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1. 发明申请

US20060228834A1 Fabrication method of image scan module 审中-公开
标题翻译：图像扫描模块的制作方法
公开(公告)号：US20060228834A1
公开(公告)日：2006-10-12
申请号：US11102674
申请日：2005-04-11
申请人： Pen-Jung Lee , Ling-Ta Su , Ming-Chieh Lin
发明人： Pen-Jung Lee , Ling-Ta Su , Ming-Chieh Lin
IPC分类号： H01L21/339
CPC分类号： H04N5/2253 , H01L27/14618 , H01L27/14625 , H01L27/1469 , H01L2924/0002 , H04N5/2257 , H01L2924/00
摘要： A method of fabricating a CCDM scan module applied for image scan. A circuit board on which electronic devices are mounted is provided. A photo-detector and an integrated circuit device which is either packaged or unpackaged are also mounted on the circuit board to form an image sensor board. The electric connection between the photo-detector, the IC devices and the circuit board is established by wire-bonding technique. A module base is provided, and at least one reflection mirror and one transmission lens are mounted on the module base at predetermined positions. The image sensor board is then mounted on the module base at a position aligned with the lens for focusing an image.
摘要翻译：一种应用于图像扫描的CCDM扫描模块的制造方法。提供安装电子装置的电路板。光电检测器和集成电路装置也被封装或未封装，也安装在电路板上以形成图像传感器板。光电检测器，IC器件和电路板之间的电气连接通过引线键合技术建立。提供模块底座，并且至少一个反射镜和一个透射透镜在预定位置安装在模块基座上。然后，图像传感器板在与镜头对准的位置处安装在模块基座上，用于聚焦图像。

2. 发明申请

US20110096219A1 IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：图像传感器封装及其制造方法
公开(公告)号：US20110096219A1
公开(公告)日：2011-04-28
申请号：US12795837
申请日：2010-06-08
申请人： Pen-Jung Lee , Yu-Te Hsieh , Chiung-Kun Chuang , Ling-Ta Su , Ming-Chieh Lin
发明人： Pen-Jung Lee , Yu-Te Hsieh , Chiung-Kun Chuang , Ling-Ta Su , Ming-Chieh Lin
IPC分类号： H04N5/335 , H01L31/18
CPC分类号： H01L31/0203 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L31/02325 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48227 , H01L2924/16235 , H01L2924/181 , H01L2924/1815 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An image sensor package includes a substrate, an image sensor chip, a plurality of metal wires and an encapsulant. The substrate has an upper face, a lower face and a plurality of connecting pads arranged on the upper face. The image sensor chip has an active surface, a back surface opposite to the active surface and a plurality of bonding pads arranged on the active surface. The metal wires electrically connect the bonding pads of the image sensor chip to the connecting pads of the substrate. The transparent cover is arranged above the image sensor chip. A gap is formed between the transparent cover and the image sensor chip. The encapsulant is disposed around the transparent cover and the metal wires, and is used for sealing the metal wires and fixing the transparent cover above the image sensor chip.
摘要翻译：图像传感器封装包括基板，图像传感器芯片，多个金属线和密封剂。基板具有上表面，下表面和布置在上表面上的多个连接焊盘。图像传感器芯片具有活性表面，与活性表面相对的后表面和布置在活性表面上的多个接合焊盘。金属线将图像传感器芯片的接合焊盘电连接到衬底的连接焊盘。透明盖布置在图像传感器芯片的上方。在透明盖和图像传感器芯片之间形成间隙。密封剂设置在透明盖和金属丝周围，用于密封金属线并将透明盖固定在图像传感器芯片上方。

3. 发明授权

US08355210B2 Zoom camera module 有权
标题翻译：变焦相机模块
公开(公告)号：US08355210B2
公开(公告)日：2013-01-15
申请号：US12625503
申请日：2009-11-24
申请人： Chy-Lin Wang , Chir-Weei Chang , Ling-Ta Su , Ping-Chung Lin
发明人： Chy-Lin Wang , Chir-Weei Chang , Ling-Ta Su , Ping-Chung Lin
IPC分类号： G02B3/12 , G02B15/14
CPC分类号： G02B15/177 , G02B3/14 , G02B26/005
摘要： A zooming camera module includes a first lens group, a second lens group, and a third lens group. The first lens group is implemented on an optical axis at a fixed position, and has a negative total optical power. The second lens group is implemented on the optical axis and can be moved back and forth along the optical axis, to achieve zooming and focusing. The second lens group has a positive total optical power, and includes a liquid lens unit and at least one lens with non-zero optical power, wherein the at least one lens and the liquid lens are separately or integrally configured. The third lens group is implemented on the optical axis at a fixed position, and has a non-zero total optical power.
摘要翻译：变焦摄像机模块包括第一透镜组，第二透镜组和第三透镜组。第一透镜组在固定位置的光轴上实现，并且具有负总光功率。第二透镜组在光轴上实现并且可沿着光轴来回移动，以实现变焦和聚焦。第二透镜组具有正的总光功率，并且包括液体透镜单元和至少一个具有非零光焦度的透镜，其中至少一个透镜和液体透镜分开地或一体地构造。第三透镜组在固定位置的光轴上实现，并且具有非零的总光功率。

4. 发明申请

US20110058258A1 ZOOM CAMERA MODULE 有权
标题翻译：变焦相机模块
公开(公告)号：US20110058258A1
公开(公告)日：2011-03-10
申请号：US12625503
申请日：2009-11-24
申请人： Chy-Lin Wang , Chir-Weei Chang , Ling-Ta Su , Ping-Chung Lin
发明人： Chy-Lin Wang , Chir-Weei Chang , Ling-Ta Su , Ping-Chung Lin
IPC分类号： G02B15/14 , G02B3/14
CPC分类号： G02B15/177 , G02B3/14 , G02B26/005
摘要： A zooming camera module includes a first lens group, a second lens group, and a third lens group. The first lens group is implemented on an optical axis at a fixed position, and has a negative total optical power. The second lens group is implemented on the optical axis and can be moved back and forth along the optical axis, to achieve zooming and focusing. The second lens group has a positive total optical power, and includes a liquid lens unit and at least one lens with non-zero optical power, wherein the at least one lens and the liquid lens are separately or integrally configured. The third lens group is implemented on the optical axis at a fixed position, and has a non-zero total optical power.
摘要翻译：变焦摄像机模块包括第一透镜组，第二透镜组和第三透镜组。第一透镜组在固定位置的光轴上实现，并且具有负总光功率。第二透镜组在光轴上实现并且可沿着光轴来回移动，以实现变焦和聚焦。第二透镜组具有正的总光功率，并且包括液体透镜单元和至少一个具有非零光焦度的透镜，其中至少一个透镜和液体透镜分开地或一体地构造。第三透镜组在固定位置的光轴上实现，并且具有非零的总光功率。

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