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1. 发明申请

WO2004032249A2 OPTOELECTRONIC COMPONENT AND A MODULE BASED THEREON 审中-公开
标题翻译：光电子器件和模块模块
公开(公告)号：WO2004032249A2
公开(公告)日：2004-04-15
申请号：PCT/DE0303240
申请日：2003-09-29
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , SIEMENS AG , BOGNER GEORG , KROMOTIS PATRICK , MAYER RALF , NOLL HEINRICH , WINTER MATTHIAS
发明人： BOGNER GEORG , KROMOTIS PATRICK , MAYER RALF , NOLL HEINRICH , WINTER MATTHIAS
IPC分类号： H01L33/48 , H01L33/64 , H01L33/00 , H01L31/0203
CPC分类号： H01L33/64 , H01L33/486 , H01L2224/48091 , H01L2224/48465 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an optoelectronic component (1) comprising a semiconducting assembly (4) which emits and receives electromagnetic radiation and is arranged on a support (22) connecting a thermocunductor to a heat sink (12). The inventive optoelectronic component also comprises external electrical connections (9) which are connected to the semiconducting assembly (4) and disposed in an electrically insulated manner on the heat sink (12) at a distance from the support (22). Said invention makes it possible to produce an optimised component for evacuating waste heat and light emission and providing an electrical contact and components density in modules.
摘要翻译：提出了具有光电子器件（1）的电磁辐射发射和/或在载体上的接收半导体装置（4）（22）被布置，所述Kühlkör每次是导热地连接到一个连接（12），和外部电布置与半导体器件（4）连接的端子（9），其中外部电连接（9）在与载体（22）隔开的散热器（12）上电隔离。这导致了关于损耗散热和光发射以及模块中的电接触和封装密度的优化组件。

2. 发明申请

WO2004032235A2 DEVICE FOR PRODUCING A BUNDLED LIGHT FLUX 审中-公开
标题翻译：装置用于生成捆绑光芒流转
公开(公告)号：WO2004032235A2
公开(公告)日：2004-04-15
申请号：PCT/DE0302891
申请日：2003-09-01
申请人： SIEMENS AG , OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , BREINICH HERBERT , LUDEWIG BERND , MAYER RALF , NOLL HEINRICH , SORG JOERG ERICH
发明人： BOGNER GEORG , BREINICH HERBERT , LUDEWIG BERND , MAYER RALF , NOLL HEINRICH , SORG JOERG ERICH
IPC分类号： H01L25/075 , H01L33/60
CPC分类号： G02F1/133603 , G02F1/133605 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2224/48472 , H01L2924/00
摘要： The invention relates to a device for producing a bundled light flux. According to the invention, a light source consisting of a light emitting diode matrix (1, 2, 3) is provided, an optical device for bundling and scattering the light produced by the light-emitting diodes is arranged between the light source and a light outlet (9, 18), the device for bundling and scattering comprises a latticed reflector (5) which respectively forms a light channel for each matrix point, the walls (6) of said light channel being reflective, and the end of each light channel, facing the light source (1, 2, 3), contains a convergent lens (4).
摘要翻译：在用于产生准直光束的装置被提供，其由发光二极管矩阵的光源（1，2，3），它提供的是，光源和光出射开口（9，18），用于聚焦的光学装置之间，由发光二极管产生的光的散射布置成用于聚焦和散射，该装置包括一格栅形（5）反射器，其形成光信道的每一个矩阵点的，所述壁（6）是反射性的并且在所述光源（1， 2，面对光通道的每个端部3），会聚透镜（4）。

3. 发明申请

WO2006012842A3 OPTOELECTRONIC COMPONENT THAT EMITS ELECTROMAGNETIC RADIATION AND ILLUMINATION MODULE 审中-公开
标题翻译：电磁辐射发射的光电子器件和灯模块
公开(公告)号：WO2006012842A3
公开(公告)日：2006-05-11
申请号：PCT/DE2005001283
申请日：2005-07-21
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , ENGL MORITZ , GROETSCH STEFAN , KROMOTIS PATRICK
发明人： BOGNER GEORG , ENGL MORITZ , GROETSCH STEFAN , KROMOTIS PATRICK
IPC分类号： H01L25/075 , H01L33/60
CPC分类号： H01L33/60 , F21S41/143 , F21Y2115/10 , H01L25/0753 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an optoelectronic component that emits electromagnetic radiation. Said component comprises a housing body with a cavity that is configured as a trench, a plurality of semiconductor chips being arranged in a line in the cavity. Two neighbouring semiconductor chips are spaced at a distance from one another, which is less than or equal to one and a half lateral edge lengths of the semiconductor chip and greater than or equal to 0 µm. The invention also relates to an illumination module comprising a component of this type.
摘要翻译：本发明涉及一种电磁辐射发射的光电子器件，其包括具有空腔的壳体主体，其特征在于，所述空腔被等严重和多个半导体芯片被布置在所述腔中的线性排列构成。两个相邻的半导体芯片彼此具有其是小于或等于1，并且半导体芯片的一半侧向边缘长度和大于或等于0微米的间距。此外，光模块与这样的装置指定。

4. 发明申请

WO0213231A3 RADIATION SOURCE AND METHOD FOR PRODUCING A LENS MOULD 审中-公开
标题翻译：辐射源和生产镜片表格的方法
公开(公告)号：WO0213231A3
公开(公告)日：2002-06-20
申请号：PCT/DE0102874
申请日：2001-07-30
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , GRAMANN WOLFGANG , KROMOTIS PATRICK , MARCHL WERNER , SPAETH WERNER , WAITL GUENTER
发明人： BOGNER GEORG , GRAMANN WOLFGANG , KROMOTIS PATRICK , MARCHL WERNER , SPAETH WERNER , WAITL GUENTER
IPC分类号： B29C39/02 , B29D11/00 , B29L11/00 , F21V5/04 , G02B3/00 , H01L25/075 , H01L33/00 , F21V5/00
CPC分类号： G02B3/0031 , B29D11/00278 , B29D11/00365 , F21V5/04 , F21Y2115/10 , G02B3/0056 , H01L25/0753 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01019 , H01L2924/12041 , H01L2924/1815 , H01L2924/19041 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a radiation source, which has an assembly of semiconductor chips that are positioned beneath a field of micro-lenses (8) arranged in a hexagonal lattice structure. The radiation source is characterised by a high radiation output and a high radiation density.
摘要翻译：辐射源包括布置在以六边形格子结构布置的微透镜（8）的场下方的半导体芯片阵列。辐射源具有高辐射功率和辐射率的特点。

5. 发明申请

WO2004051757A3 OPTOELECTRONIC COMPONENT 审中-公开
标题翻译：光电子器件
公开(公告)号：WO2004051757A3
公开(公告)日：2004-12-23
申请号：PCT/DE0303923
申请日：2003-11-27
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , ARNDT KARLHEINZ , BOGNER GEORG , WAITL GUENTER , WINTER MATTHIAS
发明人： ARNDT KARLHEINZ , BOGNER GEORG , WAITL GUENTER , WINTER MATTHIAS
IPC分类号： H01L33/48 , H01L33/62 , H01L33/00 , H01L31/0203
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48247 , H01L2224/48465 , H01L2924/00
摘要： The invention relates to an optoelectronic component containing an optoelectronic chip (1), a chip carrier (2) with a central region (3), on which the chip is fixed and terminals (41, 42, 43, 44), which run from the central region of the chip carrier (2) to the exterior of said chip. The chip and sections of the chip carrier are surrounded by a body (5). The respective projection of the body, in addition to that of the longitudinal axes of the terminals on the contact plane between the chip and the chip carrier are essentially point-symmetrical in relation to the central point of the chip. The invention also relates to an assembly comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced malfunctions of the components is reduced.
摘要翻译：本发明涉及一种包括光电芯片（1），一个芯片载体的光电元件（2），其具有一个中心区域（3），在其上的芯片被固定，并用连接件（41，42，43，44）从中心区点对称-从向外的芯片载体（2），其中由主体（5）的芯片和芯片载体的部分是有包膜的延伸，并且其中所述主体的所述突起和在芯片和芯片载体之间的接触面的连接器的纵向轴线各自基本上到芯片的中心。此外，本发明涉及具有该部件的布置。由于设备的对称设计，这具有减小设备的热机械故障的风险的优点。

6. 发明申请

WO2004097946A3 LIGHT SOURCE 审中-公开
标题翻译：光源
公开(公告)号：WO2004097946A3
公开(公告)日：2005-08-25
申请号：PCT/DE2004000800
申请日：2004-04-15
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , GROETSCH STEFAN
发明人： BOGNER GEORG , GROETSCH STEFAN
IPC分类号： H01L33/58 , G02B27/14 , G02F1/13
CPC分类号： H01L33/58 , G03B21/2033 , G03B21/208 , H04N9/3152 , H04N9/3164
摘要： The invention relates to a light source, particularly a projection light source for a projection system, comprising a multitude of semiconductor chips and at least two, preferably three different electromagnetic radiation-emitting types of chips with different emission spectra. Each semiconductor chip has a chip extraction surface via which the radiation is extracted. The light source also a multitude of primary optics elements, and a primary optics element is assigned to each semiconductor chip. Each primary optics element has a light input and a light output and reduces the divergence of at least one portion of the radiation emitted by the semiconductor chip during the operation thereof. The semiconductor chips are arranged with the primary optics elements in at least two interspaced groups so that the groups emit separate cones of light when the semiconductor chips are in operation. The separate cones of lights of the groups are superimposed by means of secondary optics to form a combined cone of light.
摘要翻译：本发明涉及一种光源，特别是投影光源的投影系统具有至少两个，优选三个多个半导体芯片，并且电磁辐射发射具有不同发射光谱，其中，每个半导体芯片具有芯片输出芯片位置，被辐射耦合输出。此外，所述光源中的各种主光学元件，其中每个半导体芯片被分配一个主光学元件，其每一个具有光输入端和光输出，并通过它们的辐射的操作期间从半导体芯片发射的光的至少一部分的发散减小。半导体芯片被布置成在至少两个局部地分开的组的主光学元件，使得该组中的半导体芯片的工作期间发射单独的光锥。组的单独的光锥被叠加由二次光学器件的装置，以形成光的一个共同的光束。

7. 发明申请

WO2008083672A3 HOUSING FOR AN OPTOELECTRONIC COMPONENT AND ARRANGEMENT OF AN OPTOELECTRONIC COMPONENT IN A HOUSING 审中-公开
标题翻译：住房在外壳的光电子器件和装置光电子器件
公开(公告)号：WO2008083672A3
公开(公告)日：2008-12-18
申请号：PCT/DE2008000029
申请日：2008-01-09
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , GRUBER STEFAN , ZEILER THOMAS , KIRSCH MARKUS
发明人： BOGNER GEORG , GRUBER STEFAN , ZEILER THOMAS , KIRSCH MARKUS
IPC分类号： H01L25/16 , H01L33/48 , H01L33/60
CPC分类号： H01L33/483 , H01L25/0753 , H01L25/167 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2924/00014
摘要： A plastic housing (2) is disposed on a support element (1) and comprises a recess (3) in which an optoelectronic component (12) is arranged. The recess (3) has an opening to the exterior (9) on the side facing away from the support element (1), which can be provided with a transparent cover. One or several structures (5, 6) can be provided at the plastic housing (2) in order to align the cover and/or the optical components relative to the optoelectronic component.
摘要翻译：塑料外壳（2）布置在承载元件（1）上，并且设置有凹部（3），在该光电器件（12）布置。在载体元件的从所述凹部（3）背向（1）侧具有到外部，其可以设置有透明盖的开口（9）。一个或多个结构（5,6）可被设置在塑料外壳（2）上以对准相对于所述光电子器件的覆盖物和/或光学部件。

8. 发明申请

WO2006128416A3 HOUSING BODY AND METHOD FOR PRODUCTION THEREOF 审中-公开
标题翻译：住房和工艺及其
公开(公告)号：WO2006128416A3
公开(公告)日：2007-08-09
申请号：PCT/DE2006000778
申请日：2006-05-05
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , ARNDT KARLHEINZ
发明人： BOGNER GEORG , ARNDT KARLHEINZ
IPC分类号： H01L23/498 , H01L33/48 , H01L33/62
CPC分类号： H01L33/62 , H01L23/49805 , H01L24/48 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2924/00014 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/12044 , H01L2924/181 , H01L2924/3025 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： The invention relates to a housing body (1), comprising an upper side (2), a lower side (22), opposite the upper side (2) and lateral faces connecting the upper side (2) and the lower side (22) provided as assembly faces (19), whereby the housing body (1) comprises a number of layers (8) containing a ceramic material and a principal extension direction for the layers (23, 24, 25) runs perpendicular to the assembly faces (19). The invention further relates to a method for production of a housing body (1).
摘要翻译：本发明描述了一个壳体（1），其具有顶部（2），与所述上侧（2）的底部（22）相反的一个并具有一个顶面（2）和所述侧面连接作为安装面的底部（22）（19）设置，其中，所述外壳体（1），具有多个（8）含有陶瓷材料层，并且所述层（23，24，25）的主延伸方向横向于所述安装表面（19）。此外，被指定用于制造外壳体（1）的方法。

9. 发明申请

WO2004109813A3 LIGHT-EMITTING DIODE 审中-公开
标题翻译：发光二极管
公开(公告)号：WO2004109813A3
公开(公告)日：2005-04-21
申请号：PCT/DE2004000829
申请日：2004-04-21
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , BRAUNE BERT , SCHMID JOSEF
发明人： BOGNER GEORG , BRAUNE BERT , SCHMID JOSEF
IPC分类号： H01L33/56 , H01L33/58 , H01L33/64 , H01L33/00
CPC分类号： H01L33/56 , H01L33/58 , H01L33/641 , H01L2224/48091 , H01L2924/00014
摘要： The invention relates to a light-emitting diode which comprises, embedded in a casting compound (3) and fastened on a support (1), a radiation-emitting semiconductor chip (4) and a lens body (2), whereby the support (1) contains silicon or a ceramic material and the lens body (2) contains a glass. The casting compound (3) is preferably enclosed by the support (1) and the lens body (2) and preferably does not contain any ultraviolet radiation-sensitive polymers.
摘要翻译：一种发光二极管包括：在一个密封的化合物（3）嵌入在承载体（1）固定于发射辐射的半导体芯片（4），和一个透镜体（2），其中，所述承载体（1）的硅或陶瓷和透镜体（2）是玻璃包含的内容。密封化合物（3）优选地通过在支撑体（1）和所述透镜体（2）封闭，并且有利地不包含聚合物，其是对紫外辐射敏感。

10. 发明申请

WO2004004017A2 SURFACE-MOUNTABLE MINIATURE LIGHT-EMITTING DIODE AND/OR PHOTODIODE AND METHOD FOR THE PRODUCTION THEREOF 审中-公开
标题翻译：表层嵌微型发光和/或光电二极管和方法及其
公开(公告)号：WO2004004017A2
公开(公告)日：2004-01-08
申请号：PCT/DE0301831
申请日：2003-06-04
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , SORG JOERG , BOGNER GEORG , WAITL GUENTER , BRUNNER REINHOLD
发明人： SORG JOERG , BOGNER GEORG , WAITL GUENTER , BRUNNER REINHOLD
IPC分类号： H01L31/02 , H01L31/0203 , H01L33/48 , H01L33/62 , H05K1/02 , H05K3/34 , H01L33/00
CPC分类号： H01L33/62 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/12041 , H05K1/0203 , H05K3/3442 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a surface-mountable miniature light-emitting diode, comprising a chip housing, which has a lead frame (16) and a semiconductor chip (22). This semiconductor chip is situated on the lead frame (16) while in electrical contact therewith and contains an active radiation-emitting region. According to the invention, the lead frame (16) is formed by a flexible layer (12, 14) consisting of multiple layers.
摘要翻译：在与具有引线框（16）和一个布置在引线框（16）上的芯片封装的表面安装的微型发光二极管和与电接触半导体芯片（22），其含有的活性，发射辐射的区域，根据本发明，引线框架这个属性（16）由柔性多层片材（12，14）形成。

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