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1. 发明专利

JPH10286571A ELECTROLYTIC CELL FOR ACIDIC WATER AND ALKALINE WATER PREPARATION 失效
公开(公告)号：JPH10286571A
公开(公告)日：1998-10-27
申请号：JP11529197
申请日：1997-04-16
申请人： PERMELEC ELECTRODE LTD , TOSHIBA CORP
发明人： YAMADA KUNIAKI , ANZAI SEIICHI , TANAKA MASASHI , SHIMAMUNE TAKAYUKI , NISHIKI YOSHINORI , SAKURAI NAOAKI , HAYAMIZU NAOYA , FUJITA HIROSHI
IPC分类号： C02F1/46 , C02F1/42 , C02F1/461 , C02F1/469 , C02F9/00 , C25B9/00 , C25B9/08 , C25B9/18
摘要： PROBLEM TO BE SOLVED: To prepare acidic water and alkaline water in a good balance of high purity in a good balance by providing in a ultrapure water supply amount and the power application amount of the minimum required amount in compliance with the required acidic water and alkaline water respectively. SOLUTION: An electrolytic cell comprises an acidic water electrolysis preparation unit 3 including an anode chamber 6 and an auxiliary cathode chamber 7 divided by a first ion exchange membrane 5 and an alkaline water electrolysis preparation unit 4 including a cathode chamber 10 and an auxiliary anode chamber 9 divided by a second ion exchange membrane 8, and power sources for both units are set to be controlled separately. The ultrapure water supply amount and the power application amount in compliance with the amounts of required acidic water and alkaline water can be provided by the arrangement to avoid the wasteful use of ultrapure water and waste of power consumption.

2. 发明专利

JP2013191779A Processor and processing method 审中-公开
标题翻译：处理器和处理方法
公开(公告)号：JP2013191779A
公开(公告)日：2013-09-26
申请号：JP2012057939
申请日：2012-03-14
申请人： Toshiba Corp , 株式会社東芝 , Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
发明人： FUJITA HIROSHI , ISO AKINORI , SOEDA KATSUYUKI , NISHIBE YUKINOBU , SASAKI SHINICHI
IPC分类号： H01L21/304 , B08B3/02
摘要： PROBLEM TO BE SOLVED: To provide a processor and a processing method capable of performing proper processing even in the case of performing processing by collected processing liquid.SOLUTION: The processor relating to an embodiment includes a carrying part for carrying an object to be processed, a collection part for collecting a first processing liquid supplied to a processing surface of the object to be processed carried by the carrying part, a first nozzle for discharging the first processing liquid collected by the collection part to the processing surface of the object to be processed, a second nozzle provided on a downstream side in the carrying direction of the first nozzle to discharge a second processing liquid to the processing surface of the object to be processed, and a third nozzle provided on a downstream side in the carrying direction of the second nozzle to discharge a cleaning fluid to the processing surface of the object to be processed. The second nozzle discharges the second processing liquid more to a downstream side in the carrying direction than to a direction perpendicular to the carrying direction, and the third nozzle discharges the cleaning fluid more to an upstream side in the carrying direction than the direction perpendicular to the carrying direction.
摘要翻译：要解决的问题：提供即使在通过收集的处理液进行处理的情况下也能够进行适当处理的处理器和处理方法。解决方案：与实施例相关的处理器包括用于承载待处理物体的承载部件，一个收集部分，用于收集供应给被承载物承载的待处理物体的处理表面的第一处理液;第一喷嘴，用于将由收集部分收集的第一处理液体排出到待处理物体的处理表面设置在第一喷嘴的输送方向的下游侧的第二喷嘴，将第二处理液排出到被处理物的处理面，以及设置在第二喷嘴的输送方向的下游侧的第三喷嘴喷嘴以将清洁流体排放到待处理物体的处理表面。第二喷嘴将第二处理液体排出到比输送方向垂直的方向更靠近输送方向的下游侧，并且第三喷嘴将排出清洁流体的方向比垂直于输送方向的方向更靠近输送方向的上游侧携带方向。

3. 发明专利

JP2012143705A Sludge disposal apparatus, sewage treatment system and method for disposing sludge 审中-公开
标题翻译：污泥处理设备，污水处理系统及排污方法
公开(公告)号：JP2012143705A
公开(公告)日：2012-08-02
申请号：JP2011003754
申请日：2011-01-12
申请人： Toshiba Corp , 株式会社東芝
发明人： HIRABAYASHI HIDEAKI , YAMAMOTO KATSUYA , FUJITA HIROSHI , OBARA TAKUMI , HARAGUCHI SATOSHI
IPC分类号： C02F11/00 , C02F3/12
CPC分类号： Y02E50/343 , Y02W10/15
摘要： PROBLEM TO BE SOLVED: To provide a sludge disposal apparatus that can improve the reduction in volume of excess sludge, and to provide a sewage treatment system and a method for disposing sludge.SOLUTION: The sludge disposal apparatus for disposing the sludge generated through microbial treatment, includes: a disposal vessel to which a fluid containing the sludge is supplied; a cavitation generating unit for generating cavitation in the fluid supplied to the disposal vessel; and a gas dissolving unit for dissolving gas in the fluid supplied to a region where the cavitation is generated.
摘要翻译：要解决的问题：提供一种可以改善过剩污泥体积减少的污泥处理装置，并提供污水处理系统和污泥处理方法。解决方案：用于处理通过微生物处理产生的污泥的污泥处理装置包括：供给含有污泥的流体的处理容器; 气蚀发生单元，用于在供给到处理容器的流体中产生气蚀; 以及用于将气体溶解在供给到产生气蚀的区域的流体中的气体溶解单元。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2011060955A Substrate drying method 审中-公开
标题翻译：基板干燥方法
公开(公告)号：JP2011060955A
公开(公告)日：2011-03-24
申请号：JP2009208261
申请日：2009-09-09
申请人： Toshiba Corp , 株式会社東芝
发明人： SATO KATSUHIRO , HAYAMIZU NAOYA , FUJITA HIROSHI , TAYA MAKIKO
IPC分类号： H01L21/304 , F26B9/06
摘要： PROBLEM TO BE SOLVED: To provide a substrate drying method capable of preventing the occurrence of a watermark and pattern collapse.
SOLUTION: In the substrate drying method, a substrate is processed by a rinsing liquid and dried. The substrate is brought into contact with a liquid organic solvent containing a hydrophilic group and fluorine atom in a molecule, and on a surface of the substrate, the rinsing liquid is replaced with the organic solvent and dried.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够防止水印和图案崩溃的发生的基板干燥方法。解决方案：在基材干燥方法中，将基材用冲洗液处理并干燥。将基板与分子中含有亲水基团和氟原子的液体有机溶剂接触，在基板的表面上，用有机溶剂代替漂洗液并干燥。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2007194546A Treating apparatus 有权
标题翻译：处理装置
公开(公告)号：JP2007194546A
公开(公告)日：2007-08-02
申请号：JP2006013652
申请日：2006-01-23
申请人： Shibaura Mechatronics Corp , Toshiba Corp , 株式会社東芝 , 芝浦メカトロニクス株式会社
发明人： WAKATSUKI TAKAHIKO , HAYAMIZU NAOYA , FUJITA HIROSHI , SAITO AKIKO , HAYASHI TOSHIHIDE , NISHIBE YUKINOBU , MAKINO TSUTOMU
IPC分类号： H01L21/304 , B08B3/02 , H01L21/027
CPC分类号： B08B3/022 , B08B7/00 , H01L21/67028 , H01L21/67051 , Y10T137/0318
摘要： PROBLEM TO BE SOLVED: To provide a treating apparatus capable of suppressing an increase in the temperature of the wall of a treatment chamber for treating a body to be treated by vapor. SOLUTION: The treating apparatus comprises the treatment chamber 1 capable of storing the body 10 to be treated; a nozzle 5 that is provided in the treatment chamber 1 for discharging vapor to the body 10 to be treated; a wall 2 for covering the treatment chamber 1; fluid passages 65a-65c provided inside the wall 2; a fluid inlet 60 provided while communicating with the fluid passages 65a-65c; and a fluid outlet 61 that is provided while communicating with the fluid passages 65a-65c and fluid flowing in from the fluid inlet 65, and passing the fluid passages 65a-65c flows out. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种能够抑制处理室的壁的温度升高的处理装置，用于处理由蒸气处理的物体。解决方案：处理装置包括能够储存被处理体10的处理室1。设置在处理室1中用于将蒸汽排放到待处理的主体10上的喷嘴5; 用于覆盖处理室1的壁2; 设置在壁2内的流体通道65a-65c; 设置在与流体通道65a-65c连通的流体入口60; 并且与流体通道65a-65c连通并且从流体入口65流入的流体和流体通道65a-65c通过而设置的流体出口61流出。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006286947A Method and apparatus for cleaning electronic device 审中-公开
标题翻译：清洁电子设备的方法和装置
公开(公告)号：JP2006286947A
公开(公告)日：2006-10-19
申请号：JP2005105071
申请日：2005-03-31
申请人： Toshiba Corp , 株式会社東芝
发明人： HAYAMIZU NAOYA , FUJITA HIROSHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To remove fine particles sufficiently without causing any damage on the surface of an electronic device.
SOLUTION: An apparatus for cleaning an electronic device comprises a section 50 for supplying cleaning liquid, a section 40 for supplying high pressure air, and a two-fluid nozzle 30 for spraying the cleaning liquid to a semiconductor wafer W while mixing with nitrogen wherein the two-fluid nozzle 30 is composed of a conductive material produced by mixing carbon filler into nonconductive resin.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了充分除去细颗粒而不会在电子设备的表面上造成任何损坏。解决方案：用于清洁电子设备的设备包括用于供应清洁液的部分50，用于供应高压空气的部分40和用于将清洁液喷射到半导体晶片W的双流体喷嘴30，同时与氮气，其中双流体喷嘴30由通过将碳填料混合到非导电树脂中而制成的导电材料构成。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2003340386A Ultrasonic cleaning apparatus and method therefor 审中-公开
标题翻译：超声波清洗装置及其方法
公开(公告)号：JP2003340386A
公开(公告)日：2003-12-02
申请号：JP2002149130
申请日：2002-05-23
申请人： Toshiba Corp , 株式会社東芝
发明人： SAKURAI NAOAKI , FUJITA HIROSHI
IPC分类号： B05B17/06 , B05D3/12 , B08B3/12 , H01L21/00 , H01L21/304 , H01L21/68
CPC分类号： H01L21/67259 , B08B3/12 , H01L21/67051 , H01L21/67253 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide an ultrasonic cleaning apparatus capable of preventing the contact of an ultrasonic cleaning unit with an object to be washed.
SOLUTION: The ultrasonic cleaning apparatus is equipped with an ultrasonic cleaning unit 40 opposedly arranged to the surface Wa to be cleaned of the object W to be washed and a positioning mechanism 30 for positioning the ultrasonic cleaning unit 40. The ultrasonic cleaning unit 40 has an ultrasonic diffusion body 62 which has an ultrasonic transducer 63 fixed to one surface thereof and is arranged in opposed relation to the surface of the object W to be washed on the other surface thereof and the non-contact distance sensor 71 for measuring the relative distance between the ultrasonic diffusion body 62 and the surface Wa to be washed. The positioning mechanism 30 has a control circuit 32 for positioning the ultrasonic cleaning unit 40 so as to hold the distance between the ultrasonic diffusion body 62 and the surface Wa to be washed.
COPYRIGHT: (C)2004,JPO
摘要翻译：解决的问题：提供一种超声波清洗装置，能够防止超声波清洗机与被清洗物接触。解决方案：超声波清洗装置配备有超声波清洗装置40，该超声波清洗装置40相对配置于待清洗对象物W的被清扫面Wa，以及定位机构30，用于定位超声波清洗机40。 40具有超声波扩散体62，该超声波扩散体62具有固定在其一个表面上的超声波换能器63，并且与其另一个表面上被清洗物体W的表面相对地设置有超声波扩散体62和非接触式距离传感器71，超声波扩散体62与要洗涤的表面Wa之间的相对距离。定位机构30具有用于定位超声波清洗单元40的控制电路32，以便保持超声波扩散体62与要被清洗的表面Wa之间的距离。版权所有（C）2004，JPO

8. 发明专利

JP2003340330A Ultrasonic cleaning nozzle, apparatus thereof and semiconductor device 有权
标题翻译：超声波清洗喷嘴，其设备及半导体装置
公开(公告)号：JP2003340330A
公开(公告)日：2003-12-02
申请号：JP2002149129
申请日：2002-05-23
申请人： Toshiba Corp , 株式会社東芝
发明人： SAKURAI NAOAKI , FUJITA HIROSHI
IPC分类号： B08B3/02 , B05B17/06 , B08B3/12 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an ultrasonic cleaning nozzle for suppressing the disturbance of a sound pressure value due to fluctuations in irradiation distance or flow rate, by arranging the flow of a cleaning liquid, reducing unnecessary reflected sonic waves in the nozzle, and not causing product defectiveness.
SOLUTION: The ultrasonic cleaning nozzle 60 for applying ultrasonic vibration to the cleaning liquid L to discharge the cleaning liquid L to a semiconductor wafer W is equipped with a relay chamber 70 into which the cleaning liquid L is introduced, a vibration part 80 provided in the relay chamber 70 to apply ultrasonic vibration to the cleaning liquid L in the relay chamber 70, a taper nozzle 91 provided at the position opposite to the vibration part 80 to discharge the cleaning liquid L and provided on the side of the relay chamber 70 to gradually become narrow in its inner diameter and a nozzle body 90 provided so as to continue to the tape nozzle 91 and having an extension nozzle 92 having a constant inner diameter.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种用于通过布置清洗液的流动来抑制由于照射距离或流量的波动引起的声压值的干扰的超声波清洗喷嘴，从而减少喷嘴中不必要的反射声波，而不会导致产品缺陷。解决方案：用于对清洗液L施加超声波振动以将清洗液L排出到半导体晶片W的超声波清洗喷嘴60配备有引入清洗液L的中继室70，振动部80 设置在继电器室70中，对中继室70中的清洗液L施加超声波振动，设置在与振动部80相反的位置设置的锥形喷嘴91，以将清洗液L排出并设置在中继室侧 70，其内径逐渐变窄，喷嘴体90设置成与带嘴91连续并具有内径恒定的延伸喷嘴92。版权所有（C）2004，JPO

9. 发明专利

JP2003004644A Method for evaluating surface, surface treatment method and its apparatus 审中-公开
标题翻译：评价表面，表面处理方法及其装置的方法
公开(公告)号：JP2003004644A
公开(公告)日：2003-01-08
申请号：JP2001184782
申请日：2001-06-19
申请人： Toshiba Corp , 株式会社東芝
发明人： FUJITA HIROSHI , INO TAKAO
IPC分类号： G01N21/88 , B08B3/02 , G02F1/13 , H01L21/306
摘要： PROBLEM TO BE SOLVED: To provide a surface evaluation method and a surface treatment apparatus which can always optimize a surface treatment to a body to be treated by detecting a change of a surface state of the body, transmitting the signal and controlling the treatment by the signal.
SOLUTION: Images from the same point of a specific position at a surface of the object 1 to be treated which is illuminated by a light source 12 are taken by an imaging means 13. A pixel number of the taken image is sorted by a preliminarily set pixel number level. The treatment is controlled by the sorting result.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种表面评价方法和表面处理装置，其可以通过检测身体的表面状态的变化来总是优化对待处理的身体的表面处理，发送信号并控制治疗信号。解决方案：通过成像装置13拍摄来自被光源12照射的被处理物体1的表面上的特定位置的相同点的图像。通过预先设定的拍摄图像的像素数量像素数级。治疗由分选结果控制。

10. 发明专利

JP2002209830A ENDOSCOPE AND MICROSCOPIC PROBE 失效
公开(公告)号：JP2002209830A
公开(公告)日：2002-07-30
申请号：JP2001008129
申请日：2001-01-16
申请人： TOSHIBA CORP
发明人： FUJITA HIROSHI
IPC分类号： G02B23/26 , A61B1/00
摘要： PROBLEM TO BE SOLVED: To provide a microscopic probe which is usable simultaneously with an endoscope and permits macroobservation by good illuminance and good focusing position and to provide the endoscope which is usable simultaneously with the microscopic probe. SOLUTION: The microscopic probe 1 has a high-refractive index member 2 at its distal end and illuminates a concern site by incidence of illumination light on this high-refractive index member 2 from outside. The microscopic probe comprises an objective lens system 3, a solid-state imaging device 10, and the like, and the focusing position of the objective lens system 3 is at the end face of the high-refractive index member 2. The endoscope 25 is provided with a forceps port 23 and the microscopic probe 1 is inserted into this forceps port 23 and is freely longitudinally movably manipulated. The operation of the microscopic probe 1 can be observed while the condition in the celom is observed imagewise and the observation of the enlarged image by the microscopic probe 1 in the prescribed position is made possible.

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