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1. 发明授权

US08450902B2 Electrostatic actuator device having multiple gap heights 有权
标题翻译：具有多个间隙高度的静电致动器装置
公开(公告)号：US08450902B2
公开(公告)日：2013-05-28
申请号：US11467660
申请日：2006-08-28
申请人： Peter M. Gulvin , Peter J. Nystrom
发明人： Peter M. Gulvin , Peter J. Nystrom
IPC分类号： H02N1/00 , H01H59/00 , B41J2/45
CPC分类号： H01H59/0009 , H01G5/18
摘要： The present application is directed to novel electrostatic actuators and methods of making the electrostatic actuators. In one embodiment, the electrostatic actuator comprises a substrate, an electrode formed on the substrate and a deflectable member positioned in proximity to the electrode so as to provide a gap between the electrode and the deflectable member. The deflectable member is anchored on the substrate via one or more anchors. The gap comprises at least one first region having a first gap height positioned near the one or more anchors and at least one second region having a second gap height positioned farther from the anchors than the first region. The first gap height is smaller than the second gap height.
摘要翻译：本申请涉及新型静电致动器和制造静电致动器的方法。在一个实施例中，静电致动器包括衬底，形成在衬底上的电极和位于电极附近的可偏转构件，以便在电极和可偏转构件之间提供间隙。可偏转构件经由一个或多个锚固件锚定在基底上。所述间隙包括至少一个第一区域，其具有位于所述一个或多个锚固件附近的第一间隙高度和至少一个第二区域，所述第二区域具有比所述第一区域更远离所述锚定件的第二间隙高度。第一间隙高度小于第二间隙高度。

2. 发明授权

US08097497B2 Inkjet printed wirebonds, encapsulant and shielding 有权
标题翻译：喷墨印刷线圈，密封剂和屏蔽
公开(公告)号：US08097497B2
公开(公告)日：2012-01-17
申请号：US11694886
申请日：2007-03-30
申请人： Peter M. Gulvin , Peter J. Nystrom , John P. Meyers
发明人： Peter M. Gulvin , Peter J. Nystrom , John P. Meyers
IPC分类号： H01L21/00
CPC分类号： H01L24/82 , H01L23/3185 , H01L23/552 , H01L23/66 , H01L24/24 , H01L2224/24011 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/76155 , H01L2224/82007 , H01L2224/82102 , H01L2224/82104 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12044 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A method of connecting a chip to a package in a semiconductor device includes printing an encapsulant to a predetermined thickness on at least a portion of the chip and package and printing a layer of conductive material on the encapsulant in a predetermined pattern between the chip and package. The printed conductive material conforms to an upper surface of the encapsulant such that the encapsulant defines a distance from the printed conductive material to the chip and package. The method further includes printing a second layer of encapsulant over the printed conductive material curing at least the second layer of encapsulant.
摘要翻译：将芯片连接到半导体器件中的封装的方法包括在芯片和封装的至少一部分上将密封剂印刷到预定厚度，并且在芯片和封装之间以预定图案在密封剂上印刷导电材料层。印刷的导电材料符合密封剂的上表面，使得密封剂限定了从印刷的导电材料到芯片和封装的距离。该方法还包括在固化至少第二层密封剂的印刷导电材料上印刷第二层密封剂。

3. 发明授权

US07591535B2 Maintainable coplanar front face for silicon die array printhead 失效
标题翻译：用于硅芯片阵列打印头的可维护的共面正面
公开(公告)号：US07591535B2
公开(公告)日：2009-09-22
申请号：US11837728
申请日：2007-08-13
申请人： Peter J. Nystrom , Peter M. Gulvin , John P. Meyers
发明人： Peter J. Nystrom , Peter M. Gulvin , John P. Meyers
IPC分类号： B41J2/155 , B21D51/16
CPC分类号： B41J2/155 , B41J2202/19 , B41J2202/20 , Y10T29/49346 , Y10T29/49885 , Y10T156/1089
摘要： A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.
摘要翻译：提供了具有连续可维护的打印头表面的全宽度阵列打印头及其形成方法。打印头包括基板和安装在其上的模具模块阵列，每个模块模块的正面暴露。硬化的填充材料围绕模具模块阵列以限定与模具阵列阵列的前表面共面的连续表面。

4. 发明授权

US08455271B2 Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads 有权
标题翻译：高度集成的晶片粘合MEMS器件，具有无释放膜制造用于高密度打印头
公开(公告)号：US08455271B2
公开(公告)日：2013-06-04
申请号：US11693209
申请日：2007-03-29
申请人： Peter J. Nystrom , Peter M. Gulvin , Paul W. Browne
发明人： Peter J. Nystrom , Peter M. Gulvin , Paul W. Browne
IPC分类号： H01L21/00 , B41J2/135
CPC分类号： B41J2/14314 , B41J2/16 , B41J2/1623 , B41J2/1629 , B41J2/1632 , B41J2/1639
摘要： A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrificial layer previously required for forming the actuatable membrane with respect to the driver component.
摘要翻译：公开了制造MEMS喷墨型打印头的方法和所得到的装置。该方法包括提供驱动器部件并且单独地提供可致动的膜部件，可致动的膜部件在不存在去除牺牲层的酸蚀刻的情况下形成。单独提供的致动膜部件被结合到驱动器部件，并且在接合之后将喷嘴板附接到可致动膜部件。单独制造组件不需要先前为相对于驱动器部件形成可致动膜所需的牺牲层的氢氟酸蚀刻去除。

5. 发明授权

US08132892B2 Maintainable coplanar front face for silicon die array printhead 有权
标题翻译：用于硅芯片阵列打印头的可维护的共面正面
公开(公告)号：US08132892B2
公开(公告)日：2012-03-13
申请号：US12536196
申请日：2009-08-05
申请人： Peter J. Nystrom , Peter M. Gulvin , John P. Meyers
发明人： Peter J. Nystrom , Peter M. Gulvin , John P. Meyers
IPC分类号： B41J2/155
CPC分类号： B41J2/155 , B41J2202/19 , B41J2202/20 , Y10T29/49346 , Y10T29/49885 , Y10T156/1089
摘要： A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.
摘要翻译：提供了具有连续可维护的打印头表面的全宽度阵列打印头及其形成方法。打印头包括基板和安装在其上的模具模块阵列，每个模块模块的正面暴露。硬化的填充材料围绕模具模块阵列以限定与模具阵列阵列的前表面共面的连续表面。

6. 发明申请

US20110242218A1 INDEPENDENT ADJUSTMENT OF DROP MASS AND VELOCITY USING STEPPED NOZZLES 有权
标题翻译：使用STEPPED喷嘴独立调整液压质量和速度
公开(公告)号：US20110242218A1
公开(公告)日：2011-10-06
申请号：US12751077
申请日：2010-03-31
申请人： Peter M. Gulvin , John R. Andrews , Gerald A. Domoto , Nicholas P. Kladias , Peter J. Nystrom
发明人： Peter M. Gulvin , John R. Andrews , Gerald A. Domoto , Nicholas P. Kladias , Peter J. Nystrom
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/14314 , B41J2/1433 , B41J2002/14475
摘要： Methods and systems of ejecting ink drops from an inkjet printer are disclosed. The methods and systems can include a printhead with one or more stepped nozzles each with an associated entrance diameter and exit diameter. Ink can be received into the printhead and formed into ink drops in the stepped nozzles. The ink drops can each have an associated drop mass and drop speed. The stepped nozzles can be provided such that the exit diameter can independently dictate the drop mass and the entrance diameter can independently dictate the drop speed. As such, the complexity of jet design optimization is reduced.
摘要翻译：公开了从喷墨打印机喷出墨滴的方法和系统。方法和系统可以包括具有一个或多个阶梯式喷嘴的打印头，每个具有相关联的入口直径和出口直径。油墨可以被接收到打印头中并且形成为阶梯式喷嘴中的墨滴。墨滴可以各自具有相关联的液滴质量和液滴速度。可以设置阶梯喷嘴，使得出口直径可以独立地决定液滴质量，并且入口直径可以独立地决定液滴速度。因此，喷射设计优化的复杂性降低。

7. 发明授权

US07681985B2 Self-aligned precision datums for array die placement 失效
标题翻译：用于阵列管芯放置的自对准精密基准
公开(公告)号：US07681985B2
公开(公告)日：2010-03-23
申请号：US12422532
申请日：2009-04-13
申请人： Peter J. Nystrom , Peter M. Gulvin , John P. Meyers
发明人： Peter J. Nystrom , Peter M. Gulvin , John P. Meyers
IPC分类号： B41J2/25
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2202/20
摘要： A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.
摘要翻译：本文描述了一种用于在包括更大的部分宽度阵列和全页宽度阵列的成像阵列中精确地定位管芯模块阵列的方法和所得到的装置。该方法包括直接在单个硅模块上形成物理参考数据，并将各个模具模块定位在临时固定器上。临时保持器包括对准工具，并且通过将物理基准原件抵靠对准工具而将单个模具放置在临时保持器上。真空暂时固定定位在临时保持器上的模具，然后将永久基板附接到临时保持器的模具。临时保持器被释放，有利于其上具有精确对准的模具模块的永久基板。

8. 发明授权

US07571970B2 Self-aligned precision datums for array die placement 失效
标题翻译：用于阵列管芯放置的自对准精密基准
公开(公告)号：US07571970B2
公开(公告)日：2009-08-11
申请号：US11777475
申请日：2007-07-13
申请人： Peter J. Nystrom , Peter M. Gulvin , John P. Meyers
发明人： Peter J. Nystrom , Peter M. Gulvin , John P. Meyers
IPC分类号： B41J2/155
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2202/20
摘要： A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.
摘要翻译：本文描述了一种用于在包括更大的部分宽度阵列和全页宽度阵列的成像阵列中精确地定位管芯模块阵列的方法和所得到的装置。该方法包括直接在单个硅模块上形成物理参考数据，并将各个模具模块定位在临时固定器上。临时保持器包括对准工具，并且通过将物理基准原件抵靠对准工具而将单个模具放置在临时保持器上。真空暂时固定定位在临时保持器上的模具，然后将永久基板附接到临时保持器的模具。临时保持器被释放，有利于其上具有精确对准的模具模块的永久基板。

9. 发明申请

US20080238997A1 HIGHLY INTEGRATED WAFER BONDED MEMS DEVICES WITH RELEASE-FREE MEMBRANE MANUFACTURE FOR HIGH DENSITY PRINT HEADS 有权
标题翻译：具有高密度打印头的无释放膜制造的高度集成的波形粘结MEMS器件
公开(公告)号：US20080238997A1
公开(公告)日：2008-10-02
申请号：US11693209
申请日：2007-03-29
申请人： Peter J. Nystrom , Peter M. Gulvin , Paul W. Browne
发明人： Peter J. Nystrom , Peter M. Gulvin , Paul W. Browne
IPC分类号： B41J2/145 , H01L21/00
CPC分类号： B41J2/14314 , B41J2/16 , B41J2/1623 , B41J2/1629 , B41J2/1632 , B41J2/1639
摘要： A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrificial layer previously required for forming the actuatable membrane with respect to the driver component.
摘要翻译：公开了制造MEMS喷墨型打印头的方法和所得到的装置。该方法包括提供驱动器部件并且单独地提供可致动的膜部件，可致动的膜部件在不存在去除牺牲层的酸蚀刻的情况下形成。单独提供的致动膜部件被结合到驱动器部件，并且在接合之后将喷嘴板附接到可致动膜部件。单独制造组件不需要先前为相对于驱动器部件形成可致动膜所需的牺牲层的氢氟酸蚀刻去除。

10. 发明授权

US07131628B2 Vented MEMS structures and methods 有权
标题翻译：通风MEMS结构和方法
公开(公告)号：US07131628B2
公开(公告)日：2006-11-07
申请号：US10901285
申请日：2004-07-28
申请人： Kathleen A. Feinberg , Peter M. Gulvin , Nancy Y. Jia , Peter J. Nystrom
发明人： Kathleen A. Feinberg , Peter M. Gulvin , Nancy Y. Jia , Peter J. Nystrom
IPC分类号： F16J3/00
CPC分类号： B41J2/14 , B41J2002/14483
摘要： A vent connects a chamber to the external atmosphere surrounding a device to equalize pressure within the chamber. The vent has a size and shape to allow pressure equalization to occur outside a normal operating cycle of the chamber and controls the pressure to prevent undesirable deflection of a membrane within the chamber and ensure proper operation of the device.
摘要翻译：排气口将室连接到围绕设备的外部气氛以均衡室内的压力。排气口具有尺寸和形状，以允许在室的正常操作循环之外发生压力平衡，并且控制压力以防止膜在室内的不期望的偏转并且确保装置的正常操作。

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