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    • 1. 发明授权
    • High speed, high density electrical connector
    • 高速,高密度电连接器
    • US5993259A
    • 1999-11-30
    • US797537
    • 1997-02-07
    • Philip T. StokoeThomas CohenSteven J. Allen
    • Philip T. StokoeThomas CohenSteven J. Allen
    • H01R12/50H01R13/514H01R43/16H01R13/648
    • H01R13/514H01R23/688H01R12/716H01R12/724H01R13/6587H01R43/16
    • A high speed, high density electrical connector for use with printed circuit boards. The connector is in two pieces with one piece having pins and shield plates and the other having socket type signal contacts and shield plates. The shields have a grounding arrangement which is adapted to control the electromagnetic fields, for various system architectures, simultaneous switching configurations and signal speeds, allowing all of the socket type signal contacts to be used for signal transmission. Additionally, at least one piece of the connector is manufactured from wafers, with each ground plane and signal column injection molded into components which, when combined, form a wafer. This construction allows very close spacing between adjacent columns of signal contacts as well as tightly controlled spacing between the signal contacts and the shields. It also allows for easy and flexible manufacture, such as a connector that has wafers intermixed in a configuration to accommodate single ended, point to point and differential applications.
    • 用于印刷电路板的高速,高密度电连接器。 连接器为两片,一片具有销和屏蔽板,另一个具有插座型信号触点和屏蔽板。 屏蔽件具有适于控制电磁场的接地装置,用于各种系统架构,同时开关配置和信号速度,允许将所有插座型信号触点用于信号传输。 另外,至少一片连接器由晶片制成,每个接地平面和信号柱都注射成型,当被组合时形成晶片。 这种结构允许在相邻的信号触点列之间具有非常紧密的间隔,以及在信号触头和屏蔽之间的紧密控制的间隔。 它还允许简单和灵活的制造,例如具有在配置中混合以适应单端,点对点和差分应用的晶片的连接器。
    • 10. 发明申请
    • Methods of manufacturing an electrical connector incorporating passive circuit elements
    • 制造具有无源电路元件的电连接器的方法
    • US20050283974A1
    • 2005-12-29
    • US10874669
    • 2004-06-23
    • Robert RichardThomas CohenWilliam Kenny
    • Robert RichardThomas CohenWilliam Kenny
    • H01R13/646H01R13/66H01R43/00
    • H01R24/44H01R12/727H01R13/6625H01R2103/00Y10T29/49117Y10T29/49139Y10T29/49147
    • A process for manufacturing an electrical connector is described. In the preferred embodiment, the process includes the following steps: (a) providing a lead frame that has a plurality of signal conductors, where each of the signal conductors has a first contact end, a second contact end and an intermediate portion therebetween; (b) providing at least a segment of the intermediate portion of the signal conductors with solder wettable material; (c) providing an insulative housing around at least a portion of each of the plurality of signal conductors, the insulative housing providing openings through which an exposed area of each of the signal conductors is accessible, where the exposed area includes the segment of the intermediate portion with solder wettable material; (d) cutting and removing a portion of the exposed area of the signal conductors such that only a portion of the exposed area remains; and (e) attaching a passive circuit element to the remaining portion of the exposed area of each of the signal conductors.
    • 描述用于制造电连接器的工艺。 在优选实施例中,该方法包括以下步骤:(a)提供具有多个信号导体的引线框架,其中每个信号导体具有第一接触端,第二接触端和它们之间的中间部分; (b)用焊料可润湿材料提供信号导体的中间部分的至少一段; (c)围绕所述多个信号导体中的每一个的至少一部分提供绝缘壳体,所述绝缘壳体提供开口,每个所述信号导体的暴露区域可穿过所述开口,其中所述暴露区域包括所述中间体 焊料润湿材料部分; (d)切割和去除信号导体的暴露区域的一部分,使得只有一部分暴露区域保留; 和(e)将无源电路元件附接到每个信号导体的暴露区域的剩余部分。