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1. 发明申请

US20090051293A1 DISPLAY HEAT DISTRIBUTION SYSTEM 有权
标题翻译：显示热分配系统
公开(公告)号：US20090051293A1
公开(公告)日：2009-02-26
申请号：US11843399
申请日：2007-08-22
申请人： Philip J. Houdek , John Ternus , Wei Chen
发明人： Philip J. Houdek , John Ternus , Wei Chen
IPC分类号： H01J7/24 , F21V29/00
CPC分类号： G02F1/133603 , G02F2001/133628
摘要： A display heat distribution system provides a display assembly. LEDs are mounted in the display assembly and illuminate the display assembly. Heat generation structures are mounted into the display assembly. In addition, heat distribution structures are mounted into the display assembly in a predetermined physically distributed heat management configuration. The heat generation structures and the heat distribution structures are physically located to maintain the LED temperatures at substantially uniform temperatures.
摘要翻译：显示器散热系统提供显示组件。 LED安装在显示组件中并照亮显示组件。发热结构安装在显示组件中。此外，热分配结构以预定的物理分布的热管理配置安装到显示组件中。发热结构和热分布结构物理定位，以将LED温度保持在基本均匀的温度。

2. 发明授权

US08854284B2 Display heat distribution system 有权
标题翻译：显示配热系统
公开(公告)号：US08854284B2
公开(公告)日：2014-10-07
申请号：US11843399
申请日：2007-08-22
申请人： Philip J. Houdek , John Ternus , Wei Chen
发明人： Philip J. Houdek , John Ternus , Wei Chen
IPC分类号： G09G3/32 , G02F1/1335
CPC分类号： G02F1/133603 , G02F2001/133628
摘要： A display heat distribution system provides a display assembly. LEDs are mounted in the display assembly and illuminate the display assembly. Heat generation structures are mounted into the display assembly. In addition, heat distribution structures are mounted into the display assembly in a predetermined physically distributed heat management configuration. The heat generation structures and the heat distribution structures are physically located to maintain the LED temperatures at substantially uniform temperatures.
摘要翻译：显示器散热系统提供显示组件。 LED安装在显示组件中并照亮显示组件。发热结构安装在显示组件中。此外，热分配结构以预定的物理分布的热管理配置安装到显示组件中。发热结构和热分布结构物理定位，以将LED温度保持在基本均匀的温度。

4. 发明授权

US06406257B1 Modular air moving system and method 有权
标题翻译：模块化空气移动系统及方法
公开(公告)号：US06406257B1
公开(公告)日：2002-06-18
申请号：US09408769
申请日：1999-09-29
申请人： Philip J. Houdek
发明人： Philip J. Houdek
IPC分类号： F01D2526
CPC分类号： H05K7/20172 , F04D25/166
摘要： A system and method of cooling heat generating components. Heat generating components are placed in an enclosure having an air permeable cover. A mating panel having a mating connector is placed proximate to the air permeable cover. A fan assembly having a hub is coupled to the mating panel, wherein coupling includes wiring the fan to a fan connector, mounting the fan connector along an axial line running through the hub and pressing the fan assembly into the mating panel so as to mate the mating connector and the fan connector.
摘要翻译：冷却发热部件的系统和方法。发热部件放置在具有透气盖的外壳中。具有配合连接器的配合面板放置在靠近透气罩的位置。具有轮毂的风扇组件联接到配合面板，其中联接包括将风扇连接到风扇连接器，沿着穿过轮毂的轴线安装风扇连接器，并将风扇组件按压到配合面板中，以便将配对连接器和风扇连接器。

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