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1. 发明授权

US5999269A One-dimensional active alignment of optical or opto-electronic devices on a substrate 失效
公开(公告)号：US5999269A
公开(公告)日：1999-12-07
申请号：US599213
申请日：1996-02-09
申请人： Paul O. Haugsjaa , Robert A. Boudreau , Michael J. Urban
发明人： Paul O. Haugsjaa , Robert A. Boudreau , Michael J. Urban
IPC分类号： G02B6/42 , H01S5/022 , H01S5/40 , G01B11/00
CPC分类号： G02B6/4219 , G02B6/4221 , G02B6/423 , G02B6/4234 , G02B6/4225 , G02B6/4226 , H01S5/02252 , H01S5/02284 , H01S5/4031
摘要： The present invention involves a combination of active and passive optical or opto-electronic device alignment techniques. Passive alignment is used for two axial lateral directions and all three axial rotational directions (yaw, pitch and roll). In such passive alignment, only the substrate is micromachined with passive alignment structures. One-dimensional active alignment is then used for the remaining axial lateral direction.

2. 发明授权

US6023339A One-dimensional active alignment of optical or opto-electronic devices on a substrate 有权
标题翻译：光学或光电子器件在衬底上的一维有源对准
公开(公告)号：US6023339A
公开(公告)日：2000-02-08
申请号：US273898
申请日：1999-03-22
申请人： Paul O. Haugsjaa , Robert A. Boudreau , Michael J. Urban
发明人： Paul O. Haugsjaa , Robert A. Boudreau , Michael J. Urban
IPC分类号： G02B6/42 , H01S5/022 , H01S5/40 , G01B11/00
CPC分类号： G02B6/4219 , G02B6/4221 , G02B6/423 , G02B6/4234 , G02B6/4225 , G02B6/4226 , H01S5/02252 , H01S5/02284 , H01S5/4031
摘要： The present invention involves a combination of active and passive optical or opto-electronic device alignment techniques. Passive alignment is used for two axial lateral directions and all three axial rotational directions (yaw, pitch and roll). In such passive alignment, only the substrate is micromachined with passive alignment structures. One-dimensional active alignment is then used for the remaining axial lateral direction.
摘要翻译：本发明涉及有源和无源光学或光电子器件对准技术的组合。无源对准用于两个轴向横向和所有三个轴向旋转方向（偏航，俯仰和滚动）。在这种被动对准中，只有基板被微加工成被动对准结构。然后将一维有源对准用于剩余的轴向横向。

3. 发明授权

US5574561A Kinematic mounting of optical and optoelectronic elements on silicon waferboard 失效
标题翻译：光学和光电子元件在硅片上的运动安装
公开(公告)号：US5574561A
公开(公告)日：1996-11-12
申请号：US362625
申请日：1994-12-22
申请人： Robert A. Boudreau , Hongtao Han , Michael Kadar-Kallen , John R. Rowlette, Sr.
发明人： Robert A. Boudreau , Hongtao Han , Michael Kadar-Kallen , John R. Rowlette, Sr.
IPC分类号： G01B5/00 , G02B6/42 , G01B11/00
CPC分类号： G02B6/4231 , G01B5/0004 , G02B6/423
摘要： The present invention relates to a novel, accurate, passive alignment of optical and optoelectronic elements using silicon waferboard technology. The invention particularly relates to the use of etched v-grooves on monocrystalline materials in conjunction with alignment spheres to effect the passive alignment.
摘要翻译：本发明涉及使用硅片板技术的光学和光电子元件的新颖的，准确的，被动的对准。本发明特别涉及在与对准球结合的单晶材料上使用蚀刻的V形槽以实现被动对准。

4. 发明授权

US5479540A Passively aligned bi-directional optoelectronic transceiver module assembly 失效
标题翻译：被动对准双向光电收发模组件
公开(公告)号：US5479540A
公开(公告)日：1995-12-26
申请号：US382946
申请日：1995-02-01
申请人： Robert A. Boudreau , Hongtao Han , Ervin H. Mueller , John R. Rowlette, Sr. , Jared D. Stack
发明人： Robert A. Boudreau , Hongtao Han , Ervin H. Mueller , John R. Rowlette, Sr. , Jared D. Stack
IPC分类号： G02B6/42 , G02B6/34
CPC分类号： G02B6/4231 , G02B6/4246 , G02B6/4214
摘要： A passively aligned bi-directional optoelectronic transceiver module assembly utilizes a computer generated hologram as a diffractor to split/combine light beams of two different wavelengths. The entire assembly is constructed of monocrystalline silicon which is photolithographically batch processed to provide a low cost, compact structure with precision tolerances which is inherently passively aligned upon assembly.
摘要翻译：被动对准的双向光电收发器模块组件利用计算机产生的全息图作为衍射器来分离/组合两个不同波长的光束。整个组件由单晶硅构成，其通过光刻分批处理以提供具有精确公差的低成本，紧凑的结构，其在组装时固有地被对准。

5. 发明授权

US4746548A Method for registration of shadow masked thin-film patterns 失效
标题翻译：掩膜薄膜图案的配准方法
公开(公告)号：US4746548A
公开(公告)日：1988-05-24
申请号：US790695
申请日：1985-10-23
申请人： Robert A. Boudreau , Robert J. Wilkie
发明人： Robert A. Boudreau , Robert J. Wilkie
IPC分类号： G09F9/00 , C23C14/04 , C23C16/04 , H01L21/68
CPC分类号： C23C14/042 , C23C16/042 , H01L21/682
摘要： A method of aligning thin-film structure patterns on a substrate formed with the use of an apertured mask in a vacuum deposition system. The present method includes the steps of positioning a mask holder assembly within a deposition chamber, the mask holder assembly having the apertured mask as part thereof and having means for engaging a substrate carrier; positioning a substrate carrier within the deposition chamber spaced from the mask holder assembly, the carrier having the substrate supported therein and having means for aligning the apertured mask with the substrate; engaging the mask holder assembly with the substrate carrier such that they are in operative contact; positioning a magnet in the deposition chamber adjacent the side of the substrate carrier opposite the mask holder assembly such that the apertured mask is held in operative contact with the substrate; vacuum-depositing a thin-film structure material through the apertured mask; and removing the magnet from the substrate carrier and disengaging the mask holder assembly from the substrate carrier, thereby resulting in the formation of the thin-film structures on the substrate.
摘要翻译：在真空沉积系统中使用孔径掩模形成的衬底上的薄膜结构图案对准的方法。本方法包括以下步骤：将掩模保持器组件定位在沉积室内，掩模保持器组件具有孔径掩模作为其一部分并具有用于接合衬底载体的装置; 将衬底载体定位在所述沉积室内与所述掩模保持器组件间隔开的位置，所述载体具有支撑在其中的衬底，并且具有用于使所述带孔掩模与所述衬底对准的装置; 使掩模支架组件与基板载体接合，使得它们处于操作接触状态; 将磁体定位在邻近基板载体与掩模保持器组件相对的一侧的沉积室中，使得有孔掩模保持与基板有效接触; 通过多孔掩模真空沉积薄膜结构材料; 以及从基板载体上移除磁体并使掩模支架组件与基板载体脱开，由此导致在基板上形成薄膜结构。

6. 发明申请

US20130258485A1 GLASS LENTICULARS FOR AUTOSTEREOSCOPIC DISPLAY 审中-公开
标题翻译：用于自动显示的玻璃透镜
公开(公告)号：US20130258485A1
公开(公告)日：2013-10-03
申请号：US13431255
申请日：2012-03-27
申请人： Heather D. Boek , Robert A. Boudreau , Thierry L.A. Dannoux , Jacques Gollier , Mark O. Weller
发明人： Heather D. Boek , Robert A. Boudreau , Thierry L.A. Dannoux , Jacques Gollier , Mark O. Weller
IPC分类号： C03B23/02 , G02B3/00
CPC分类号： C03B23/02 , C03B2215/414 , G02B3/005
摘要： A method of making a glass lenticular array is provided. The method comprises: heating a sheet of glass, the sheet of glass comprising contact regions located thereupon in substantially parallel linear rows; and deforming the heated sheet of glass by contacting the contact regions with a forming body so as to form a plurality of cylindrical lenses in the heated sheet of glass, the plurality of cylindrical lenses arranged in substantially parallel rows with depressed regions between adjacent cylindrical lenses. The depressed regions are formed at the contact regions while apex regions of the cylindrical lenses are kept untouched during the step of deforming.
摘要翻译：提供一种制造玻璃透镜阵列的方法。该方法包括：加热玻璃板，所述玻璃片包括位于其上的基本上平行的直线行的接触区域; 并且通过使接触区域与成形体接触来使加热的玻璃片变形，以在加热的玻璃板中形成多个柱面透镜，所述多个柱面透镜以相邻的柱面透镜之间的凹陷区域大致平行地排列。在接触区域处形成凹陷区域，而在变形步骤期间保持柱面透镜的顶点区域不变。

7. 发明授权

US5694048A Monitor-detector assembly on silicon wafer board 失效
标题翻译：硅晶片板上的显示器检测器组件
公开(公告)号：US5694048A
公开(公告)日：1997-12-02
申请号：US414893
申请日：1995-03-31
申请人： Robert A. Boudreau , Hongtao Han , Robert Wallace Roff , Randall Brian Wilson
发明人： Robert A. Boudreau , Hongtao Han , Robert Wallace Roff , Randall Brian Wilson
IPC分类号： G01R31/28 , G02B6/36 , H01S3/04
CPC分类号： G01R31/2884
摘要： An optical subassembly for monitoring the emission of a semi-conductor laser is disclosed. The subassembly is diced from a wafer having mounted thereon the devices to be tested as well as the testing optical devices. The devices of the wafer are burned-in and those sections of the wafer having lasers that pass the burn-in testing are diced and form the subassemblies of the present invention.
摘要翻译：公开了一种用于监测半导体激光器的发射的光学子组件。子组件从其上安装有要测试的器件的晶片以及测试光学器件切片。将晶片的器件烧入，并且通过老化测试的具有激光器的晶片的那些部分被切割并形成本发明的子组件。

8. 发明授权

US5460318A Diebonding geometry for packaging optoelectronics 失效
标题翻译：封装几何封装光电子
公开(公告)号：US5460318A
公开(公告)日：1995-10-24
申请号：US252478
申请日：1994-06-01
申请人： Robert A. Boudreau , Richard H. Sargent
发明人： Robert A. Boudreau , Richard H. Sargent
IPC分类号： B23K1/00 , H01S5/02 , B23K101/40 , B23K31/02
CPC分类号： B23K1/0008 , H01S5/0224 , H01S5/02272
摘要： A solder geometry for epi-down diebonding an optoelectronic component to a heat sink platform includes a solder deposition pattern having exposure windows to create gaps or diebond bridges in the solder pattern. The active regions of the components are disposably registered within the gaps of the solder pattern.
摘要翻译：用于将光电子部件粘附到散热器平台的用于外延下沉的焊料几何形状包括具有曝光窗口的焊料沉积图案，以在焊料图案中产生间隙或沉陷桥。部件的有源区域可部分地登记在焊料图形的间隙内。

9. 发明授权

US5420953A Optoelectronic integration of holograms using (110) oriented silicon on (100) oriented silicon waferboard 失效
标题翻译：（100）定向硅晶片上的（110）取向硅的全息图的光电集成
公开(公告)号：US5420953A
公开(公告)日：1995-05-30
申请号：US198028
申请日：1994-02-17
申请人： Robert A. Boudreau , Hongtao Han , John R. Rowlette, Sr. , Jared D. Stack
发明人： Robert A. Boudreau , Hongtao Han , John R. Rowlette, Sr. , Jared D. Stack
IPC分类号： G02B6/30 , G02B5/32 , G02B6/36 , G02B6/42 , G02B7/00
CPC分类号： G02B6/4204 , G02B6/4249 , G02B6/423
摘要： The disclosure describes an optical interconnect which utilizes a silicon waferboard (1) with grooves (3,4) etched to expose preferred crystallographic planes to effect alignment of focusing elements (5) between optical waveguides (6) and optoelectronic devices (2). The focusing elements (5) are made of silicon wafers and are etched to expose crystal planes which compliment crystal planes of cavities or grooves which are etched in the waferboard. The focusing elements may have holograms (7) formed thereon for efficient focusing to the optical waveguide (6).
摘要翻译：本公开描述了一种光学互连件，其利用硅片板（1），其具有蚀刻以暴露优选结晶平面的凹槽（3,4）以实现光波导（6）和光电子器件（2）之间的聚焦元件（5）的对准。聚焦元件（5）由硅晶片制成，并被蚀刻以暴露掺杂在晶片板中蚀刻的空腔或凹槽的晶面的晶面。聚焦元件可以具有形成在其上的全息图（7），以有效地聚焦到光波导（6）。

10. 发明授权

US5011247A Uptapered single-mode optical fiber package for optoelectronic components 失效
标题翻译：用于光电子元件的单模光纤封装
公开(公告)号：US5011247A
公开(公告)日：1991-04-30
申请号：US487497
申请日：1990-03-02
申请人： Robert A. Boudreau , William C. Rideout
发明人： Robert A. Boudreau , William C. Rideout
IPC分类号： G02B6/42
CPC分类号： G02B6/4224 , G02B6/4208 , G02B6/4209 , G02B6/4225 , G02B6/423
摘要： A package for an optoelectronic device, such as a laser, having a photo-active element optically coupled to an uptapered single-mode optical fiber which connects said optoelectronic array to an external device includes a housing having a solderable substrate to which the device is secured, a graded index lens also secured to said substrate at a distance calculated to provide a known magnification of light beam emanating from said laser and an uptapered single-mode optical fiber mechanically positioned and actively aligned to said mangified light beam to achieve optimal optical coupling to said optoelectronic device. The package includes a plurality of reference marks and surfaces such that the laser, the lens and the uptapered end of a single-mode optical fiber may be positioned for precise optical coupling using an active alignment for final adjustments. The reference surfaces include a pedestal for the laser and a plurality of stops for the lens integrally formed with the substrate. The package also includes a fiber tube and flange for mechanically positioning the uptapered fiber. The precisely calculated spacing based on the spacing of said photo-active element, the magnification of said lens, and the fiber positioning is achieved by mechanical means.
摘要翻译：用于光电器件（例如激光器）的封装具有光耦合到连接所述光电子阵列与外部器件的开通单模光纤的光有源元件，该封装具有可焊接的基板，该器件被固定到该壳体分级折射率透镜也被固定到所述衬底上，所述距离被计算为提供从所述激光器发出的光束的已知放大倍数，以及机械定位并且主动地对准所述曼彻斯特光束的开通单模光纤，以实现最佳的光耦合说光电器件。封装包括多个参考标记和表面，使得单模光纤的激光器，透镜和开口端可以被定位用于使用主动对准来进行最终调整的精确光耦合。参考表面包括用于激光器的基座和用于与基底一体形成的透镜的多个止动件。该包装还包括一个光纤管和法兰，用于机械地定位光纤。基于所述光有源元件的间隔，所述透镜的放大率和光纤定位的精确计算的间隔通过机械装置实现。

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