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1. 发明授权

US07292449B2 Virtual ground return for reduction of radiated emissions 有权
标题翻译：减少辐射发射的虚拟地面回报
公开(公告)号：US07292449B2
公开(公告)日：2007-11-06
申请号：US11010553
申请日：2004-12-13
申请人： Paul Kevin Hall , Keith Bryan Hardin , Brandon Robert Shields
发明人： Paul Kevin Hall , Keith Bryan Hardin , Brandon Robert Shields
IPC分类号： H05K1/00
CPC分类号： H05K1/0231 , H05K1/0237 , H05K1/148 , H05K2201/09236
摘要： A digital apparatus having a cable comprising a plurality of high-speed and low-speed signal carrying conductors, the conductors carrying the low-speed signals are bypassed to a signal ground with selected values of capacitance so as to become virtual signal ground return conductors for the high-speed signal conductors. The selected values of capacitance have a lower impedance then the characteristic impedance of the conductors in the cable. The cable may be a multi conductor cable, a ribbon cable, a flex cable, a twisted pair cable, etc. In a similar fashion, signal conductors on a printed circuit board, not having a separate ground plane layer, may create virtual signal ground returns from the low-speed signal carrying conductors that are proximate to the high-speed signal carrying conductors for reduction of radiated electromagnetic radio frequency interference.
摘要翻译：具有包括多个高速和低速信号承载导体的电缆的数字装置，承载低速信号的导体被旁路到具有所选择的电容值的信号地，以便成为用于高速信号导体。电容的选定值具有较低的阻抗，即电缆中导体的特性阻抗。电缆可以是多导体电缆，带状电缆，柔性电缆，双绞线电缆等。以类似的方式，不具有单独的接地层的印刷电路板上的信号导体可以产生虚拟信号接地从靠近高速信号承载导体的低速信号承载导体返回，以减少辐射电磁射频干扰。

2. 发明授权

US09078374B2 Screening process for manufacturing a Z-directed component for a printed circuit board 有权
标题翻译：用于制造用于印刷电路板的Z定向部件的筛选过程
公开(公告)号：US09078374B2
公开(公告)日：2015-07-07
申请号：US13222418
申请日：2011-08-31
申请人： Paul Kevin Hall , Keith Bryan Hardin , Zachary Charles Nathan Kratzer , Qing Zhang
发明人： Paul Kevin Hall , Keith Bryan Hardin , Zachary Charles Nathan Kratzer , Qing Zhang
IPC分类号： B05D5/12 , H05K3/00 , H01C17/06 , H05K1/18 , H05K3/40 , C04B35/622 , H05K1/02 , B28B7/16
CPC分类号： H05K1/184 , B28B7/16 , C04B35/622 , H05K1/0231 , H05K1/0233 , H05K1/0248 , H05K1/0251 , H05K3/4046 , H05K3/4667 , H05K2201/09645
摘要： A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes adding a substrate material to a mold defining the shape of a layer of the z-directed component. A top surface of the substrate material in the mold is leveled. The substrate material in the mold is treated and the layer of the z-directed component is formed. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed that includes a stack of component layers that includes the formed layer.
摘要翻译：根据一个示例性实施例的用于制造用于插入到印刷电路板的安装孔中的z定向部件的方法包括将衬底材料添加到限定z定向部件的层的形状的模具中。模具中的基材材料的顶表面被平整。对模具中的基底材料进行处理，并且形成z定向部件的层。将导电材料施加到所形成的层的至少一个表面。形成z定向分量，其包括包括所形成的层的一组成分层。

3. 发明申请

US20120224296A1 Z-DIRECTED CAPACITOR COMPONENTS FOR PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：用于印刷电路板的Z方向电容器组件
公开(公告)号：US20120224296A1
公开(公告)日：2012-09-06
申请号：US13448460
申请日：2012-04-17
申请人： Keith Bryan Hardin , John Thomas Fessler , Paul Kevin Hall , Robert Aaron Oglesbee
发明人： Keith Bryan Hardin , John Thomas Fessler , Paul Kevin Hall , Robert Aaron Oglesbee
IPC分类号： H01G4/30
CPC分类号： H05K3/4046 , H05K1/0231 , H05K1/0233 , H05K1/0248 , H05K1/0251 , H05K1/0298 , H05K1/184 , H05K2201/09645 , H05K2201/10984
摘要： A Z-directed capacitor component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained within the PCB. In one embodiment the Z-directed capacitor component utilizes semi-cylindrical metallic sheets. In another embodiment, stack annular metallic disks are used. The Z-directed capacitor component mounts within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.
摘要翻译：用于插入印刷电路板的Z导向电容器组件，同时允许电连接到包含在PCB内部的内部导电平面。在一个实施例中，Z导向电容器部件使用半圆柱形金属片。在另一个实施例中，使用堆叠的环形金属盘。 Z导向电容器组件安装在PCB的厚度内，允许其他组件安装在其上。主体可以包含一个或多个导体并且可以包括沿着身体的长度的至少一部分延伸的一个或多个表面通道或孔。还提供了用于安装Z向定向部件的方法。

4. 发明授权

US08198548B2 Z-directed capacitor components for printed circuit boards 有权
标题翻译：用于印刷电路板的Z向电容器组件
公开(公告)号：US08198548B2
公开(公告)日：2012-06-12
申请号：US12508158
申请日：2009-07-23
申请人： Keith Bryan Hardin , John Thomas Fessler , Paul Kevin Hall , Robert Aaron Oglesbee
发明人： Keith Bryan Hardin , John Thomas Fessler , Paul Kevin Hall , Robert Aaron Oglesbee
IPC分类号： H05K1/16
CPC分类号： H05K3/4046 , H05K1/0231 , H05K1/0233 , H05K1/0248 , H05K1/0251 , H05K1/0298 , H05K1/184 , H05K2201/09645 , H05K2201/10984
摘要： A Z-directed capacitor component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained within the PCB. In one embodiment the Z-directed capacitor component utilizes semi-cylindrical metallic sheets. In another embodiment, stack annular metallic disks are used. The Z-directed capacitor component mounts within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.
摘要翻译：用于插入印刷电路板的Z导向电容器组件，同时允许电连接到包含在PCB内部的内部导电平面。在一个实施例中，Z导向电容器部件使用半圆柱形金属片。在另一个实施例中，使用堆叠的环形金属盘。 Z导向电容器组件安装在PCB的厚度内，允许其他组件安装在其上。主体可以包含一个或多个导体并且可以包括沿着身体的长度的至少一部分延伸的一个或多个表面通道或孔。还提供了用于安装Z向定向部件的方法。

5. 发明申请

US20110019374A1 Z-Directed Delay Line Components for Printed Circuit Boards 有权
标题翻译：用于印刷电路板的Z定向延迟线组件
公开(公告)号：US20110019374A1
公开(公告)日：2011-01-27
申请号：US12508188
申请日：2009-07-23
申请人： Keith Bryan Hardin , John Thomas Fessler , Paul Kevin Hall , Brian Lee Nally , Robert Aaron Oglesbee
发明人： Keith Bryan Hardin , John Thomas Fessler , Paul Kevin Hall , Brian Lee Nally , Robert Aaron Oglesbee
IPC分类号： H05K1/18
CPC分类号： H05K1/115 , H01B7/0009 , H05K1/0248 , H05K1/0286 , H05K1/0298 , H05K1/184 , H05K2201/10984
摘要： A Z-directed signal delay line component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed delay line component is housed within the thickness of the PCB allowing other components to be mounted over it. The delay line embodiments include a W-like line and a plurality of spaced apart, semi-circular line segment connected such that current flow direction alternates in direction between adjacent semi-circular line segments, each of which in other embodiments can be varied by use of shorting bars. Several Z-directed delay line components may be mounted into a PCB and serially connected to provide for longer delays. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.
摘要翻译：用于插入印刷电路板的Z指向信号延迟线组件，同时允许电连接到与PCB一起包含的内部导电平面。在一个实施例中，Z向延迟线部件容纳在PCB的厚度内，允许其上的其它部件安装在其上。延迟线实施例包括W状线和多个间隔开的半圆形线段，其连接成使得电流流动方向在相邻的半圆形线段之间的方向上交替，在其它实施例中，每一个可以通过使用来改变的短路。几个Z向延迟线组件可以安装到PCB中并串联连接以提供更长的延迟。主体可以包含一个或多个导体并且可以包括沿着身体的长度的至少一部分延伸的一个或多个表面通道或孔。还提供了用于安装Z向定向部件的方法。

6. 发明申请

US20110019375A1 Z-DIRECTED PASS-THROUGH COMPONENTS FOR PRINTED CIRCUIT BOARDS 有权
标题翻译：用于打印电路板的Z方向通过组件
公开(公告)号：US20110019375A1
公开(公告)日：2011-01-27
申请号：US12508145
申请日：2009-07-23
申请人： Keith Bryan Hardin , John Thomas Fessier , Paul Kevin Hall , Brian Lee Naity , Robert Aaron Oglesbee
发明人： Keith Bryan Hardin , John Thomas Fessier , Paul Kevin Hall , Brian Lee Naity , Robert Aaron Oglesbee
IPC分类号： H05K1/18
CPC分类号： H01G2/06 , H01G4/228 , H01G4/28 , H05K1/0231 , H05K1/0233 , H05K1/0248 , H05K1/0251 , H05K1/0298 , H05K1/184 , H05K3/4046 , H05K2201/09645 , H05K2201/10015 , H05K2201/10984
摘要： A Z-directed signal pass-through component for insertion into a printed circuit board while allowing electrical connection from external surface conductors to internal conductive planes or between internal conductive planes. The Z-directed pass-through component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body.
摘要翻译：用于插入印刷电路板的Z指向信号通过部件，同时允许从外部表面导体到内部导电平面或内部导电平面之间的电连接。 Z定向的直通部件安装在PCB的厚度内，允许其它部件安装在其上。主体可以包含一个或多个导体并且可以包括沿着身体的长度的至少一部分延伸的一个或多个表面通道或孔。

7. 发明授权

US09009954B2 Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material 有权
标题翻译：使用牺牲约束材料制造用于印刷电路板的Z定向部件的方法
公开(公告)号：US09009954B2
公开(公告)日：2015-04-21
申请号：US13528097
申请日：2012-06-20
申请人： Keith Bryan Hardin , Paul Kevin Hall , Zachary Charles Nathan Kratzer , Qing Zhang
发明人： Keith Bryan Hardin , Paul Kevin Hall , Zachary Charles Nathan Kratzer , Qing Zhang
IPC分类号： H01R43/00 , H05K1/18 , H01G4/33 , H01G4/35 , H05K1/02 , H05K3/40
CPC分类号： H05K1/0298 , B28B7/0091 , H01G2/06 , H01G4/33 , H01G4/35 , H05K1/0251 , H05K1/184 , H05K3/4046 , H05K2201/09645 , H05K2201/10053 , H05K2201/10984 , Y10T29/49002 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49153 , Y10T29/49155
摘要： A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes forming the Z-directed component in a cavity formed by a constraining material that defines the outer shape of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.
摘要翻译：根据一个示例性实施例的用于制造用于插入到印刷电路板的安装孔中的Z定向部件的方法包括：将Z定向部件形成在由约束材料形成的空腔中，所述约束材料限定Z定向的外形零件。消融约束材料以将约束材料释放Z定向的成分，并且对Z指向的元件进行烧制。

8. 发明授权

US08790520B2 Die press process for manufacturing a Z-directed component for a printed circuit board 有权
标题翻译：用于制造用于印刷电路板的Z定向部件的压模工艺
公开(公告)号：US08790520B2
公开(公告)日：2014-07-29
申请号：US13222748
申请日：2011-08-31
申请人： Paul Kevin Hall , Keith Bryan Hardin , Zachary Charles Nathan Kratzer , Qing Zhang
发明人： Paul Kevin Hall , Keith Bryan Hardin , Zachary Charles Nathan Kratzer , Qing Zhang
IPC分类号： H01L21/302
CPC分类号： H05K1/184 , H05K1/0231 , H05K1/0233 , H05K1/0248 , H05K1/0251 , H05K3/4046 , H05K3/4629 , H05K2201/09645 , Y10T29/49117 , Y10T29/4913
摘要： A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes punching a plurality of segments out of at least one sheet of substrate material to form a plurality of layers of the Z-directed component. A channel is formed through the substrate material either before or after the segments are punched. At least one of the formed layers includes at least a portion of the channel. A conductive material is applied to at least one surface of at least one of the formed layers. A stack of the formed layers is combined to form the Z-directed component.
摘要翻译：根据一个示例性实施例的用于制造用于插入到印刷电路板的安装孔中的Z指向部件的方法包括：从至少一个基片材料中冲出多个部分，以形成多个Z- 定向组件。在片段被冲压之前或之后通过衬底材料形成通道。所形成的层中的至少一个包括通道的至少一部分。导电材料被施加到至少一个所形成的层的至少一个表面。将形成的层的堆叠组合以形成Z指向的部件。

9. 发明授权

US08273996B2 Z-directed connector components for printed circuit boards 有权
标题翻译：用于印刷电路板的Z型连接器部件
公开(公告)号：US08273996B2
公开(公告)日：2012-09-25
申请号：US12508236
申请日：2009-07-23
申请人： Keith Bryan Hardin , Richard Herman Dressman , John Thomas Fessler , Paul Kevin Hall , Brian Lee Naily
发明人： Keith Bryan Hardin , Richard Herman Dressman , John Thomas Fessler , Paul Kevin Hall , Brian Lee Naily
IPC分类号： H05K1/11
CPC分类号： H05K3/4046 , H05K1/0231 , H05K1/0233 , H05K1/0248 , H05K1/0251 , H05K1/0298 , H05K1/184 , H05K2201/09645 , H05K2201/10893 , H05K2201/10984
摘要： A Z-directed connector component for insertion into a printed circuit board and providing electrical connections to internal conductive planes contained with the PCB and/or to external conductive traces on the surface of the PCB. In one embodiment the Z-directed component is housed within the thickness of the PCB allowing other components to be mounted over it. The body of the Z-directed connector component may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.
摘要翻译：用于插入印刷电路板并提供与PCB所包含的内部导电平面的电连接和/或PCB表面上的外部导电迹线的Z定向连接器部件。在一个实施例中，Z指向的部件容纳在PCB的厚度内，允许其上的部件安装在其上。 Z导向连接器部件的主体可以包含一个或多个导体，并且可以包括沿着身体长度的至少一部分延伸的一个或多个表面通道或孔。还提供了用于安装Z向定向部件的方法。

10. 发明授权

US08237061B2 Z-directed filter components for printed circuit boards 有权
标题翻译：用于印刷电路板的Z导向滤芯组件
公开(公告)号：US08237061B2
公开(公告)日：2012-08-07
申请号：US12508199
申请日：2009-07-23
申请人： Keith Bryan Hardin , Paul Kevin Hall , Robert Aaron Oglesbee
发明人： Keith Bryan Hardin , Paul Kevin Hall , Robert Aaron Oglesbee
IPC分类号： H05K1/16
CPC分类号： H05K1/184 , H05K1/0231 , H05K1/0233 , H05K1/0248 , H05K1/0251 , H05K1/0298 , H05K3/4046 , H05K2201/09645 , H05K2201/1006 , H05K2201/10984
摘要： A Z-directed filter component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed filter component is mounted within the thickness of the PCB allowing other components to be mounted over it. The filter may be T-filter or a Pi-filter within the body of the Z-directed component. The body may also contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.
摘要翻译：用于插入印刷电路板的Z向滤波器组件，同时允许电连接到与PCB一起包含的内部导电平面。在一个实施例中，Z导向的滤波器部件安装在PCB的厚度内，允许其它部件安装在其上。滤波器可以是Z-导向分量的体内的T滤波器或Pi滤波器。主体还可以包含一个或多个导体，并且可以包括沿主体长度的至少一部分延伸的一个或多个表面通道或孔。还提供了用于安装Z向定向部件的方法。

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