专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08314676B1 Method of making a controlled seam laminated magnetic core for high frequency on-chip power inductors 有权
标题翻译：制造用于高频片上功率电感器的可控缝层压磁芯的方法
公开(公告)号：US08314676B1
公开(公告)日：2012-11-20
申请号：US13098656
申请日：2011-05-02
申请人： Peter Smeys , Andrei Papou , Peter Johnson , Anuraag Mohan
发明人： Peter Smeys , Andrei Papou , Peter Johnson , Anuraag Mohan
IPC分类号： H01F5/00 , H01F7/06 , H01L27/08
CPC分类号： H01F17/0033 , H01F41/046 , Y10T29/4902 , Y10T29/49075 , Y10T29/49078
摘要： A controlled seam magnetic core lamination utilizable in an inductor structure includes a magnetic base and first and second spaced-apart magnetic sidewalls extending substantially orthogonally from the base to define a seam therebetween. The controlled seam magnetic core lamination is utilizable in an inductor structure that includes: a non-conductive lower mold; a plurality of spaced-apart controlled seam lower laminations formed in the lower mold, each magnetic lower lamination having a horizontal base and first and second spaced-apart sidewalls extending substantially vertically upward from the base to define a seam therebetween; a non-conductive isolation layer formed on the lower mold and the magnetic lower laminations; a conductive trace formed on the isolation layer; a non-conductive upper mold formed over the isolation layer and the conductive trace; and a plurality of spaced-apart controlled seam magnetic upper laminations formed in the upper mold, each magnetic upper lamination having a horizontal base and first and second spaced-apart sidewalls that extend substantially vertically upward from the base to define a seam therebetween.
摘要翻译：可用于电感器结构的受控接缝磁芯层叠体包括磁性基座和从基座基本正交地延伸的第一和第二隔开的磁性侧壁，以在其间限定接缝。受控接缝磁芯层叠可用于电感器结构，其包括：非导电下模; 形成在下模具中的多个间隔开的受控接缝下层叠片，每个磁下层层叠件具有水平底座以及从底座基本垂直向上延伸的第一和第二间隔开的侧壁，以在其间限定接缝; 形成在下模具和磁性下层叠板上的非导电隔离层; 形成在隔离层上的导电迹线; 形成在隔离层和导电迹线上的非导电上模; 以及形成在上模具中的多个间隔开的受控接缝磁性上层叠片，每个磁性上层压板具有水平底座和第一和第二隔开的侧壁，其从基座基本上垂直向上延伸以在其间限定接缝。

2. 发明申请

US20120280781A1 METHOD OF MAKING A CONTROLLED SEAM LAMINATED MAGNETIC CORE FOR HIGH FREQUENCY ON-CHIP POWER INDUCTORS 有权
标题翻译：制造用于高频片上功率电感器的受控海绵层压磁芯的方法
公开(公告)号：US20120280781A1
公开(公告)日：2012-11-08
申请号：US13098656
申请日：2011-05-02
申请人： Peter Smeys , Andrei Papou , Peter Johnson , Anuraag Mohan
发明人： Peter Smeys , Andrei Papou , Peter Johnson , Anuraag Mohan
IPC分类号： H01F27/24 , H01F41/02
CPC分类号： H01F17/0033 , H01F41/046 , Y10T29/4902 , Y10T29/49075 , Y10T29/49078
摘要： A controlled seam magnetic core lamination utilizable in an inductor structure includes a magnetic base and first and second spaced-apart magnetic sidewalls extending substantially orthogonally from the base to define a seam therebetween. The controlled seam magnetic core lamination is utilizable in an inductor structure that includes: a non-conductive lower mold; a plurality of spaced-apart controlled seam lower laminations formed in the lower mold, each magnetic lower lamination having a horizontal base and first and second spaced-apart sidewalls extending substantially vertically upward from the base to define a seam therebetween; a non-conductive isolation layer formed on the lower mold and the magnetic lower laminations; a conductive trace formed on the isolation layer; a non-conductive upper mold formed over the isolation layer and the conductive trace; and a plurality of spaced-apart controlled seam magnetic upper laminations formed in the upper mold, each magnetic upper lamination having a horizontal base and first and second spaced-apart sidewalls that extend substantially vertically upward from the base to define a seam therebetween.
摘要翻译：可用于电感器结构的受控接缝磁芯层叠体包括磁性基座和从基座基本正交地延伸的第一和第二隔开的磁性侧壁，以在其间限定接缝。受控接缝磁芯层叠可用于电感器结构，其包括：非导电下模; 形成在下模具中的多个间隔开的受控接缝下层叠片，每个磁下层片具有水平底座和第一和第二间隔开的侧壁，从侧面基本垂直向上延伸以在其间限定接缝; 形成在下模具和磁性下层叠板上的非导电隔离层; 形成在隔离层上的导电迹线; 形成在隔离层和导电迹线上的非导电上模; 以及形成在上模具中的多个间隔开的受控接缝磁性上层叠片，每个磁性上层压板具有水平底座和第一和第二隔开的侧壁，其从基座基本上垂直向上延伸以在其间限定接缝。

3. 发明申请

US20120217625A1 INTEGRATED CIRCUIT MICRO-MODULE 有权
标题翻译：集成电路微型模块
公开(公告)号：US20120217625A1
公开(公告)日：2012-08-30
申请号：US13467259
申请日：2012-05-09
申请人： Anuraag Mohan , Peter Smeys
发明人： Anuraag Mohan , Peter Smeys
IPC分类号： H01L25/065 , H01L23/66
CPC分类号： H01L24/97 , H01L21/4853 , H01L21/486 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L23/3121 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5385 , H01L23/5389 , H01L23/66 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L25/16 , H01L2221/68377 , H01L2223/6677 , H01L2224/24137 , H01L2224/24227 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01087 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H05K1/165 , H05K1/185 , H05K2201/10098 , H05K2203/1469 , H01L2224/82 , H01L2924/00
摘要： One aspect of the present invention relates to an integrated circuit package that includes multiple layers of a planarizing, photo-imageable epoxy that are formed over a substrate. In some designs, the substrate is a silicon wafer. An integrated circuit is embedded in the epoxy. An antenna, which is electrically coupled to the active face of the integrated circuit through an interconnect layer, is formed over one of the epoxy layers. In various embodiments, at least some of the epoxy layers are positioned between the substrate and the antenna such that there is a distance of at least approximately 100 microns between the substrate and the antenna.
摘要翻译：本发明的一个方面涉及一种集成电路封装，其包括在衬底上形成的多层平坦化，可光成像环氧树脂。在一些设计中，衬底是硅晶片。集成电路嵌入在环氧树脂中。通过互连层电耦合到集成电路的有源面的天线在一个环氧树脂层上形成。在各种实施例中，环氧树脂层中的至少一些位于衬底和天线之间，使得在衬底和天线之间存在至少约100微米的距离。

4. 发明授权

US08130067B2 High frequency semiconductor transformer 有权
标题翻译：高频半导体变压器
公开(公告)号：US08130067B2
公开(公告)日：2012-03-06
申请号：US12777654
申请日：2010-05-11
申请人： Dok Won Lee , Peter Smeys , Anuraag Mohan , Peter J. Hopper
发明人： Dok Won Lee , Peter Smeys , Anuraag Mohan , Peter J. Hopper
IPC分类号： H01F5/00 , G01R33/02 , C21D1/04
CPC分类号： H01F19/04 , H01F5/003 , H01F17/08 , H01F27/2895 , H01F41/046 , H01L23/645 , H01L2924/0002 , Y10T29/49071 , H01L2924/00
摘要： A semiconductor transformer provides high frequency operation by forming the primary windings of the transformer around a section of magnetic material that has a hard axis that lies substantially parallel to the direction of the magnetic field generated by the primary windings. The core can also be formed to have a number of sections where the magnetic flux follows the hard axis through each section of the core.
摘要翻译：半导体变压器通过将变压器的初级绕组围绕磁性材料的一部分形成高频操作，所述磁性材料的一部分具有基本上平行于由初级绕组产生的磁场的方向的硬轴。芯也可以形成为具有多个部分，其中磁通量通过芯的每个部分跟随硬轴。

5. 发明申请

US20110163457A1 INTEGRATED CIRCUIT MICRO-MODULE 有权
标题翻译：集成电路微型模块
公开(公告)号：US20110163457A1
公开(公告)日：2011-07-07
申请号：US13022392
申请日：2011-02-07
申请人： Anuraag Mohan , Peter Smeys
发明人： Anuraag Mohan , Peter Smeys
IPC分类号： H01L23/50 , H01L21/50
CPC分类号： H01L24/97 , H01L21/4853 , H01L21/486 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L23/3121 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5385 , H01L23/5389 , H01L23/66 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L25/16 , H01L2221/68377 , H01L2223/6677 , H01L2224/24137 , H01L2224/24227 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01087 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H05K1/165 , H05K1/185 , H05K2201/10098 , H05K2203/1469 , H01L2224/82 , H01L2924/00
摘要： One aspect of the present invention relates to an integrated circuit package that includes multiple layers of a planarizing, photo-imageable epoxy that are formed over a substrate. In some designs, the substrate is a silicon wafer. An integrated circuit is embedded in the epoxy. An antenna, which is electrically coupled to the active face of the integrated circuit through an interconnect layer, is formed over one of the epoxy layers. In various embodiments, at least some of the epoxy layers are positioned between the substrate and the antenna such that there is a distance of at least approximately 100 microns between the substrate and the antenna.
摘要翻译：本发明的一个方面涉及一种集成电路封装，该集成电路封装包括在衬底上形成的多层平坦化，光可成像环氧树脂。在一些设计中，衬底是硅晶片。集成电路嵌入在环氧树脂中。通过互连层电耦合到集成电路的有源面的天线在一个环氧树脂层上形成。在各种实施例中，环氧树脂层中的至少一些位于衬底和天线之间，使得在衬底和天线之间存在至少约100微米的距离。

6. 发明申请

US20110279214A1 High Frequency Semiconductor Transformer 有权
标题翻译：高频半导体变压器
公开(公告)号：US20110279214A1
公开(公告)日：2011-11-17
申请号：US12777654
申请日：2010-05-11
申请人： Dok Won Lee , Peter Smeys , Anuraag Mohan , Peter J. Hopper
发明人： Dok Won Lee , Peter Smeys , Anuraag Mohan , Peter J. Hopper
IPC分类号： H01F27/28 , H01F41/06
CPC分类号： H01F19/04 , H01F5/003 , H01F17/08 , H01F27/2895 , H01F41/046 , H01L23/645 , H01L2924/0002 , Y10T29/49071 , H01L2924/00
摘要： A semiconductor transformer provides high frequency operation by forming the primary windings of the transformer around a section of magnetic material that has a hard axis that lies substantially parallel to the direction of the magnetic field generated by the primary windings. The core can also be formed to have a number of sections where the magnetic flux follows the hard axis through each section of the core.
摘要翻译：半导体变压器通过将变压器的初级绕组围绕磁性材料的一部分形成高频操作，所述磁性材料的一部分具有基本上平行于由初级绕组产生的磁场的方向的硬轴。芯也可以形成为具有多个部分，其中磁通量通过芯的每个部分跟随硬轴。

7. 发明授权

US08482118B2 Integrated circuit micro-module 有权
标题翻译：集成电路微模块
公开(公告)号：US08482118B2
公开(公告)日：2013-07-09
申请号：US13467259
申请日：2012-05-09
申请人： Anuraag Mohan , Peter Smeys
发明人： Anuraag Mohan , Peter Smeys
IPC分类号： H01L23/04 , H01L23/12 , H01L23/053 , H01L23/34
CPC分类号： H01L24/97 , H01L21/4853 , H01L21/486 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L23/3121 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5385 , H01L23/5389 , H01L23/66 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L25/16 , H01L2221/68377 , H01L2223/6677 , H01L2224/24137 , H01L2224/24227 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01087 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H05K1/165 , H05K1/185 , H05K2201/10098 , H05K2203/1469 , H01L2224/82 , H01L2924/00
摘要： One aspect of the present invention relates to an integrated circuit package that includes multiple layers of a planarizing, photo-imageable epoxy that are formed over a substrate. In some designs, the substrate is a silicon wafer. An integrated circuit is embedded in the epoxy. An antenna, which is electrically coupled to the active face of the integrated circuit through an interconnect layer, is formed over one of the epoxy layers. In various embodiments, at least some of the epoxy layers are positioned between the substrate and the antenna such that there is a distance of at least approximately 100 microns between the substrate and the antenna.
摘要翻译：本发明的一个方面涉及一种集成电路封装，该集成电路封装包括在衬底上形成的多层平坦化，光可成像环氧树脂。在一些设计中，衬底是硅晶片。集成电路嵌入在环氧树脂中。通过互连层电耦合到集成电路的有源面的天线在一个环氧树脂层上形成。在各种实施例中，环氧树脂层中的至少一些位于衬底和天线之间，使得在衬底和天线之间存在至少约100微米的距离。

8. 发明授权

US08187920B2 Integrated circuit micro-module 有权
标题翻译：集成电路微模块
公开(公告)号：US08187920B2
公开(公告)日：2012-05-29
申请号：US13022392
申请日：2011-02-07
申请人： Anuraag Mohan , Peter Smeys
发明人： Anuraag Mohan , Peter Smeys
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L21/66
CPC分类号： H01L24/97 , H01L21/4853 , H01L21/486 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L23/3121 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5385 , H01L23/5389 , H01L23/66 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L25/16 , H01L2221/68377 , H01L2223/6677 , H01L2224/24137 , H01L2224/24227 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01087 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H05K1/165 , H05K1/185 , H05K2201/10098 , H05K2203/1469 , H01L2224/82 , H01L2924/00
摘要： One aspect of the present invention relates to an integrated circuit package that includes multiple layers of a planarizing, photo-imageable epoxy that are formed over a substrate. In some designs, the substrate is a silicon wafer. An integrated circuit is embedded in the epoxy. An antenna, which is electrically coupled to the active face of the integrated circuit through an interconnect layer, is formed over one of the epoxy layers. In various embodiments, at least some of the epoxy layers are positioned between the substrate and the antenna such that there is a distance of at least approximately 100 microns between the substrate and the antenna.
摘要翻译：本发明的一个方面涉及一种集成电路封装，该集成电路封装包括在衬底上形成的多层平坦化，光可成像环氧树脂。在一些设计中，衬底是硅晶片。集成电路嵌入在环氧树脂中。通过互连层电耦合到集成电路的有源面的天线在一个环氧树脂层上形成。在各种实施例中，环氧树脂层中的至少一些位于衬底和天线之间，使得在衬底和天线之间存在至少约100微米的距离。

9. 发明申请

US20200371171A1 Z-Axis Magnetic Sensor with Distributed Flux Guides 审中-公开
公开(公告)号：US20200371171A1
公开(公告)日：2020-11-26
申请号：US16957719
申请日：2018-12-20
申请人： Anuraag MOHAN , Phillip MAHER , Guide DESANDRE , Robert Bosch GmbH
发明人： Anuraag Mohan , Phillip Mather , Guido De Sandre
IPC分类号： G01R33/09
摘要： An out-of-plane tunneling magnetoresistive (TMR) magnetic field sensor includes a sense element that defines a sense plane and a flux guide configured to direct a magnetic field perpendicular to the sense plane into the sense plane. The magnetic field sensor further includes a first coil arranged in a first plane, a second coil electrically insulated from the first coil and arranged in a spaced-apart second plane, and drive circuitry operatively connected to the first coil and the second coil. The drive circuitry in a first mode energizes the first and second coils to generate respective first and second fields that combine to set a magnetization of the flux guide. The drive circuitry in a second mode energizes only the first coil to generate the first field so as to set a magnetization of the sense element without changing the magnetization of the flux guide.

10. 发明申请

US20130099334A1 Z-Axis Semiconductor Fluxgate Magnetometer 有权
标题翻译： Z轴半导体磁通门磁力计
公开(公告)号：US20130099334A1
公开(公告)日：2013-04-25
申请号：US13276391
申请日：2011-10-19
申请人： Anuraag Mohan , Peter J. Hopper
发明人： Anuraag Mohan , Peter J. Hopper
IPC分类号： H01L29/82 , H01L21/02
CPC分类号： G01R33/04 , H01L23/5227 , H01L23/645 , H01L24/19 , H01L28/10 , H01L2223/6677 , H01L2224/04105 , H01L2224/73267 , H01L2924/15153
摘要： A z-axis fluxgate magnetometer is formed in a semiconductor wafer fabrication sequence, which significantly reduces the size and cost of the fluxgate magnetometer. The semiconductor wafer fabrication sequence forms a vertical magnetic core structure, a first wire structure wound around the magnetic core structure, and a second wire structure wound around the magnetic core structure.
摘要翻译： z轴磁通门磁力计形成在半导体晶片制造顺序中，这显着地减小了磁通门磁强计的尺寸和成本。半导体晶片制造顺序形成垂直磁芯结构，围绕磁芯结构缠绕的第一线结构和缠绕在磁芯结构上的第二线结构。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式