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    • 9. 发明授权
    • Electronic circuits including planar electronic devices
    • 包括平面电子设备的电子电路
    • US09130015B2
    • 2015-09-08
    • US13511616
    • 2010-11-23
    • Richard PriceIan BartonScott White
    • Richard PriceIan BartonScott White
    • H01L21/768
    • H01L21/768H01L21/76838H01L27/124H01L51/0021
    • A method for use in the manufacture of an electronic circuit comprising at least one substantially planar electronic device is disclosed. The method comprises: forming a structure comprising a layer of active material, at least a first conductive track spaced from and extending in a plane generally parallel to the layer of active material, and a layer of insulative material separating the first conductive track from the layer of active material, the layer of active material having a plurality of insulative features formed therein, each insulative feature at least partly inhibiting electrical current flow in the layer of active material and the plurality of insulative features defining at least a first substantially planar electronic device in the layer of active material comprising at least a respective first terminal and a respective second terminal, each terminal comprising a respective area of the layer of active material, and at least a portion of said first conductive track overlapping one of the first and second terminals; forming a first hole in said structure, said first hole extending through the layer of insulative material and connecting an overlapping portion of the first conductive track to one of the first and second terminals; and filling said first hole at least partly with electrically conductive material so as to provide an electrical connection between the first conductive track and one of the first and second terminals.
    • 公开了一种用于制造包括至少一个基本上平面的电子设备的电子电路的方法。 该方法包括:形成包括活性材料层的至少第一导电轨道的结构,至少第一导电轨道与大致平行于活性材料层的平面间隔开并且延伸,以及将第一导电轨道与该层分离的绝缘材料层 活性材料层,其中形成有多个绝缘特征,每个绝缘特征至少部分地阻止在活性材料层中的电流流动,并且多个绝缘特征限定了至少第一基本上平面的电子器件 所述活性材料层包括至少相应的第一端子和相应的第二端子,每个端子包括所述活性材料层的相应区域,并且所述第一导电轨道的至少一部分与所述第一和第二端子中的一个重叠; 在所述结构中形成第一孔,所述第一孔延伸穿过所述绝缘材料层,并将所述第一导电轨道的重叠部分连接到所述第一和第二端子中的一个; 以及至少部分地用导电材料填充所述第一孔,以便在所述第一导电轨道和所述第一和第二端子中的一个之间提供电连接。