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1. 发明授权

US5776791A Process for collective manufacture of chips with electrodes selectively covered by a deposit 失效
标题翻译：具有选择性覆盖沉积物的电极的芯片的集体制造工艺
公开(公告)号：US5776791A
公开(公告)日：1998-07-07
申请号：US747932
申请日：1996-11-12
申请人： Patrice Caillat , Gerard Nicolas , Robert Teoule
发明人： Patrice Caillat , Gerard Nicolas , Robert Teoule
IPC分类号： H01L21/306 , B01J19/00 , C40B40/06 , C40B40/10 , G01N27/403 , G01N33/00 , H01L23/52 , H01L21/66
CPC分类号： G01N33/0031 , B01J19/0046 , B01J2219/00585 , B01J2219/00596 , B01J2219/00605 , B01J2219/00637 , B01J2219/00653 , B01J2219/00659 , B01J2219/00713 , B01J2219/0072 , B01J2219/00722 , B01J2219/00725 , C40B40/06 , C40B40/10
摘要： This process comprises the following steps: a) make a set of chips (110, 111, 112, 113) on a substrate (100), each chip including a number of electrodes (110a, 110b, 111a, 111b), b) individual validity test on each chip and the formation of at least one electrical network (117a, 117b) for addressable matched electrodes on different valid chips, c) make a deposit successively on matched electrode sets by dipping the substrate in an appropriate electrochemical bath and by application of appropriate voltages on the electrical network to cause an electrochemical reaction on the electrodes.
摘要翻译：该过程包括以下步骤：a）在衬底（100）上形成一组芯片（110,111,112,113），每个芯片包括多个电极（110a，110b，111a，111b），b）个体对每个芯片进行有效性测试，并在不同的有效芯片上形成用于可寻址匹配电极的至少一个电网（117a，117b），c）通过将基板浸入适当的电化学浴中并通过应用在电网上施加适当的电压以在电极上引起电化学反应。

2. 发明授权

US5450206A Process and device for checking the conformity of hybridization balls 失效
标题翻译：用于检查杂交球一致性的方法和装置
公开(公告)号：US5450206A
公开(公告)日：1995-09-12
申请号：US242607
申请日：1994-05-13
申请人： Patrice Caillat , Guy Parat , Gerard Nicolas
发明人： Patrice Caillat , Guy Parat , Gerard Nicolas
IPC分类号： H01L21/60 , G01B11/14 , H01L21/66 , H05K13/08 , G01B11/00
CPC分类号： G01B11/14 , H01L22/12
摘要： A process for checking the conformity of hybridization balls present on a chip or a substrate and its implementation device are provided. The process includes positioning the hybridization balls of the electronic component or substrate near a strip transparent to a predetermined wavelength. The hybridization balls are partially flattened against the strip by positioning the electronic component or substrate at a previously defined distance from the transparent strip. The previously defined distance corresponds to a theoretical reference ball height less an acceptable deviation between the theoretical reference ball height and a minimum height of the hybridization balls. The partial flattening creates ball flats on the hybridization balls at the strip. The hybridization balls are illuminated with a light beam of the predetermined wavelength that is emitted through the strip. A portion of the light beam reflected back through the strip by the hybridization balls to be checked and is acquired. Finally, conformity or nonconformity of the hybridization balls to be checked is determined as a function of the portion of said light beam reflected back by each of the hybridization balls.
摘要翻译：提供了一种用于检查存在于芯片或基板上的杂交球的一致性的方法及其实现装置。该方法包括将电子部件或基板的杂交球定位在预定波长透明的条带附近。通过将电子部件或基板定位在与透明条带预先限定的距离处，将杂交球部分地压平在条带上。先前定义的距离对应于理论参考球高度减去理论参考球高度和杂交球的最小高度之间的可接受的偏差。部分平坦化在条带上的杂交球上产生球平面。用通过条带发射的预定波长的光束照射杂交球。光束的一部分通过条带反射回通过待检查的杂交球并被获取。最后，将要检查的杂交球的一致性或不合格确定为由每个杂交球反射的所述光束的部分的函数。

3. 发明授权

US4671593A Microconnector with high contact density 失效
标题翻译：接触密度高的微型连接器
公开(公告)号：US4671593A
公开(公告)日：1987-06-09
申请号：US756296
申请日：1985-07-18
申请人： Bruno Millon-Fremillon , Gerard Nicolas
发明人： Bruno Millon-Fremillon , Gerard Nicolas
IPC分类号： H01R4/48 , H01R12/71 , H01R9/09
CPC分类号： H01R12/714
摘要： A microconnector is used for connecting electrodes placed on a support and which are insulated from one another to the same number of conductors as there are electrodes and comprises a means for the elastic gripping of the support and flexible, elastic conductor wires, whose number is the same as that of the electrodes for connecting to the latter, which are insulated from one another and from the gripping means and which are fixed to the latter in such a way that each of them can come into contact with a single electrode when the support is gripped by the gripping means. Application is to low temperature electrical connections and to high density connections in a reduced space.
摘要翻译：微连接器用于连接放置在支架上的电极，它们彼此绝缘至与电极相同数量的导体，并且包括用于弹性夹持支撑件和柔性弹性导线的装置，其数量为与用于连接到后者的电极相同，它们彼此绝缘并且与夹持装置绝缘，并且固定到后者，使得当支撑件是支撑件时，它们中的每一个可以与单个电极接触由夹持装置抓住。适用于减少空间中的低温电气连接和高密度连接。

4. 发明授权

US4761517A Electrical connections with controlled thermal and electrical resistances 失效
标题翻译：具有受控热和电阻的电气连接
公开(公告)号：US4761517A
公开(公告)日：1988-08-02
申请号：US44784
申请日：1987-05-01
申请人： Claude Massit , Gerard Nicolas
发明人： Claude Massit , Gerard Nicolas
IPC分类号： H01B5/14 , F17C13/00 , H01B7/08 , H05K1/00 , H05K1/02 , H05K1/09 , H05K3/32
CPC分类号： H01B7/0846 , F17C13/008 , H05K1/0201 , H05K1/09 , H05K1/0393 , H05K2201/062
摘要： Flat electrical connecting cable with controlled electrical and thermal resistances.It comprises a flat insulating support, on which are installed connecting lines constituted by two superimposed layers. The first of them is constituted by a poor heat conducting material, such a manganin, while the second is discontinuous andis formed from a very good electric conducting material, such as copper. The segments on which the second layer is installed are thermally insulated an at uniform temperature. It is possible to vary the conductivity of the different layers by acting on the thickness and width thereof.This invention is applicable in industries such as cryogenics and space, as well as all applications functioning between a cold source and hot source, where it is wished to control the heat exchanges.
摘要翻译：扁平电气连接电缆，具有受控的电气和热电阻。它包括一个平坦的绝缘支撑，其上安装有由两个重叠层构成的连接线。它们中的第一个由诸如锰的不良导热材料构成，而第二个是不连续的，并且由非常好的导电材料例如铜形成。其上安装有第二层的段在均匀的温度下进行绝热。通过作用于其厚度和宽度可以改变不同层的导电性。本发明适用于诸如低温和空间等行业，以及希望控制热交换的冷源和热源之间的所有应用。

5. 发明授权

US4255853A Method for interconnecting the terminals of electrical assemblies 失效
标题翻译：互连电气组件端子的方法
公开(公告)号：US4255853A
公开(公告)日：1981-03-17
申请号：US31836
申请日：1979-04-20
申请人： Louis Campillo , Gerard Nicolas
发明人： Louis Campillo , Gerard Nicolas
IPC分类号： H01R4/04 , G02F1/1345 , G09F9/00 , H01R12/04 , H01R12/08 , H01R43/00 , H05K1/00 , H05K3/10 , H05K3/38 , H01B7/08 , H01R11/06
CPC分类号： H05K3/103 , H05K1/0393 , H05K2201/10287 , H05K3/386 , Y10T29/49149 , Y10T29/49162
摘要： At least one slot is formed in one or both connecting end-portions of a flexible insulating support, the slot or slots being superposed on the terminals of the corresponding electrical assembly. Connecting leads are unwound and bonded to the flexible support in the form of a continuous conductor arranged as a snaked coil, the ends of the loops which are placed beyond the slots being then cut off and removed. The method of interconnection permits the achievement of a high connection density, the connecting terminal pitch being of the order of a few tenths of a millimeter.
摘要翻译：在柔性绝缘支撑件的一个或两个连接端部中形成至少一个槽，所述槽或槽重叠在相应的电气组件的端子上。连接引线解开并以布置为蛇形线圈的连续导体的形式结合到柔性支撑件，然后将被放置在槽外的环的端部切断和移除。互连方法可实现高连接密度，连接端子间距为十分之几毫米数量级。

6. 发明授权

US5636683A Heating device for embodying connections by a meltable material 失效
标题翻译：用于通过可熔材料体现连接的加热装置
公开(公告)号：US5636683A
公开(公告)日：1997-06-10
申请号：US387605
申请日：1995-02-13
申请人： Claude Massit , Gerard Nicolas , Guy Parat
发明人： Claude Massit , Gerard Nicolas , Guy Parat
IPC分类号： G02F1/13 , B23K1/005 , H01L21/60 , F25B29/00
CPC分类号： H01L24/81 , H01L2224/16225 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/19043
摘要： A heating device is provided for connecting by means of a melting material to a connection support at least one component mounted on the support in at least one connection region at the periphery of the support. The device locally heats the support and/or the component in the connection region. Particular utility for the present invention is found in the area of production of flat display screens, although other utilities are also contemplated.
摘要翻译：提供了一种加热装置，用于通过熔化材料连接到连接支撑件上的至少一个部件，所述至少一个部件安装在支撑件上的至少一个连接区域的支撑件的外围。该装置局部加热连接区域中的支撑件和/或部件。本发明的特别实用性在平面显示屏的生产领域中发现，但是也可以考虑其它实用程序。

7. 发明授权

US4684181A Microconnector with a high density of contacts 失效
标题翻译：具有高密度接触的微型连接器
公开(公告)号：US4684181A
公开(公告)日：1987-08-04
申请号：US800362
申请日：1985-11-21
申请人： Claude Massit , Gerard Nicolas , Gerard Turc
发明人： Claude Massit , Gerard Nicolas , Gerard Turc
IPC分类号： G04G17/00 , H01R12/88 , H01R13/22 , H01R33/76 , H01R9/09 , H01R13/629
CPC分类号： G04G17/00 , H01R12/88
摘要： A microconnector with a high density of contacts which make it possible to connect N parallel electrodes to N electrical conductors. The microconnector comprises a support able to receive the electrodes, N electrically conductive, flexible, elastic wires, respectively connected to the N conductors and fixed to an insulating part movable relative to said support in such a way that the wires are parallel and each of them can come into contact with a single electrode as a result of a displacement of the insulating part when the electrodes are fitted in the support. A cam is provided for moving the part in such a way as to bring about simultaneous contacts between the respective electrodes and wires. The microconnector can be used in connection with flat screen display means.
摘要翻译：具有高密度接触的微型连接器，可以将N个平行电极连接到N个电导体。微连接器包括能够接收分别连接到N个导体并固定到可相对于所述支撑件移动的绝缘部分的电极，N导电，柔性，弹性线的支撑件，使得导线平行并且每个当电极安装在支撑体中时，由于绝缘部分的位移，可以与单个电极接触。提供凸轮以使部件移动以使各个电极和电线之间同时接触。微型连接器可用于平板显示装置。

8. 发明授权

US4031612A Method and a device for the interconnection of electronic components 失效
标题翻译：电子元件互连的方法和装置
公开(公告)号：US4031612A
公开(公告)日：1977-06-28
申请号：US663250
申请日：1976-03-02
申请人： Gerard Nicolas
发明人： Gerard Nicolas
IPC分类号： H05K3/22 , H05K7/06 , H05K13/06 , H05K3/00
CPC分类号： H05K13/06 , H05K3/222 , H05K7/06 , Y10T29/49162 , Y10T29/514
摘要： Different conductive zones on an insulating base support are interconnected by bonding an insulated wire to the support. In order to establish electric contacts between conductive zones and the conductive core of the insulated wire, the wire is stripped, soldered onto the conductive zones and cut after soldering.
摘要翻译：绝缘基座支架上的不同导电区域通过将绝缘电线连接到支架而相互连接。为了在导电区域和绝缘电线的导电芯之间建立电接触，将电线剥离，焊接到导电区上并在焊接之后切割。

9. 发明授权

US6159323A Process for selective transfer of a microstructure formed on an initial substrate to a final substrate 有权
标题翻译：将初始衬底上形成的微结构选择性转移到最终衬底的工艺
公开(公告)号：US6159323A
公开(公告)日：2000-12-12
申请号：US200388
申请日：1998-11-24
申请人： Jean-Pierre Joly , Gerard Nicolas , Michel Bruel
发明人： Jean-Pierre Joly , Gerard Nicolas , Michel Bruel
IPC分类号： H05K3/32 , G02F1/1362 , H05K3/00 , H05K3/20 , B32B31/00
CPC分类号： G02F1/13454 , H01L2221/68363 , H05K3/0058 , H05K3/0097
摘要： Process for transfer of a microstructure (12) from an initial substrate (10) to a final substrate (32). The process includes the following steps in sequence:bonding between the initial substrate (10) and an intermediate substrate (24), the microstructure facing the intermediate substrate,formation of at least one layer (30) of bond material on at least one selected region (16) of the initial substrate including the microstructurebring the said selected region (16) into contact with the final substrate,treatment of the bond material in an area corresponding to the selected region (16), to increase the bond force,breaking the selected region (16) of the initial substrate, from the intermediate substrate (24).
摘要翻译：用于将微结构（12）从初始衬底（10）转移到最终衬底（32）的工艺。该方法依次包括以下步骤：在初始基底（10）和中间基底（24）之间的结合，微结构面向中间基底，在至少一个选定区域上形成至少一层（30）的粘合材料包括微结构的初始衬底的基底（16）使所述选定区域（16）与最终衬底接触，在对应于所选择的区域（16）的区域中处理粘合材料，以增加接合力，从而破坏初始衬底的选定区域（16）从中间衬底（24）。

10. 发明授权

US5373189A Three-dimensional multichip module 失效
标题翻译：三维多芯片模块
公开(公告)号：US5373189A
公开(公告)日：1994-12-13
申请号：US99663
申请日：1993-07-30
申请人： Claude Massit , Gerard Nicolas
发明人： Claude Massit , Gerard Nicolas
IPC分类号： H01L25/065 , H01L25/10 , H01L23/02 , H05K7/00
CPC分类号： H01L25/105 , H01L25/0652 , H01L25/0655 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2225/06517 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2225/06582 , H01L2225/1023 , H01L2225/1052 , H01L2225/1088 , H01L2924/01014 , H01L2924/10253 , H01L2924/15159 , H01L2924/16153 , H01L2924/1627 , H01L2924/19041 , H01L2924/19107
摘要： Three-dimensional multichip module.The invention relates to a three-dimensional or 3D multichip module having a plurality of bidimensional, elementary electronic modules (4a-4d), each incorporating at least one chip (10a-10d), a support (6a-6d) on which is placed the chip and a conductive interconnection network or array (8a-8d) covering an upper surface of the support. These elementary modules are substantially superimposed in a displaced manner (in the form of a staircase) and are interconnected by means of their interconnection networks and connection pads (12a-12d) placed on those parts of the elementary modules not covered by the upper elementary module.Application to the association of integrated circuits in microconnection technology.
摘要翻译：三维多芯片模块。本发明涉及一种具有多个二维基本电子模块（4a-4d）的三维或三维多芯片模块，每个都包含至少一个芯片（10a-10d），其上放置有支撑件（6a-6d）所述芯片和覆盖所述支撑件的上表面的导电互连网络或阵列（8a-8d）。这些基本模块基本上以移位的方式（以阶梯的形式）叠加，并且通过其互连网络和放置在未被上部基本模块覆盖的基本模块的那些部分上的连接焊盘（12a-12d）相互连接。应用于微型连接技术中集成电路的关联。

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