。所述至少一个散热装置包括底座，从底座向上延伸的多个翅片以及位于底座角落处的空气引导构件。这些翅片彼此间隔开以限定多个热交换通道。非翅片设置在基座的一侧以限定冷却空气通道。冷却空气通道平行于翅片的热交换通道。空气引导构件位于冷却空气通道中，用于控制冷却空气通道的打开和关闭。

6. 发明申请

US20100000715A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20100000715A1
公开(公告)日：2010-01-07
申请号：US12239839
申请日：2008-09-29
申请人： DONG-BO ZHENG , MENG FU , CHUN-CHI CHEN
发明人： DONG-BO ZHENG , MENG FU , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： H01L23/4006 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base, a sleeve coupling with the base, and a fastener engaging with the base and the sleeve. The base defines a hole extending therethrough. The sleeve includes a first portion coupling with the hole of the base and a second portion extending from an end of the first portion. The second portion is located at a first side of the base. The fastener includes a body portion extending through the sleeve and the base, a head portion and a foot portion formed at two ends of the body portion, respectively. The head portion is located at the first side of the base. A spring member is compressed between the head portion and the second portion. A compressed length of the spring member is adjustable by adjusting a coupling length of the first portion with the hole of the base.
摘要翻译：散热装置包括基座，与基座连接的套筒以及与基座和套筒接合的紧固件。底座限定了一个贯穿其中的孔。套筒包括与基座的孔结合的第一部分和从第一部分的端部延伸的第二部分。第二部分位于基部的第一侧。紧固件包括分别延伸穿过套筒和底座的主体部分，分别形成在主体部分两端的头部部分和脚部部分。头部位于基座的第一侧。弹簧构件在头部和第二部分之间被压缩。通过调节第一部分与基部的孔的联接长度来调节弹簧构件的压缩长度。

7. 发明申请

US20090107653A1 HEAT DISSIPATION DEVICE WITH HEAT PIPES 有权
标题翻译：带热管的散热装置
公开(公告)号：US20090107653A1
公开(公告)日：2009-04-30
申请号：US11926701
申请日：2007-10-29
申请人： LEI JIANG , DONG-BO ZHENG , MENG FU , CHUN-CHI CHEN
发明人： LEI JIANG , DONG-BO ZHENG , MENG FU , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： F28D15/0233 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base for contacting with an electronic device, a fin set thermally contacting the base, a first heat pipe and a second heat pipe connecting the base and the fin set. The fin set has a bottom larger than the base and an upper portion apart from the bottom thereof. The first heat pipe has a flat top face thermally contacting the bottom of the fin set, comprising a first transferring portion thermally engaging with the base, and a second transferring portion extending from the first transferring portion and projecting beyond the base. The second heat pipe comprises an evaporation portion thermally engaging with the base, and a condensation portion extending from the evaporation portion and engaging with the upper portion of the fin set.
摘要翻译：散热装置包括用于与电子装置接触的基座，与基座热接触的翅片组，第一热管和连接基座和翅片组的第二热管。翅片组具有比基部大的底部和与其底部分离的上部。第一热管具有与翅片组的底部热接触的平坦顶面，包括与基部热接合的第一传递部分和从第一传递部分延伸并突出超出基部的第二传递部分。第二热管包括与基座热接合的蒸发部分，以及从蒸发部分延伸并与翅片组的上部接合的冷凝部分。

8. 发明申请

US20080000619A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20080000619A1
公开(公告)日：2008-01-03
申请号：US11623288
申请日：2007-01-15
申请人： SHI-WEN ZHOU , CHUN-CHI CHEN , MENG FU
发明人： SHI-WEN ZHOU , CHUN-CHI CHEN , MENG FU
IPC分类号： F28F1/30
CPC分类号： F28F1/32 , F28D15/0275 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a fin assembly including a plurality of fins and a heat conductive member. Each individual fin includes a main body with one through hole and a sleeve installed in the through hole of the main body. The sleeve has a hole defined therethrough. The heat conductive member has higher heat conductivity than the main bodies of the fins, and is installed into the through hole of the each individual fin via extension through the hole of the sleeve. The main body and the sleeve of the each individual fin are made of different materials so that the sleeve serves as a transition component for facilitating soldering the each individual fin on the heat conductive member and heat conduction from the heat conductive member to the main body of the each individual fin.
摘要翻译：散热装置包括：翅片组件，其包括多个翅片和导热构件。每个单独的翅片包括具有一个通孔的主体和安装在主体的通孔中的套筒。套筒具有穿过其中的孔。导热构件具有比翅片的主体更高的导热性，并且通过套筒的孔经由延伸部安装到每个单独翅片的通孔中。每个单独翅片的主体和套筒均由不同的材料制成，使得套筒用作便于将导热构件上的每个单独的翅片焊接并从导热构件到主体的热传导的过渡部件每个个体鳍。

9. 发明申请

US20120057278A1 CONSUMER ELECTRONIC PRODUCT ASSEMBLY WITH BRACKET 失效
标题翻译：消费电子产品装配支架
公开(公告)号：US20120057278A1
公开(公告)日：2012-03-08
申请号：US12914990
申请日：2010-10-28
申请人： MENG FU , BANG-JIE XIE , CHUN-CHI CHEN
发明人： MENG FU , BANG-JIE XIE , CHUN-CHI CHEN
IPC分类号： H05K7/00 , H05K7/14
CPC分类号： F16M13/00 , F16M11/105 , F16M2200/08
摘要： A consumer electronic product assembly includes a consumer electronic product and a bracket holding the consumer electronic product. The bracket includes a supporting seat, a holding member and a connecting bar. The holding member holds the consumer electronic product. Opposite ends of the connecting bar hinge on the holding member and the supporting seat, respectively. The connecting bar is rotatable with respect to the supporting seat, and the holding member is rotatable with respect to the connecting bar, whereby the consumer electronic product held by the holding member can be adjusted to various positions with respect to the supporting seat.
摘要翻译：一种消费电子产品组件包括消费电子产品和一个保持消费电子产品的支架。支架包括支撑座，保持构件和连接杆。持有人持有消费电子产品。连接杆的相对端分别在保持构件和支撑座上铰接。连接杆相对于支撑座可旋转，并且保持构件可相对于连接杆旋转，由此保持构件保持的消费电子产品可以相对于支撑座调节到各种位置。

10. 发明申请

US20110032680A1 HEAT SINK ASSEMBLY HAVING CLIP 失效
标题翻译：散热器组装有夹子
公开(公告)号：US20110032680A1
公开(公告)日：2011-02-10
申请号：US12632768
申请日：2009-12-07
申请人： PIN-QUN ZHAO , DONG-BO ZHENG , MENG FU , CHUN-CHI CHEN
发明人： PIN-QUN ZHAO , DONG-BO ZHENG , MENG FU , CHUN-CHI CHEN
IPC分类号： H05K7/20 , A44B99/00
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44017 , H01L2924/00
摘要： A clip is adapted for securing a heat sink on a printed circuit board (PCB). The clip includes a linking portion, an operating portion, a handle, and a pressing portion. The linking portion is located at a lateral side of the heat sink. The operating portion pivotally engages with the linking portion and the heat sink. The handle connects the operating portion. The pressing portion connects the linking portion. A fastener mounted on the PCB extends through the heat sink and the pressing portion. The pressing portion is slidable from a first position to a second position. When the pressing portion is in the second position the handle is operable to drive the operating portion to move upwardly and urge the pressing portion to move along the fastener until the pressing portion abuts against a top portion of the fastener and simultaneously presses the heat sink.
摘要翻译：夹子适于将散热器固定在印刷电路板（PCB）上。夹子包括连接部分，操作部分，手柄和按压部分。连接部分位于散热器的侧面。操作部分与连接部分和散热器枢转地接合。手柄连接操作部分。按压部分连接连接部分。安装在PCB上的紧固件延伸穿过散热器和按压部分。按压部分可以从第一位置滑动到第二位置。当按压部分处于第二位置时，手柄可操作以驱动操作部分向上移动并促使按压部分沿着紧固件移动，直到按压部分抵靠紧固件的顶部并同时按压散热器。

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