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    • 2. 发明申请
    • Method and system for revising manuals
    • 修改手册的方法和系统
    • US20070156785A1
    • 2007-07-05
    • US11649339
    • 2007-01-03
    • Wallis HinesDeborah HinesRonald Payne
    • Wallis HinesDeborah HinesRonald Payne
    • G06F17/30
    • G06F17/2288G06F16/93G06F17/21
    • A method of revising a manual including opening a revision time period for the manual, iteratively revising the manual based on one or more change requests, closing the revision time period, and publishing a revised manual based on the one or more change requests. Iteratively revising the manual includes submitting a change request for the manual using an electronic revision management system, producing a first draft of the change request, approving the first draft of the change request using the electronic revision management system, receiving feedback on the change request from one or more reviewers through the electronic revision management system, revising the change request as necessary using the electronic revision management system based on the feedback received from the reviewers, producing a final draft of the change request, and approving the final draft of the change request using the electronic revision management system.
    • 一种修改手册的方法,包括打开手册的修订时间段,基于一个或多个改变请求迭代地修改手册,关闭修订时间段,以及基于一个或多个改变请求发布修订的手册。 迭代修改手册包括使用电子版本管理系统提交手册的更改请求,生成变更请求的初稿,使用电子版本管理系统批准变更请求的初稿,接收关于变更请求的反馈 一个或多个审核人员通过电子版本管理系统,根据审核人收到的反馈,使用电子修订管理系统根据需要修改变更请求,生成更改请求的最终草案,并批准更改请求的最终草案 使用电子版本管理系统。
    • 5. 发明申请
    • Method and apparatus for monitoring element alignment
    • 用于监测元件对准的方法和装置
    • US20060254068A1
    • 2006-11-16
    • US10549363
    • 2004-03-08
    • Peter ShottonRonald Payne
    • Peter ShottonRonald Payne
    • G01B3/00
    • E02D13/04E02D13/06E02D27/42G01C15/10
    • The present invention relates to a method of measuring the difference in alignment between a first plan position of an element (1) and a second plan position of an element, the method comprising the use of: i) at least one rigid or taut connection (4) extending between a first point (2) at the level of the first plan position and a second point (3) at the level of the second plan position, the first and second points being at an identical displacement from the element; and ii) one or more electrolevel gauges (5) provided on the or each rigid or taut connection, so as to measure the inclination of the rigid or taut connection.
    • 本发明涉及一种测量元件(1)的第一平面位置与元件的第二平面位置之间的对准差异的方法,所述方法包括以下步骤:i)至少一个刚性或拉紧连接 4)在第一平面位置的水平处的第一点(2)和在第二平面位置的水平处的第二点(3)之间延伸,第一和第二点与元件处于相同的位移; 以及ii)设置在所述或每个刚性或拉紧连接上的一个或多个电水平仪(5),以便测量刚性或拉紧连接的倾斜度。
    • 8. 发明申请
    • Integrated test-on-chip system and method and apparatus for manufacturing and operating same
    • 集成的片上芯片系统及其制造和操作的方法和装置
    • US20050060627A1
    • 2005-03-17
    • US10909919
    • 2004-08-02
    • Paul MaltseffRonald Payne
    • Paul MaltseffRonald Payne
    • G01R31/28
    • G01R31/2884G01R31/3025
    • A microchip system comprises a self check subsystem operable to perform a self test of at least one subsystem of the microchip system, and/or on the interoperability of subsystems. An antenna and a communications subsystem wirelessly transmit self check information from the microchip system. The communications subsystem may also receive information, data or instructions from an off-chip system or device. Self check tests may occur during manufacture of the microchip system and/or during operation. The microchip system may comprise a passive power subsystem coupled to an antenna to receive power in the form of an electromagnetic field, and which provides electrical power derived therefrom to at least one other subsystem of the microchip system.
    • 微芯片系统包括自检子系统,可操作以执行微芯片系统的至少一个子系统的自检和/或子系统的互操作性。 天线和通信子系统从微芯片系统无线传输自检信息。 通信子系统还可以从片外系统或设备接收信息,数据或指令。 自检检查可能在制造微芯片系统和/或操作过程中发生。 微芯片系统可以包括耦合到天线的无源电力子系统以以电磁场的形式接收功率,并且将无功功率子系统提供给微芯片系统的至少一个其它子系统。