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    • 4. 再颁专利
    • Methods and apparatus for EMI shielding
    • EMI屏蔽方法和设备
    • USRE42512E1
    • 2011-07-05
    • US12268250
    • 2008-11-10
    • Michael R. LambertJeff McFaddenPhilip van Haaster
    • Michael R. LambertJeff McFaddenPhilip van Haaster
    • H01R4/48H05K9/00
    • H05K9/0041
    • Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb. In yet another embodiment, the metallized dielectric honeycomb substrate can be utilized in a framed configuration to provide improved durability.
    • 公开了用于在提供EMI屏蔽的同时通过蜂窝式空气滤清器改善弹性和气流的方法和装置。 在一个实施例中,与传统的铝蜂窝体相比,蜂窝体可以由电介质(例如,塑料)基板制造,以提供改进的抗变形性。 电介质蜂窝状基体被金属化以提供EMI屏蔽能力。 金属化蜂窝状基体被切割成稍大的尺寸以适合电子外壳中的开口,这导致弹性周边弹簧指的弹性变形,其用于将金属化的电介质蜂窝保持在适当位置并且在金属化电介质基底和外壳之间提供导电性 ,从而消除了帧的使用。 在另一个实施例中,可以向金属化介电蜂窝体添加额外的导电层。 在另一个实施例中,金属化介电蜂窝体基底可以以框架构型使用以提供改善的耐久性。