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    • 2. 发明专利
    • CHIP FOR BLOOD TEST
    • JPH08294639A
    • 1996-11-12
    • JP10431195
    • 1995-04-27
    • NITTO DENKO CORPOTAX CO LTD
    • OKADA HIDEYUKISANO KENJISOEDA YOSHIKAZUOSHIMA ISAOSENDA SHUJIMORI KENJIROOKURA TADAHIROAOKI KAZUO
    • G01N33/52B01L3/00
    • PURPOSE: To surely feed blood from an injection port into a measuring section, and bring the blood into contact with air easily by incorporating a porous material at least into the measuring section in a device in which a blood injection port, a blood flow path and the measuring section are set, and the blood can reach the measuring section by capillarity due to the own action of the set constitution or the incorporation of the porous material. CONSTITUTION: This blood test chips T is formed by overlapping oblong polymer films 1 and 2 each other through a polymer film for a spacer along both ends in parallel with in the longitudinal direction, and contact sections are bonded together. A blood injection port 5, a blood flow path 6 and a measuring section 7 are formed on the blood test chip T, and the measuring section 7 is constituted of a reagent site A and an air vent 8 for feeding air into the reagent site. A porous material 9 is filled in the measuring section 7 and the blood flow path 6. The reagent is brought into contact with the porous material 9 on the reagent site A formed on the polymer film 2 in the measuring section 7, and the blood injection port 5 is communicated with the measuring section 7 via the blood flow path 6.
    • 3. 发明专利
    • Heat-conduction member and electronic device using the same
    • 导热部件和使用该导热部件的电子器件
    • JP2000077872A
    • 2000-03-14
    • JP24236398
    • 1998-08-27
    • Nitto Denko Corp日東電工株式会社
    • OURA MASAHIROOSHIMA TOSHIYUKIOSHIMA ISAOMATSUOKA NAOKIYOSHIKAWA TAKAOARIMOTO MASAHIKO
    • H05K7/20
    • PROBLEM TO BE SOLVED: To provide a heat-conduction member which can be applied even to an electronic device wherein the position relationship between a heating electronic part and a heat-dissipation member is complicated by, in the design for an electronic device, raising the freeness in position for setting the heat- dissipation member.
      SOLUTION: A heat-insulating layer 12 of formable resin, etc., is provided on both surfaces, side surface, and end surface so that a sheet-like heat- conductive base material 11 such as a copper or aluminum foil is covered. A part of the heat-insulating layer 12 is cut out, where a joint part 13 which is thermally contacted to an electronic device where the heat-conductive base material 11 is exposed or a heat-dissipation member is provided. Further, a heat-conductive joint layer 14 formed of a heat-conductive adhesive or solder, etc., is provided at the joint part 13, providing a heat-conduction member 10.
      COPYRIGHT: (C)2000,JPO
    • 要解决的问题:为了提供一种可以应用于电子设备的导热构件,其中,在电子设备的设计中,通过在电子设备的设计中使加热电子部件和散热构件之间的位置关系变得复杂, 用于设置散热构件的位置的打浆度。 解决方案:在两个表面,侧表面和端表面上设置可成形树脂等的绝热层12,以覆盖诸如铜或铝箔的片状导热基材11。 切除绝热层12的一部分,其中与设置有导热基材11的电子设备热接触的接合部13或散热构件。 此外,在接合部13处设置由导热性粘合剂或焊料等形成的导热性接合层14,从而形成导热部件10。