专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07916262B2 Signal transmission assembly and display device applied with the same 有权
标题翻译：信号传输组件和显示设备应用相同
公开(公告)号：US07916262B2
公开(公告)日：2011-03-29
申请号：US11650469
申请日：2007-01-08
申请人： Po-Yuan Liu , Chuan-Mau Wei , Kuo-Chih Lee
发明人： Po-Yuan Liu , Chuan-Mau Wei , Kuo-Chih Lee
IPC分类号： G02F1/1345
CPC分类号： G02F1/13452 , H05K3/323 , H05K3/361 , H05K2201/09663 , H05K2201/0969
摘要： A signal transmission assembly includes first and second substrates respectively having first and second electrodes, and a conductive layer disposed between the electrodes. The second electrode has a trench. The conductive layer includes an adhesive and conductive particles distributed therein. The second electrode is electrically connected to the first electrode through the conductive layer, and a portion of the adhesive is filled into the trench. When the assembly is applied to a display device, the first electrode electrically connects a non-display area to a display area of a display panel. When the second electrode and a third electrode at two ends of the second substrate are electrically connected to the first electrode and a third substrate (e.g., a PCB), respectively, a signal may be transmitted from the third substrate to the display area through the second substrate, the second electrode and the first electrode to control the display.
摘要翻译：信号传输组件包括分别具有第一和第二电极的第一和第二基板以及设置在电极之间的导电层。第二电极具有沟槽。导电层包括粘合剂和分布在其中的导电颗粒。第二电极通过导电层电连接到第一电极，并且一部分粘合剂被填充到沟槽中。当将组件应用于显示装置时，第一电极将非显示区域电连接到显示面板的显示区域。当第二电极和第二基板的两端的第三电极分别电连接到第一电极和第三基板（例如，PCB）时，信号可以从第三基板传送到显示区域第二基板，第二电极和第一电极以控制显示器。

2. 发明申请

US20070268441A1 Signal transmission assembly and display device applied with the same 有权
标题翻译：信号传输组件和显示设备应用相同
公开(公告)号：US20070268441A1
公开(公告)日：2007-11-22
申请号：US11650469
申请日：2007-01-08
申请人： Po-Yuan Liu , Chuan-Mau Wei , Kuo-Chih Lee
发明人： Po-Yuan Liu , Chuan-Mau Wei , Kuo-Chih Lee
IPC分类号： G02F1/1345
CPC分类号： G02F1/13452 , H05K3/323 , H05K3/361 , H05K2201/09663 , H05K2201/0969
摘要： A signal transmission assembly includes first and second substrates respectively having first and second electrodes, and a conductive layer disposed between the electrodes. The second electrode has a trench. The conductive layer includes an adhesive and conductive particles distributed therein. The second electrode is electrically connected to the first electrode through the conductive layer, and a portion of the adhesive is filled into the trench. When the assembly is applied to a display device, the first electrode electrically connects a non-display area to a display area of a display panel. When the second electrode and a third electrode at two ends of the second substrate are electrically connected to the first electrode and a third substrate (e.g., a PCB), respectively, a signal may be transmitted from the third substrate to the display area through the second substrate, the second electrode and the first electrode to control the display.
摘要翻译：信号传输组件包括分别具有第一和第二电极的第一和第二基板以及设置在电极之间的导电层。第二电极具有沟槽。导电层包括粘合剂和分布在其中的导电颗粒。第二电极通过导电层电连接到第一电极，并且一部分粘合剂被填充到沟槽中。当将组件应用于显示装置时，第一电极将非显示区域电连接到显示面板的显示区域。当第二电极和第二基板的两端的第三电极分别电连接到第一电极和第三基板（例如，PCB）时，信号可以从第三基板传送到显示区域第二基板，第二电极和第一电极以控制显示器。

3. 发明授权

US07728945B2 Structure for circuit assembly 有权
标题翻译：电路组合结构
公开(公告)号：US07728945B2
公开(公告)日：2010-06-01
申请号：US11505344
申请日：2006-08-17
申请人： Po-Yuan Liu , Chuan-Mau Wei , Chih-Yuan Chien
发明人： Po-Yuan Liu , Chuan-Mau Wei , Chih-Yuan Chien
IPC分类号： H01L23/544
CPC分类号： H01L23/544 , G02F1/13452 , H01L24/29 , H01L24/83 , H01L2223/5448 , H01L2224/16 , H01L2224/838 , H01L2924/01013 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/01082 , H01L2924/0781
摘要： A structure for circuit assembly is applied to positional alignment in bonding process. The structure for circuit assembly comprises a first substrate, having a plurality of first terminals and both a first alignment mark and a second alignment mark located in the vicinity of the first terminals, and a second substrate, having a plurality of second terminals and a transmissive area located in the vicinity of second terminals. During the first substrate bonding with the second substrate, as the edge of the transmissive area is located between the first alignment mark and the second alignment mark, and the first alignment mark is outside of the transmissive area, the first terminals are normally connected with the second terminals.
摘要翻译：用于电路组装的结构应用于接合过程中的位置对准。电路组件的结构包括具有多个第一端子以及位于第一端子附近的第一对准标记和第二对准标记的第一基板和具有多个第二端子和透射的第二基板的第二基板区域位于第二终端附近。在与第二基板的第一基板接合期间，当透射区域的边缘位于第一对准标记和第二对准标记之间，并且第一对准标记在透射区域的外部时，第一端子通常与第二个终端。

4. 发明申请

US20070040286A1 Structure for circuit assembly 有权
标题翻译：电路组合结构
公开(公告)号：US20070040286A1
公开(公告)日：2007-02-22
申请号：US11505344
申请日：2006-08-17
申请人： Po-Yuan Liu , Chuan-Mau Wei , Chih-Yuan Chien
发明人： Po-Yuan Liu , Chuan-Mau Wei , Chih-Yuan Chien
IPC分类号： H01L23/544
CPC分类号： H01L23/544 , G02F1/13452 , H01L24/29 , H01L24/83 , H01L2223/5448 , H01L2224/16 , H01L2224/838 , H01L2924/01013 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/01082 , H01L2924/0781
摘要： A structure for circuit assembly is applied to positional alignment in bonding process. The structure for circuit assembly comprises a first substrate, having a plurality of first terminals and both a first alignment mark and a second alignment mark located in the vicinity of the first terminals, and a second substrate, having a plurality of second terminals and a transmissive area located in the vicinity of second terminals. During the first substrate bonding with the second substrate, as the edge of the transmissive area is located between the first alignment mark and the second alignment mark, and the first alignment mark is outside of the transmissive area, the first terminals are normally connected with the second terminals.
摘要翻译：用于电路组装的结构应用于接合过程中的位置对准。电路组件的结构包括具有多个第一端子以及位于第一端子附近的第一对准标记和第二对准标记的第一基板和具有多个第二端子和透射的第二基板的第二基板区域位于第二终端附近。在与第二基板的第一基板接合期间，当透射区域的边缘位于第一对准标记和第二对准标记之间，并且第一对准标记在透射区域的外部时，第一端子通常与第二个终端。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式