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    • 5. 发明授权
    • Molding material transfer method and substrate structure
    • 成型材料转移方法和基材结构
    • US07530305B2
    • 2009-05-12
    • US11174459
    • 2005-07-06
    • Osamu ToyodaKazunori InoueAkira Tokai
    • Osamu ToyodaKazunori InoueAkira Tokai
    • B41M1/10
    • B41M1/10B41M3/006
    • The present invention provides a new and highly reliable substrate manufacturing technology for manufacturing a substrate with a protrusion pattern, which can decrease structural defects caused by involving bubbles when the protrusion pattern is formed, can improve the reliability of the product and the yield of the product, does not require off-line steps such as vacuum deaeration, and therefore improves the production efficiency and simplifies the steps. According to the present invention, a molding material paste is filled into the concave portions of an intaglio plate for filling, an intaglio plate for transfer on which a specific groove pattern is formed is partially contacted with the intaglio plate for filling, the molding material is filled into the grooves of the intaglio plate for transfer, then the molding material is transferred from the intaglio plate for transfer to a substrate as a protrusion pattern.
    • 本发明提供了一种用于制造具有突起图案的基板的新的高度可靠的基板制造技术,其可以在形成突起图案时减少由气泡引起的结构缺陷,可以提高产品的可靠性和产品的产量 ,不需要真空脱气等离线工序,因此提高了生产效率,简化了工序。 根据本发明,将成型材料浆料填充到用于填充的凹版的凹部中,形成有特定凹槽图案的转印用凹版板与用于填充的凹版板部分接触,成型材料为 填充到用于转印的凹版印版的凹槽中,然后将成型材料从凹版印刷转印到基板作为突起图案。