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1. 发明授权

US06402843B1 Non-contact workpiece holder 失效
标题翻译：非接触式工件支架
公开(公告)号：US06402843B1
公开(公告)日：2002-06-11
申请号：US09456135
申请日：1999-12-07
申请人： Oleg Siniaguine , Sergey Savastiouk , Alex Berger , Igor Bagriy
发明人： Oleg Siniaguine , Sergey Savastiouk , Alex Berger , Igor Bagriy
IPC分类号： C23C1600
CPC分类号： H01L21/68735 , B25B11/005 , B65G47/911 , H01L21/6838
摘要： The present invention relates to a non-contact holder for substantially planar workpieces, particularly suited for holding thin workpieces without substantial distortion. The present invention includes a cylindrical chuck having a gas inlet orifice positioned at an oblique. The introduction of pressurized gas creates a vortex and vacuum attraction holding a wafer in close proximity to the chuck while the gas exiting from the chuck prevents contact between wafer and chuck. Small diameter chucks located in close proximity help the present invention avoid distortion when processing very thin workpieces. The gas exiting from the chuck of the present invention exits preferentially in a certain angular direction. Chucks are arranged on the wafer holder such that exiting gas is preferentially directed radially towards the periphery of the holder and that exiting gas is directed between adjacent chucks, not directly at another nearby chuck. Chucks on the periphery of the holder are positioned have the gas exiting therefrom towards the periphery of the holder and overlapping the gas flow from immediately adjacent chucks. Chucks on the periphery of the holder are located as close together as feasible. The combination of overlapping gas flow and close proximity creates a gas shield on the boundary of the wafer holder.
摘要翻译：本发明涉及一种用于基本上平面的工件的非接触保持器，特别适用于保持薄的工件而没有实质的变形。本发明包括具有位于倾斜处的气体入口孔的圆柱形卡盘。加压气体的引入产生涡流和真空吸引，将晶片保持在靠近卡盘的位置，而从卡盘排出的气体防止晶片和卡盘之间的接触。紧邻的小直径卡盘有助于本发明在加工非常薄的工件时避免扭曲。从本发明的卡盘排出的气体优先在一定的角度方向上离开。卡盘布置在晶片保持器上，使得离开的气体优选地朝向保持器的周边径向引导，并且排出气体被引导在相邻卡盘之间，而不是直接在另一个附近卡盘处。定位在保持器周边的卡盘具有从其朝向保持器的周边离开的气体，并与来自紧邻的卡盘的气流重叠。夹持器外围的夹头尽可能靠近在一起。重叠气流和近距离的组合在晶片保持器的边界上形成气体屏蔽。

2. 发明授权

US06261375B1 Plasma processing methods and apparatus 有权
标题翻译：等离子体处理方法和装置
公开(公告)号：US06261375B1
公开(公告)日：2001-07-17
申请号：US09617211
申请日：2000-07-17
申请人： Oleg Siniaguine , Igor Bagriy
发明人： Oleg Siniaguine , Igor Bagriy
IPC分类号： C23C1600
CPC分类号： H01J37/32752 , H01L21/68
摘要： To move an article in and out of plasma during plasma processing, the article is rotated by a first drive around a first axis, and the first drive is itself rotated by a second drive, so that the article enters the plasma at different angles for different positions of the first axis. The plasma cross-section at the level at which the plasma contacts the article is such that those points on the article that move at a greater linear velocity (due to being farther from the first axis) move longer distances through the plasma. As a result, the plasma processing time becomes more uniform for different points on the article surface. The direction of rotation of the first and/or second drive changes during processing to improve processing uniformity. The article is allowed to be processed with the plasma only during one-half of each revolution of the second drive. In the other half of each revolution, the processing is substantially prevented by increasing the second drive velocity as the article is carried through the plasma.
摘要翻译：为了在等离子体处理期间将物品移入和移出等离子体，物品通过围绕第一轴线的第一驱动器旋转，并且第一驱动器本身由第二驱动器旋转，使得物品以不同的角度进入等离子体以用于不同的第一轴的位置。在等离子体接触物品的水平处的等离子体横截面使得制品上以更大的线速度（由于离第一轴越远）移动的那些点移动通过等离子体的较长距离。结果，物品表面上的不同点的等离子体处理时间变得更加均匀。第一和/或第二驱动器的旋转方向在处理期间改变以提高加工均匀性。仅在第二驱动器的每转一半的时间内，允许用等离子体处理该物品。在每次旋转的另一半中，通过在制品被传送通过等离子体时增加第二驱动速度，基本上防止了处理。

3. 发明授权

US06287976B1 Plasma processing methods and apparatus 有权
公开(公告)号：US06287976B1
公开(公告)日：2001-09-11
申请号：US09315122
申请日：1999-05-19
申请人： Oleg Siniaguine , Igor Bagriy
发明人： Oleg Siniaguine , Igor Bagriy
IPC分类号： H01L21302
CPC分类号： H01J37/32752 , H01L21/68
摘要： To move an article in and out of plasma during plasma processing, the article is rotated by a first drive around a first axis, and the first drive is itself rotated by a second drive, so that the article enters the plasma at different angles for different positions of the first axis. The plasma cross-section at the level at which the plasma contacts the article is such that those points on the article that move at a greater linear velocity (due to being farther from the first axis) move longer distances through the plasma. As a result, the plasma processing time becomes more uniform for different points on the article surface. The direction of rotation of the first and/or second drive changes during processing to improve processing uniformity. The article is allowed to be processed with the plasma only during one-half of each revolution of the second drive. In the other half of each revolution, the processing is substantially prevented by increasing the second drive velocity as the article is carried through the plasma.

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