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1. 发明授权

US08238823B2 Method for ensuring a secure NFC functionality of a wireless mobile communication device and wireless mobile communication device having a secure NFC functionality 有权
标题翻译：确保无线移动通信设备的安全NFC功能和具有安全NFC功能的无线移动通信设备的方法
公开(公告)号：US08238823B2
公开(公告)日：2012-08-07
申请号：US11815767
申请日：2006-02-02
申请人： Phillipe Maugars , Patrice Gamand
发明人： Phillipe Maugars , Patrice Gamand
IPC分类号： H04B5/00
CPC分类号： H04W4/008 , H02J7/025 , H02J7/34 , H02J17/00 , H02J50/10 , H04M1/7253 , H04W4/80 , H04W52/0277 , H04W88/06
摘要： The invention provides a method for ensuring a secure NFC functionality of a wireless mobile communication device comprising the steps of detecting the charge state of a first energy source (1) which supplies the voltage for operating the wireless mobile communication device (S1); switching off the first energy source and switching on a second energy source (2), if the detected charge state of the first energy source (1) falls below a threshold (S2); detecting the charge state of the second energy source (2), if an external NFC signal is received (S3); charging of the second energy source via voltage induced by a received NFC signal to allow at least one secure NFC transaction, if the detected charge state of the second energy source (2) is below a threshold (S4). Furthermore the invention provides a wireless mobile communication device having a secure NFC functionality, which is always ready for operation of at least the secure NFC functionality.
摘要翻译：本发明提供了一种用于确保无线移动通信设备的安全NFC功能的方法，包括以下步骤：检测提供用于操作无线移动通信设备的电压的第一能量源（1）的充电状态（S1）; 如果第一能量源（1）的检测到的电荷状态下降到阈值以下，则关闭第一能量源并接通第二能量源（2）; 如果接收到外部NFC信号（S3），则检测第二能量源（2）的充电状态; 如果检测到的第二能量源（2）的充电状态低于阈值（S4），则通过由接收的NFC信号感应的电压来充电第二能量源以允许至少一个安全的NFC事务。此外，本发明提供了一种具有安全NFC功能的无线移动通信设备，其始终准备好至少运行安全的NFC功能。

2. 发明授权

US5434502A Calibration device for hyper-frequency adjustment of the reference planes of an apparatus for measuring the dispersion parameters of elements of integrated circuits 失效
标题翻译：用于测量集成电路元件的色散参数的装置的参考平面的超频调整的校准装置
公开(公告)号：US5434502A
公开(公告)日：1995-07-18
申请号：US124742
申请日：1993-09-21
申请人： Peter C. Walters , Patrice Gamand
发明人： Peter C. Walters , Patrice Gamand
IPC分类号： G01R31/26 , G01R1/067 , G01R31/28 , G01R35/00 , H01L21/66 , G01R31/02
CPC分类号： G01R35/007 , G01R1/06705 , G01R31/2822 , G01R31/2886
摘要： A calibration device is disclosed for hyper-frequency adjustment of the reference planes of an apparatus for measuring the dispersion parameters of elements of circuits integrated on a substrate. The device includes, integrated on the same substrate, standard patterns and accesses to these patterns which are compatible with the contacts of two test probes connected to the apparatus. Also provided on the substrate are at least two identical series of standard patterns which are formed by parallel lines of the same length, including a short-circuit line and/or an open line and/or a load line, whose accesses are aligned within each series, but opposed from one series to another with respect to the zone in which the second ends are situated. Their second ends are aligned within each series, defining the facing reference planes, separated by a given distance d. The second ends are also arranged in an offset manner from one series to the other in the plane of the substrate by translations parallel to the reference planes so that the distance between these offset ends is equal to or greater than twice the thickness of the substrate and the distance d separating the reference planes is approximately equal to or smaller than three times the thickness of the substrate.
摘要翻译：公开了一种校准装置，用于对用于测量集成在衬底上的电路的元件的色散参数的装置的参考平面进行超频调整。该装置包括集成在相同基板上的标准图案和对这些图案的访问，这些图案与连接到该装置的两个测试探针的触点兼容。还设置在基板上的至少两个相同系列的标准图案由相同长度的平行线形成，包括短路线和/或开线和/或负载线，其访问在每个但是相对于第二端所在的区域而言，从一个系列到另一个系列相反。它们的第二端在每个系列内对齐，限定面对参考平面，间隔给定距离d。第二端还通过平行于参考平面的平移以偏移方式从衬底的平面中的一个系列到另一个排列布置，使得这些偏移端之间的距离等于或大于衬底的厚度的两倍，分离参考平面的距离d近似等于或小于衬底厚度的三倍。

3. 发明授权

US4985642A High-frequency circuit having a loaded field-effect transistor 失效
标题翻译：具有负载场效应晶体管的高频电路
公开(公告)号：US4985642A
公开(公告)日：1991-01-15
申请号：US284205
申请日：1988-12-14
申请人： Patrice Gamand
发明人： Patrice Gamand
IPC分类号： H03F3/193 , H03F3/60
CPC分类号： H03F3/601 , H03F3/607
摘要： A high-frequency circuit includes a field-effect transistor having a gate electrode for receiving a high-frequency input signal, a source electrode and a drain electrode. Substantial improvements in both maximum gain and high-frequency performance are achieved by providing an input or output terminal at one end of each electrode, and terminating at least one of the electrodes with an appropriate impedance at its second end.
摘要翻译：高频电路包括具有用于接收高频输入信号的栅电极，源电极和漏电极的场效应晶体管。通过在每个电极的一端提供输入或输出端子，并在其第二端端接至少一个具有适当阻抗的电极来实现最大增益和高频性能的显着改善。

4. 发明授权

US08374546B2 Wireless mobile communication device having an ensured NFC functionality 有权
标题翻译：具有确保的NFC功能的无线移动通信设备
公开(公告)号：US08374546B2
公开(公告)日：2013-02-12
申请号：US13538727
申请日：2012-06-29
申请人： Philippe Maugars , Patrice Gamand
发明人： Philippe Maugars , Patrice Gamand
IPC分类号： H04B5/00
CPC分类号： H04W4/008 , H02J7/025 , H02J7/34 , H02J17/00 , H02J50/10 , H04M1/7253 , H04W4/80 , H04W52/0277 , H04W88/06
摘要： A wireless mobile communication device having NFC functionality that is designed to always be capable of NFC functionality, including secure NFC functionality by having a first and second energy source where charging of the second energy source may be achieved by the voltage induced by the received NFC signal.
摘要翻译：一种具有NFC功能的无线移动通信设备，其被设计为总是能够进行NFC功能，包括通过具有第一和第二能量源的安全NFC功能，其中第二能量源的充电可以由接收到的NFC信号引起的电压来实现。

5. 发明申请

US20080185614A1 Integrated Circuit Assembly with Passive Integration Substrate for Power and Ground Line Routing on Top of an Integrated Circuit Chip 有权
标题翻译：集成电路组件与集成电路芯片顶部的电源和地线路由无源集成基板
公开(公告)号：US20080185614A1
公开(公告)日：2008-08-07
申请号：US11912843
申请日：2006-04-26
申请人： Patrice Gamand , Jean-Marc Yannou , Fabrice Verjus , Cyrille Cathelin
发明人： Patrice Gamand , Jean-Marc Yannou , Fabrice Verjus , Cyrille Cathelin
IPC分类号： H01L27/10
CPC分类号： H01L25/16 , H01L23/49833 , H01L23/50 , H01L24/48 , H01L2224/05554 , H01L2224/16145 , H01L2224/16225 , H01L2224/16265 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/14 , H01L2924/19011 , H01L2924/19104 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit assembly (ICA) comprises: a digital and/or analog integrated circuit (S1) having a core with input and/or output pins and at least one power supply connection pad (PP) and one ground connection pad (GP) connected to a chosen one of the input and/or output pins and respectively connected to power supply and ground connection zones (MZ1) of a printed circuit board (PCB), and a passive integration substrate (S2) set on top of the digital and/or analog integrated circuit (S1) and comprising i) at least first and second input zones respectively connected to the ground (GP) and power supply (PP) connection pads to, be fed with input ground and supply voltages, ii) input and/or output zones connected to chosen core input and/or output pins, and Ëi) a passive integrated circuit (PIC) connected to the first and second input zones and arranged to feed the substrate input and/or output zones with chosen ground and supply voltages defined from the input ground and supply voltages.
摘要翻译：集成电路组件（ICA）包括：数字和/或模拟集成电路（S1），其具有带有输入和/或输出引脚的核心和至少一个电源连接焊盘（PP）和一个接地连接焊盘（GP）连接到所选择的输入和/或输出引脚中的一个并分别连接到印刷电路板（PCB）的电源和接地连接区（MZ 1），以及设置在印刷电路板（PCB）顶部的无源集成基板（S 2）数字和/或模拟集成电路（S1），并且包括i）分别连接到地（GP）和电源（PP）连接焊盘的至少第一和第二输入区域，被馈送输入接地和电源电压，ii ）连接到所选择的核心输入和/或输出引脚的输入和/或输出区域，以及Ëi连接到所述第一和第二输入区域的无源集成电路（PIC），并且被布置为将所选择的所述基板输入和/或输出区域接地和电源电压从输入地和su定义提供电压。

6. 发明申请

US20060131691A1 Electronic device, assembly and methods of manufacturing an electronic device 有权
标题翻译：电子设备，组装和制造电子设备的方法
公开(公告)号：US20060131691A1
公开(公告)日：2006-06-22
申请号：US10560717
申请日：2004-06-11
申请人： Freddy Roozeboom , Adrianus Alphonsus Buijsman , Patrice Gamand , Antonius Kemmeren , Gerardus Hubert
发明人： Freddy Roozeboom , Adrianus Alphonsus Buijsman , Patrice Gamand , Antonius Kemmeren , Gerardus Hubert
IPC分类号： H01L29/00 , H01L29/94
CPC分类号： H01L23/66 , H01L21/486 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L23/49838 , H01L23/49872 , H01L24/16 , H01L25/0657 , H01L25/18 , H01L27/0805 , H01L28/60 , H01L29/0657 , H01L29/66181 , H01L2223/6622 , H01L2223/6666 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/0557 , H01L2224/16225 , H01L2224/16265 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2924/00014 , H01L2924/0002 , H01L2924/1205 , H01L2924/1431 , H01L2924/1434 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/05124 , H01L2224/05147
摘要： A semiconductor substrate comprises both vertical interconnects and vertical capacitors with a common dielectric layer. The substrate can be suitably combined with further devices to form an assembly. The substrate can be made in etching treatments including a first step on the one side, and then a second step on the other side of the substrate.
摘要翻译：半导体衬底包括垂直互连和具有公共电介质层的垂直电容器。衬底可以适当地与另外的装置组合以形成组件。衬底可以在包括一侧的第一步骤，然后在衬底的另一侧上的第二步骤的蚀刻处理中制成。

7. 发明授权

US08178901B2 Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip 有权
标题翻译：集成电路组件，具有无源集成基板，用于集成电路芯片顶部的电源和接地线路由
公开(公告)号：US08178901B2
公开(公告)日：2012-05-15
申请号：US11912843
申请日：2006-04-26
申请人： Patrice Gamand , Jean-Marc Yannou , Fabrice Verjus , Cyrille Cathelin
发明人： Patrice Gamand , Jean-Marc Yannou , Fabrice Verjus , Cyrille Cathelin
IPC分类号： H01L27/00
CPC分类号： H01L25/16 , H01L23/49833 , H01L23/50 , H01L24/48 , H01L2224/05554 , H01L2224/16145 , H01L2224/16225 , H01L2224/16265 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/14 , H01L2924/19011 , H01L2924/19104 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit assembly (ICA) comprises: a digital and/or analog integrated circuit (S1) having a core with input and/or output pins and at least one power supply connection pad (PP) and one ground connection pad (GP) connected to a chosen one of the input and/or output pins and respectively connected to power supply and ground connection zones (MZ1) of a printed circuit board (PCB), and a passive integration substrate (S2) set on top of the digital and/or analog integrated circuit (S1) and comprising i) at least first and second input zones respectively connected to the ground (GP) and power supply (PP) connection pads to be fed with input ground and supply voltages, ii) input and/or output zones connected to chosen core input and/or output pins, and Ëi) a passive integrated circuit (PIC) connected to the first and second input zones and arranged to feed the substrate input and/or output zones with chosen ground and supply voltages defined from the input ground and supply voltages.
摘要翻译：集成电路组件（ICA）包括：数字和/或模拟集成电路（S1），其具有带有输入和/或输出引脚的核心，以及连接至少一个电源连接焊盘（PP）和一个接地连接焊盘（GP）分别连接到印刷电路板（PCB）的电源和接地连接区域（MZ1）中的所选择的一个输入和/或输出引脚以及设置在数字和/或输出引脚上的无源集成基板（S2）或模拟集成电路（S1），并且包括i）分别连接到接地（GP）和电源（PP）连接焊盘的至少第一和第二输入区域，以供给输入的接地和电源电压; ii）输入和/或输出区域，连接到所选择的核心输入和/或输出引脚，以及Ëi）连接到第一和第二输入区域的无源集成电路（PIC），并且被布置为馈送所选择的接地和电源电压的基板输入和/或输出区域从输入接地和电源电压年龄

8. 发明授权

US07839239B2 MEMS resonator having at least one resonator mode shape 有权
标题翻译：具有至少一个谐振器模式形状的MEMS谐振器
公开(公告)号：US07839239B2
公开(公告)日：2010-11-23
申请号：US12281985
申请日：2007-03-08
申请人： Marc Sworowski , Patrice Gamand , Pascal Philippe
发明人： Marc Sworowski , Patrice Gamand , Pascal Philippe
IPC分类号： H03H9/46 , H03H9/52 , H03B5/30
CPC分类号： H03H9/02259 , H03H3/0076 , H03H9/2405 , H03H9/505 , H03H2009/02503
摘要： The invention relates to a MEMS resonator having at least one mode shape comprising: a substrate (2) having a surface (12), and a resonator structure (1), wherein the resonator structure (1) is part of the substrate (2), characterized in that the resonator structure (1) is defined by a first closed trench (3) and a second closed trench (3), the first trench (3) being located inside the second trench (3) so as to form a tube structure (1) inside the substrate (2), and the resonator structure (1) being released from the substrate (2) only in directions parallel to the surface (12). The invention further relates to a method of manufacturing such a MEMS resonator.
摘要翻译：本发明涉及一种具有至少一种模式形状的MEMS谐振器，包括：具有表面的衬底（2）和谐振器结构（1），其中谐振器结构（1）是衬底（2）的一部分，其特征在于，所述谐振器结构（1）由第一封闭沟槽（3）和第二闭合沟槽（3）限定，所述第一沟槽（3）位于所述第二沟槽（3）的内部，从而形成管结构（1），并且谐振器结构（1）仅在平行于表面（12）的方向上从基板（2）释放。本发明还涉及制造这种MEMS谐振器的方法。

9. 发明申请

US20100156569A1 MEMS RESONATOR HAVING AT LEAST ONE RESONATOR MODE SHAPE 有权
标题翻译：具有至少一个谐振器模式形状的MEMS谐振器
公开(公告)号：US20100156569A1
公开(公告)日：2010-06-24
申请号：US12281985
申请日：2007-03-08
申请人： Marc Sworowski , Patrice Gamand , Pascal Philippe
发明人： Marc Sworowski , Patrice Gamand , Pascal Philippe
IPC分类号： H01P7/00 , H01L21/02
CPC分类号： H03H9/02259 , H03H3/0076 , H03H9/2405 , H03H9/505 , H03H2009/02503
摘要： The invention relates to a MEMS resonator having at least one mode shape comprising: a substrate (2) having a surface (12), and a resonator structure (1), wherein the resonator structure (1) is part of the substrate (2), characterized in that the resonator structure (1) is defined by a first closed trench (3) and a second closed trench (3), the first trench (3) being located inside the second trench (3) so as to form a tube structure (1) inside the substrate (2), and the resonator structure (1) being released from the substrate (2) only in directions parallel to the surface (12). The invention further relates to a method of manufacturing such a MEMS resonator.
摘要翻译：本发明涉及一种具有至少一种模式形状的MEMS谐振器，包括：具有表面的衬底（2）和谐振器结构（1），其中谐振器结构（1）是衬底（2）的一部分，其特征在于，所述谐振器结构（1）由第一封闭沟槽（3）和第二闭合沟槽（3）限定，所述第一沟槽（3）位于所述第二沟槽（3）的内部，从而形成管结构（1），并且谐振器结构（1）仅在平行于表面（12）的方向上从基板（2）释放。本发明还涉及制造这种MEMS谐振器的方法。

10. 发明授权

US5635762A Flip chip semiconductor device with dual purpose metallized ground conductor 失效
标题翻译：具有双用途金属化接地导体的倒装芯片半导体器件
公开(公告)号：US5635762A
公开(公告)日：1997-06-03
申请号：US236973
申请日：1994-05-02
申请人： Patrice Gamand
发明人： Patrice Gamand
IPC分类号： H01L21/60 , H01L23/48 , H01L23/66 , H01L23/34 , H01P1/00
CPC分类号： H01L23/66 , H01L23/481 , H01L2224/32 , H01L2224/33 , H01L2924/3011
摘要： Semiconductor device for the microwave frequency ranges includes a semiconductor element of the "flip chip" type which comprises a semiconductor substrate having an active surface with at least one integrated circuit, a plurality of metal input-output pads and a circuit of transmission lines of the coplanar type having conductor strips and ground metallizations disposed on the active surface. A circuit of transmission lines of the microstrip type with conductor strips disposed on a surface opposed to the active surface and whose ground metallizations are formed by the ground metallization of the active surface. A base plate comprising an insulating substrate having a front surface with a plurality of metal input-output pads and ground metallizations patterned so as to be in electrical contact with the ground metallizations of the active surface of the semiconductor element when the latter is bonded to the base plate. The active surface of the semiconductor element is bonded to the front surface of the base plate with the corresponding input-output pads in electrical contact with one another.
摘要翻译：用于微波频率范围的半导体器件包括“倒装芯片”类型的半导体元件，其包括具有至少一个集成电路的有源表面的半导体衬底，多个金属输入 - 输出焊盘和传输线的电路具有导体条的共面型和设置在有源表面上的接地金属化。微带型传输线的电路，其中导体条布置在与有源表面相对的表面上，并且其接地金属化由有源表面的接地金属化形成。一种基板，包括绝缘基板，该绝缘基板具有带有多个金属输入 - 输出焊盘的前表面和图形化的地面金属化，以便当半导体元件的活性表面接合到底盘。半导体元件的有源表面被接合到基板的前表面，相应的输入 - 输出焊盘彼此电接触。

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