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    • 5. 发明申请
    • Method for production of a semiconductor device with auto-aligned metallisations
    • 用于生产具有自动对准金属化的半导体器件的方法
    • US20060275936A1
    • 2006-12-07
    • US10555072
    • 2004-04-27
    • Pierre-Jean RibeyronMarc Pirot
    • Pierre-Jean RibeyronMarc Pirot
    • H01L21/00
    • H01L31/022433Y02E10/50
    • This invention relates to a process for making a semiconductor device comprising the following steps: a doped region with a first type of conductivity is made on a first principal face of a semiconductor substrate and at least one window is made, a first metallisation area is deposited on the doped region, a dielectric layer is deposited on at least the window and the first metallisation area, at least a first opening is etched in the dielectric layer at the window to accommodate a doped region with a second type of conductivity while arranging an undoped portion of the semiconductor substrate laterally between the doped regions, the substrate is doped to create the doped region with the second type of conductivity, a second metallisation area is deposited. Application particularly for solar cells in thin layer.
    • 本发明涉及一种制造半导体器件的方法,包括以下步骤:在半导体衬底的第一主面上形成具有第一类型导电性的掺杂区域,并且至少形成一个窗口,沉积第一金属化区域 在掺杂区域上,在至少窗口和第一金属化区域上沉积介电层,在窗口处的电介质层中至少蚀刻第一开口以容纳具有第二类型导电性的掺杂区域,同时布置未掺杂的 部分半导体衬底横向于掺杂区域之间,衬底被掺杂以产生具有第二类型导电性的掺杂区域,沉积第二金属化区域。 特别适用于薄层太阳能电池。
    • 7. 发明授权
    • Method for production of a semiconductor device with auto-aligned metallisations
    • 用于生产具有自动对准金属化的半导体器件的方法
    • US07364938B2
    • 2008-04-29
    • US10555072
    • 2004-04-27
    • Pierre-Jean RibeyronMarc Pirot
    • Pierre-Jean RibeyronMarc Pirot
    • H01L21/00
    • H01L31/022433Y02E10/50
    • This invention relates to a process for making a semiconductor device comprising the following steps: a doped region with a first type of conductivity is made on a first principal face of a semiconductor substrate and at least one window is made, a first metallisation area is deposited on the doped region, a dielectric layer is deposited on at least the window and the first metallisation area, at least a first opening is etched in the dielectric layer at the window to accommodate a doped region with a second type of conductivity while arranging an undoped portion of the semiconductor substrate laterally between the doped regions, the substrate is doped to create the doped region with the second type of conductivity, a second metallisation area is deposited. Application particularly for solar cells in thin layer.
    • 本发明涉及一种制造半导体器件的方法,包括以下步骤:在半导体衬底的第一主面上形成具有第一类型导电性的掺杂区域,并且至少形成一个窗口,沉积第一金属化区域 在掺杂区域上,在至少窗口和第一金属化区域上沉积介电层,在窗口处的电介质层中至少蚀刻第一开口以容纳具有第二类型导电性的掺杂区域,同时布置未掺杂的 部分半导体衬底横向于掺杂区域之间,衬底被掺杂以产生具有第二类型导电性的掺杂区域,沉积第二金属化区域。 特别适用于薄层太阳能电池。