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1. 发明授权

US08257075B2 Carbon composite mold design 有权
标题翻译：碳复合模具设计
公开(公告)号：US08257075B2
公开(公告)日：2012-09-04
申请号：US12615141
申请日：2009-11-09
申请人： Paul Choiniere , Glenn Aune , John DiFonzo , Daniel Hong , Kevin Kenney
发明人： Paul Choiniere , Glenn Aune , John DiFonzo , Daniel Hong , Kevin Kenney
IPC分类号： B29C45/40
CPC分类号： B29C70/46 , B29C33/442 , B29C33/68
摘要： A mold assembly or system includes a moldbase that holds mold inserts and has embedded fluid lines to facilitate cooling during part formation. Mold inserts combine to form mold cavities that receive carbon fiber and resin components to form a carbon composite based part. A permanent release coating along a mold component surface that contacts the carbon fiber and resin components facilitates the release of the finished part from the mold component. Guide pins and guide pin receiving holes facilitate accurate alignment of mold components. Ejector pins within respective ejector pin shafts help eject a finished part from a respective mold component. An ejector pin shaft cover transfers force from an ejector pin to eject a finished part and also prevents substantial passage of resin into the ejector pin shaft. A fluid actuated ejection system provides fluid based mechanical forces to the ejector pins to facilitate finished part ejection.
摘要翻译：模具组件或系统包括保持模具插入件的模具基座，并且具有嵌入式流体管线以便于部件形成期间的冷却。模具插入件组合形成模腔，其容纳碳纤维和树脂组分以形成基于碳复合材料的部件。沿着与碳纤维和树脂部件接触的模具部件表面的永久性脱模涂层有利于成品部件从模具部件的释放。导销和导销接收孔有助于模具部件的精确对准。相应的顶针轴内的推杆有助于从相应的模具部件弹出成品零件。顶针轴套从顶针传递力，以弹出成品部件，并且还可防止树脂大量通入推杆销轴。流体致动的喷射系统向喷射器销提供基于流体的机械力以便于最终的部件喷射。

2. 发明申请

US20110038120A1 HEAT DISSIPATION IN COMPUTING DEVICE 有权
标题翻译：计算设备中的散热
公开(公告)号：US20110038120A1
公开(公告)日：2011-02-17
申请号：US12912671
申请日：2010-10-26
申请人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
发明人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
IPC分类号： G06F1/20 , B21D53/02
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
摘要翻译：公开了一种计算设备。该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。计算装置还包括从计算装置的发热元件移除热量的传热系统。传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。

3. 发明申请

US20100254111A1 SYSTEM FOR COUPLING INTERFACING PARTS 有权
标题翻译：接头部件联接系统
公开(公告)号：US20100254111A1
公开(公告)日：2010-10-07
申请号：US12817517
申请日：2010-06-17
申请人： Chris Ligtenberg , John DiFonzo , Brett William Degner , John Brock
发明人： Chris Ligtenberg , John DiFonzo , Brett William Degner , John Brock
IPC分类号： H05K9/00 , H05K5/00 , H05K13/00
CPC分类号： H05K5/0017 , H01R13/74 , Y10T29/49002 , Y10T29/49947
摘要： An electronic device is disclosed. The electronic device includes a first sub assembly having a first housing component. The first housing component has an opening. The electronic device also includes a second sub assembly having a second housing component. The second housing component cooperates with the first housing component to enclose components of an electronic device. The at least one internal component is accessible through the opening. The at least one internal component is also movable relative to the second sub assembly so as to properly align with the opening. The at least one internal component is additionally magnetically attracted towards the first housing component near the opening.
摘要翻译：公开了一种电子设备。电子设备包括具有第一壳体部件的第一子组件。第一个房屋部件有一个开口。电子设备还包括具有第二壳体部件的第二子组件。第二壳体部件与第一壳体部件配合以封闭电子设备的部件。至少一个内部部件可通过开口接近。所述至少一个内部部件也可相对于第二子组件移动，以便与开口正确对准。至少一个内部部件另外在靠近开口处朝向第一壳体部件磁吸引。

4. 发明申请

US20090174990A1 System For Coupling Interfacing Parts 有权
标题翻译：耦合接头部件系统
公开(公告)号：US20090174990A1
公开(公告)日：2009-07-09
申请号：US12239662
申请日：2008-09-26
申请人： Chris Ligtenberg , John DiFonzo , Brett William Degner , John Brock
发明人： Chris Ligtenberg , John DiFonzo , Brett William Degner , John Brock
IPC分类号： H05K7/00 , B23P11/00
CPC分类号： H05K5/0017 , H01R13/74 , Y10T29/49002 , Y10T29/49947
摘要： An electronic device is disclosed. The electronic device includes a first subassembly having a first housing component. The first housing component has an opening. The electronic device also includes a second subassembly having a second housing component. The second housing component cooperates with the first housing component to enclose components of an electronic device. The at least one internal component is also movable relative to the second subassembly so as to properly align with the opening. The at least one internal component is additionally magnetically attracted towards the first housing component near the opening.
摘要翻译：公开了一种电子设备。电子设备包括具有第一壳体部件的第一子组件。第一个房屋部件有一个开口。电子设备还包括具有第二壳体部件的第二子组件。第二壳体部件与第一壳体部件配合以封闭电子设备的部件。所述至少一个内部部件也可相对于第二子组件移动，以便与开口正确对准。至少一个内部部件另外在靠近开口处朝向第一壳体部件磁吸引。

5. 发明授权

US07301761B2 Computer component protection 有权
标题翻译：计算机组件保护
公开(公告)号：US07301761B2
公开(公告)日：2007-11-27
申请号：US11336102
申请日：2006-01-19
申请人： Nick Merz , John DiFonzo , Michael Prichard
发明人： Nick Merz , John DiFonzo , Michael Prichard
IPC分类号： G06F1/16
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
摘要翻译：公开了一种计算设备。该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。计算装置还包括从计算装置的发热元件移除热量的传热系统。传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。

6. 发明申请

US20070165373A1 COMPUTER COMPONENT PROTECTION 失效
标题翻译：电脑组件保护
公开(公告)号：US20070165373A1
公开(公告)日：2007-07-19
申请号：US11624141
申请日：2007-01-17
申请人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
发明人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
IPC分类号： G06F1/16
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
摘要翻译：公开了一种计算设备。该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。计算装置还包括从计算装置的发热元件移除热量的传热系统。传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。

7. 发明申请

US20070109737A1 Computer enclosure 有权
标题翻译：电脑外壳
公开(公告)号：US20070109737A1
公开(公告)日：2007-05-17
申请号：US11648304
申请日：2006-12-29
申请人： Michael Kriege , Dan Hong , John DiFonzo , Stephen Zadesky , David Lynch , David Lundgren , Nick Merz
发明人： Michael Kriege , Dan Hong , John DiFonzo , Stephen Zadesky , David Lynch , David Lundgren , Nick Merz
IPC分类号： G06F1/16 , H05K7/20
CPC分类号： G06F1/1616 , G06F1/1656 , G06F1/1679 , G06F1/182 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49171
摘要： A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.
摘要翻译：公开了一种具有改进的外壳布置的计算设备。外壳的一个方面涉及在结构上结合在一起以形成单一复合结构的外壳部件。在一个实施例中，结构胶用于将至少两个独特部分粘合在一起。外壳的另一方面涉及电结合在一起以形成单一的集成导电构件的外壳部件。在一个实施例中，使用导电膏将至少两个独特部分粘合在一起。改进的外壳在诸如膝上型计算机的便携式计算设备中特别有用。

8. 发明申请

US20070072443A1 Magnetic connector for electronic device 有权
公开(公告)号：US20070072443A1
公开(公告)日：2007-03-29
申请号：US11235875
申请日：2005-09-26
申请人： Matthew Rohrbach , Mark Doutt , Bartley Andre , Kanye Lim , John DiFonzo , Jean-Marc Gery
发明人： Matthew Rohrbach , Mark Doutt , Bartley Andre , Kanye Lim , John DiFonzo , Jean-Marc Gery
IPC分类号： H01R11/30
CPC分类号： H01R13/6205 , G06F1/1633 , G06F1/18 , H01R13/24 , Y10T29/49117
摘要： An electrical plug and receptacle relying on magnetic force to maintain contact are disclosed. The plug and receptacle can be used as part of a power adapter for connecting an electronic device, such as a laptop computer, to a power supply. The plug includes electrical contacts, which are preferably biased toward corresponding contacts on the receptacle. The plug and receptacle each have a magnetic element. The magnetic element on one or both of the plug and receptacle can be a magnet, which is preferably a permanent rare earth magnet although electromagnets may also be used. The magnetic element on the plug or receptacle that does not include a magnet is composed of ferromagnetic material. When the plug and receptacle are brought into proximity, the magnetic attraction between the magnet and its complement, whether another magnet or a ferromagnetic material, maintains the contacts in an electrically conductive relationship.

9. 发明授权

US07790637B2 Composite laminate having an improved cosmetic surface and method of making same 有权
标题翻译：具有改善的化妆品表面的复合层压板及其制造方法
公开(公告)号：US07790637B2
公开(公告)日：2010-09-07
申请号：US11932244
申请日：2007-10-31
申请人： John DiFonzo , Chris Ligtenberg
发明人： John DiFonzo , Chris Ligtenberg
IPC分类号： B32B27/04 , D04H1/00
CPC分类号： D03D15/02 , B29C70/083 , B29C70/34 , B32B5/022 , B32B5/26 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2262/106 , B32B2307/718 , B32B2457/00 , D10B2101/12 , Y10T428/24124 , Y10T428/24132 , Y10T428/249921 , Y10T442/184 , Y10T442/191 , Y10T442/198 , Y10T442/2984 , Y10T442/2992 , Y10T442/30
摘要： A composite laminate includes a plurality of sheets of prepreg stacked one over another, and a scrim layer provided on an exterior surface of the sheets of prepreg. Each prepreg sheet is formed of fibers preimpregnated with resin. The scrim layer and the sheets of prepreg form a composite laminate whereby the scrim layer constitutes an outer, exposed surface of the composite laminate. The scrim layer may be a nonwoven carbon or glass fiber scrim that has absorbed resin from the sheets of prepreg. A method of making a composite laminate includes placing into a mold a scrim and a plurality of sheets of prepreg, with the scrim extending between an exterior surface of the sheets of prepreg and an inner surface of the mold; forming a composite laminate whereby the scrim is adhered to the sheets of prepreg; and removing the composite laminate from the mold. An outer layer of the composite laminate includes the scrim.
摘要翻译：复合层叠体包括多个堆叠在一起的预浸料片，以及设置在预浸料片的外表面上的稀松布层。每个预浸料片材由预先用树脂浸渍的纤维形成。稀松布层和预浸料片形成复合层压材料，由此稀松布层构成复合层压板的外露面。稀松布层可以是从预浸料片吸收树脂的非织造碳纤维或玻璃纤维稀松布。制造复合层压材料的方法包括在模具中放置稀松布和多片预浸料，其中，稀松布在预浸料的片材的外表面和模具的内表面之间延伸; 形成复合层压体，由此将稀松布粘附到预浸料片上; 并从模具中去除复合层压材料。复合层压材料的外层包括稀松布。

10. 发明申请

US20090040698A1 COMPUTER COMPONENT PROTECTION 有权
标题翻译：电脑组件保护
公开(公告)号：US20090040698A1
公开(公告)日：2009-02-12
申请号：US12253126
申请日：2008-10-16
申请人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
发明人： Nick Merz , John DiFonzo , Stephen Zadesky , Michael Prichard
IPC分类号： G06F1/18
CPC分类号： G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
摘要翻译：公开了一种计算设备。该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。计算装置还包括从计算装置的发热元件移除热量的传热系统。传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。

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