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1. 发明申请

US20130061649A1 OFFSET ERROR AUTOMATIC CALIBRATION INTEGRATED CIRCUIT 有权
标题翻译：偏移自动校准集成电路
公开(公告)号：US20130061649A1
公开(公告)日：2013-03-14
申请号：US13671951
申请日：2012-11-08
申请人： PETER S. SCHULTZ , SUNG-JIN JO
发明人： PETER S. SCHULTZ , SUNG-JIN JO
IPC分类号： G01D18/00
CPC分类号： G01D18/008
摘要： An integrated circuit includes a transducer and transducer circuitry and additional elements useful in testing the transducer and transducer circuitry. A first power supply terminal and a second power supply terminal are for being directly connected to an external power supply terminal. A power bus is connected to the first power supply terminal. A logic function is for determining if the second power supply terminal is receiving power and if an automatic calibration test of the transducer and transducer circuitry has been run. An automatic calibration is for running an automatic calibration test on the transducer and transducer circuitry if the logic means determines that the second power supply terminal is receiving power and the automatic calibration test of the transducer and transducer circuitry has not been run.
摘要翻译：集成电路包括换能器和换能器电路以及用于测试换能器和换能器电路的附加元件。第一电源端子和第二电源端子用于直接连接到外部电源端子。电源总线连接到第一电源端子。逻辑功能用于确定第二电源端子是否正在接收电力，以及是否已经运行了换能器和换能器电路的自动校准测试。如果逻辑手段确定第二个电源端子正在接收电力，并且换能器和换能器电路的自动校准测试尚未运行，则自动校准用于对换能器和换能器电路进行自动校准测试。

2. 发明申请

US20140122013A1 SENSOR SINGLE TRACK TRIM USING STATIONARY HARDWARE AND FIELDS 有权
标题翻译：传感器单轨跟踪使用静态硬件和字段
公开(公告)号：US20140122013A1
公开(公告)日：2014-05-01
申请号：US13663998
申请日：2012-10-30
申请人： PETER S. SCHULTZ
发明人： PETER S. SCHULTZ
IPC分类号： G01D7/00 , G01P15/18 , G01R33/02 , G06F15/00
CPC分类号： G01R33/0286 , G01D21/00 , G01L25/00 , G01P15/18 , G01P21/00 , G01R33/0035 , G01R33/0206 , G06F17/40 , G06F19/00
摘要： A testing environment is provided in which both accelerometers and magnetometers can be tested in parallel, thereby decreasing the total cycle time for testing a semiconductor device package containing those devices. Embodiments of the present invention can also be configured to test singulated packages, thereby providing a tested and trimmed product that more accurately reflects the package delivered to the customer. In one embodiment, a series of device test locations within a testing region are configured to provide a known relationship with multiple fields of force. The device test locations are configured to provide sensitivity data from the packaged sensors in response to the directional forces. Embodiments provide a mechanism to transport the sensor packages from a device test location to a next device test location.
摘要翻译：提供了测试环境，其中可以并行测试加速度计和磁力计，从而减少用于测试包含这些装置的半导体器件封装的总周期时间。本发明的实施例还可以被配置为测试单个包装，从而提供更准确地反映递送给顾客的包装的经过测试和修剪的产品。在一个实施例中，测试区域内的一系列设备测试位置被配置为提供与多个力场的已知关系。设备测试位置被配置为响应于定向力提供来自封装传感器的灵敏度数据。实施例提供了一种将传感器封装从设备测试位置传输到下一个设备测试位置的机制。

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