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1. 发明申请

WO2009036731A3 RADIATION-EMITTING COMPONENT 审中-公开
标题翻译：辐射分量
公开(公告)号：WO2009036731A3
公开(公告)日：2009-05-28
申请号：PCT/DE2008001448
申请日：2008-08-28
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , GROETSCH STEFAN , MARFELD JAN , SORG JOERG ERICH , ENGL MORITZ , KOEHLER STEFFEN
发明人： GROETSCH STEFAN , MARFELD JAN , SORG JOERG ERICH , ENGL MORITZ , KOEHLER STEFFEN
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/44 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a radiation-emitting component (8), which comprises a semiconductor layer stack (10) having an active region (12), which is configured for emitting electromagnetic radiation (R), and at least one surface (14, 15, 16, 17) of the semiconductor layer stack (10) or an optical element (18, 20), which is configured for transmitting the electromagnetic radiation (R), wherein the surface (14, 15, 16, 17) has a normal vector (N), wherein on the at least one surface (14, 15, 16, 17) of the semiconductor layer stack (10) or of the optical element (18, 20), the electromagnetic radiation (R) penetrating said surface, an anti-reflection layer (30) is disposed and configured such that it has minimum reflection for a predetermined wavelength at an observation angle (alpha) relative to the normal vector (N) of the surface (14, 15, 16, 17), at which angle the increase in a zonal light flux of the electromagnetic radiation (R) approximately has a maximum.
摘要翻译：发射辐射的装置（8），其具有具有有源区（12），其被设计用于将电磁辐射（R）的发光的半导体层堆叠（10），和半导体层堆叠中的至少一个表面（14，15，16，17）（10）或形成于电磁辐射（R）的传输，所述光学元件（18，20），其中，所述表面（14，15，16，17）包括一法线向量（N），其中至少一个表面（14，15，16上，17）在半导体层堆叠（10）或通过该电磁辐射（R）通过，低于最小反射布置的防反射层（30），并且形成为使得它们对于给定的波长的光元件（18，20）的一个所述表面（14，15，16，17）相关的视场角（阿尔法）的法线向量（N），其中，所述电磁辐射（R）的带状光束的增加大约是有一个最大值。

2. 发明申请

WO2012034812A2 RADIATION EMITTING COMPONENT 审中-公开
标题翻译：辐射分量
公开(公告)号：WO2012034812A2
公开(公告)日：2012-03-22
申请号：PCT/EP2011064154
申请日：2011-08-17
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , SORG JOERG ERICH , MUELLER RUEDIGER , SCHWARZ RAIMUND
发明人： SORG JOERG ERICH , MUELLER RUEDIGER , SCHWARZ RAIMUND
IPC分类号： G06T15/00
CPC分类号： H01L33/58 , H01L33/486 , H01L33/56 , H01L2224/32245
摘要： The invention relates to a radiation-emitting component comprising a semiconductor body (1), which emits electromagnetic radiation from a radiation outlet surface (2) when in operation. The semiconductor body is arranged in a component housing (5) having a recess (4). The component further comprises an optical element (8), which is connected to the component housing (5) in a mechanically stable manner, by means of a joining layer (9), wherein the elasticity modulus of the joining layer (9) is lower than or equal to 30 MPA.
摘要翻译：它是包括一个半导体主体（1），其辐射出射表面（2），指定的操作过程中发射电磁辐射的发射辐射的器件。半导体本体是在装置壳体（5）具有一凹槽（4）被布置。此外，该装置包括其上设置有粘结层（9）的光学元件（8）是机械稳定地连接到组件壳体（5），其中所述粘结层（9）具有弹性小于或等于30MPa的弹性模量。

3. 发明申请

WO2004027882A3 LEADFRAME-BASED HOUSING, SURFACE-MOUNTED OPTOELECTRONIC COMPONENT, AND PRODUCTION METHOD 审中-公开
标题翻译：引线框架基础的住房，表面安装的光电子器件及其制造方法
公开(公告)号：WO2004027882A3
公开(公告)日：2004-07-29
申请号：PCT/DE0302953
申请日：2003-09-05
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , SORG JOERG ERICH
发明人： SORG JOERG ERICH
IPC分类号： H01L31/02 , H01L33/48 , H01L33/62 , H01L33/00 , H01L31/0203
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/01004 , H01L2924/0102 , H01L2924/01078 , H01L2924/12041 , H01L2924/00014
摘要： The invention relates to a leadframe-based housing for a surface-mounted component, particularly a radiation-emitting component. Said leadframe-based housing comprises electrical connector strips and at least one chip assembly area. One of the inventive connector strips is provided with a spray-on window allowing a leadframe-based housing having a reduced thickness to be produced in an injection molding process. Also disclosed is a method for producing such housings.
摘要翻译：本发明描述了一种用于表面的基于引线框的外壳安装部件，尤其是发射辐射的器件，其特征在于，具有根据本发明的连接片被提供一个喷孔，其制造的一个电连接带和至少一个芯片安装表面，以及其中所述基于引线框的壳体允许具有在注射模制工艺较小厚度的基于引线框的壳体。此外，提供制造这种壳体的方法。

4. 发明申请

WO2010133393A3 OPTICAL RECORDING DEVICE FOR RECORDING AN IMAGE 审中-公开
标题翻译：光学记录仪记录用图像
公开(公告)号：WO2010133393A3
公开(公告)日：2011-03-03
申请号：PCT/EP2010054373
申请日：2010-03-31
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , SORG JOERG ERICH
发明人： SORG JOERG ERICH
IPC分类号： H04N5/225 , H04N1/028 , H04N5/235
CPC分类号： H04N1/02815 , H04N5/2256 , H04N5/2354 , H04N5/33
摘要： The invention describes an optical recording device (1) for recording an image (9), comprising - an image sensor (2) used for detecting electromagnetic radiation from the infrared radiation and visible light spectral regions, and a first flash unit (3) suited to emit electromagnetic radiation from the infrared radiation spectral region during operation, wherein the first flash unit (3) comprises at least one light emitting diode chip (31) suited to emit electromagnetic radiation from the infrared radiation spectral region during operation, wherein the maximum intensity of the electromagnetic radiation emitted by the light emitting diode chip (31) is in the infrared radiation spectral region.
摘要翻译：本发明提供一种光记录装置（1），用于记录的图像（9），包括： - 图像传感器（2），其适合于从红外辐射和可见光的光谱范围的检测的电磁辐射，以及第一选通光（3），是适合于操作，其中，所述第一选通脉冲光（3）包括至少一个LED芯片（31），其适用于在操作过程中的红外辐射的光谱范围发射的电磁辐射在从红外线辐射的光谱范围内发射的电磁辐射，具有最大在红外辐射的光谱范围发射的电磁辐射的发光二极管芯片（31）的强度是。

5. 发明申请

WO2004032235A2 DEVICE FOR PRODUCING A BUNDLED LIGHT FLUX 审中-公开
标题翻译：装置用于生成捆绑光芒流转
公开(公告)号：WO2004032235A2
公开(公告)日：2004-04-15
申请号：PCT/DE0302891
申请日：2003-09-01
申请人： SIEMENS AG , OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , BREINICH HERBERT , LUDEWIG BERND , MAYER RALF , NOLL HEINRICH , SORG JOERG ERICH
发明人： BOGNER GEORG , BREINICH HERBERT , LUDEWIG BERND , MAYER RALF , NOLL HEINRICH , SORG JOERG ERICH
IPC分类号： H01L25/075 , H01L33/60
CPC分类号： G02F1/133603 , G02F1/133605 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2224/48472 , H01L2924/00
摘要： The invention relates to a device for producing a bundled light flux. According to the invention, a light source consisting of a light emitting diode matrix (1, 2, 3) is provided, an optical device for bundling and scattering the light produced by the light-emitting diodes is arranged between the light source and a light outlet (9, 18), the device for bundling and scattering comprises a latticed reflector (5) which respectively forms a light channel for each matrix point, the walls (6) of said light channel being reflective, and the end of each light channel, facing the light source (1, 2, 3), contains a convergent lens (4).
摘要翻译：在用于产生准直光束的装置被提供，其由发光二极管矩阵的光源（1，2，3），它提供的是，光源和光出射开口（9，18），用于聚焦的光学装置之间，由发光二极管产生的光的散射布置成用于聚焦和散射，该装置包括一格栅形（5）反射器，其形成光信道的每一个矩阵点的，所述壁（6）是反射性的并且在所述光源（1， 2，面对光通道的每个端部3），会聚透镜（4）。

6. 发明申请

WO2008040315A3 LIGHT-EMITTING DIODE ARRANGEMENT AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译： LED和用于制备这种
公开(公告)号：WO2008040315A3
公开(公告)日：2008-11-20
申请号：PCT/DE2007001733
申请日：2007-09-25
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , SORG JOERG ERICH , GRUBER STEFAN , HERRMANN SIEGFRIED , HAHN BERTHOLD
发明人： SORG JOERG ERICH , GRUBER STEFAN , HERRMANN SIEGFRIED , HAHN BERTHOLD
IPC分类号： H01L25/075 , H01L33/00 , H01L33/50 , H01L33/62
CPC分类号： H01L25/0753 , H01L24/24 , H01L24/82 , H01L33/0079 , H01L33/508 , H01L33/62 , H01L2224/24226 , H01L2224/24998 , H01L2224/48091 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01058 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/014 , H01L2924/09701 , H01L2924/12036 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side (101) and which are fixed by their rear side (102) - opposite the front side - on a first main area (201) of a common carrier (2), wherein the semiconductor chips are composed of a respective substrateless semiconductor layer stack (1) and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.
摘要翻译：本发明涉及一种具有多个半导体芯片，其被设置成从电磁辐射的其前侧（101），用于发出光的发光二极管阵列，将其相反它们在共同的支撑体的第一主表面（201）正面背面（102）（2 ）被安装，其中，所述半导体芯片（一个衬底的半导体层堆叠体1）和被固定到共同的支撑体无副载波，以及用于制造这样的发光二极管装置的方法。

7. 发明申请

WO2011023641A3 RADIATION-EMITTING DEVICE, AND METHOD FOR THE PRODUCTION OF A RADIATION-EMITTING DEVICE 审中-公开
标题翻译：辐射装置和方法用于产生辐射发射装置
公开(公告)号：WO2011023641A3
公开(公告)日：2011-04-28
申请号：PCT/EP2010062189
申请日：2010-08-20
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , SORG JOERG ERICH
发明人： SORG JOERG ERICH
IPC分类号： H01L33/56 , C09K11/02
CPC分类号： H01L33/56 , H01L2224/48091 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： Radiation-emitting device comprising a lead frame (1), a radiation source (3) that is arranged on the lead frame, an electrically conducting contact (2) that connects the lead frame in an electrically conducting manner to the radiation source, and a molding material (4) that is arranged on the surface of the radiation source. The molding material comprises an additive (5) that can absorb H+ ions or neutralize H+ ions by discharging OH- ions.
摘要翻译：发射辐射的装置，其包括引线框（1），辐射源（3），其被布置在引线框架上，导电接触（2）连接所述引线框架电连接到辐射源，模制材料（4），其上表面被安置在辐射源，其中，所述封装材料包括添加剂（5），其能够H + - 接收离子，或通过递送该OH - 中和的离子。

8. 发明申请

WO2009143796A3 OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND PRINTED CIRCUIT BOARD 审中-公开
标题翻译：光电半导体器件和电路板的
公开(公告)号：WO2009143796A3
公开(公告)日：2010-03-11
申请号：PCT/DE2009000543
申请日：2009-04-20
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , JAEGER HARALD , SORG JOERG ERICH
发明人： JAEGER HARALD , SORG JOERG ERICH
IPC分类号： H01L33/00 , H01L33/48 , H05K1/03
CPC分类号： H01L33/483 , H01L2224/48091 , H01L2924/12044 , H01L2924/181 , H05K1/0366 , H05K2201/0162 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In at least one embodiment of the optoelectronic semiconductor component, said component comprises a base mount having at least two connecting points, at least one optoelectronic semiconductor chip, which is attached to the base mount and is in direct contact therewith, wherein the base mount is configured with a silicon matrix having fiber reinforcement. Due to the use of a base mount comprising a silicon matrix having fiber reinforcement, a mechanically stable and temperature- and UV-resistant semiconductor component can be implemented.
摘要翻译：在光电子半导体器件的至少一个实施例中，后者包括具有至少两个连接点，其被安装在连接载体上并与其直接接触的至少一个光电子半导体芯片，其特征在于，用硅树脂基体连接载体被设计为具有纤维增强的连接载体。通过使用连接的载体与用纤维增强的有机硅基质，可以实现机械稳定并且由此温度和耐紫外线半导体装置。

9. 发明申请

WO2006034671A3 OPTOELECTRONIC COMPONENT WITH A WIRELESS CONTACTING 审中-公开
标题翻译：与无线联络OPTO电子元件
公开(公告)号：WO2006034671A3
公开(公告)日：2006-07-13
申请号：PCT/DE2005001603
申请日：2005-09-13
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , GUENTHER EWALD KARL MICHAEL , SORG JOERG ERICH , STATH NORBERT
发明人： GUENTHER EWALD KARL MICHAEL , SORG JOERG ERICH , STATH NORBERT
IPC分类号： H01L33/50 , H01L33/52 , H01L33/54 , H01L33/62
CPC分类号： H01L33/62 , H01L24/24 , H01L24/82 , H01L33/508 , H01L33/52 , H01L33/54 , H01L2224/24051 , H01L2224/24105 , H01L2224/24226 , H01L2224/24998 , H01L2224/82007 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01049 , H01L2924/01051 , H01L2924/01058 , H01L2924/01082 , H01L2924/014 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/351 , H01L2924/00
摘要： An optoelectronic component according to the invention contains a semiconductor chip (1) and a supporting body (10), which are provided with a transparent, electrically insulating encapsulation layer (3), this encapsulation layer (3) having two cutouts (11, 12) for exposing a contact surface (6) and a connecting area (8) of the supporting body, and contains an electrically conductive layer (14) leading from the contact surface (6) while passing over a partial area of the encapsulation layer (3) and extending to the electrical connecting area (8) of the supporting body (10) in order to electrically connect the contact surface (6) and the electrical connecting area (8). The radiation emitted from the semiconductor chip (1) in a main emitting direction (13) is decoupled via the encapsulation layer (3) that advantageously contains luminescence conversion substances for converting wavelengths of the emitted radiation.
摘要翻译：根据本发明的光电子器件包括：半导体芯片（1）和被提供有一个透明的，电绝缘的封装层（3）的载体主体（10），其中所述封装层（3）包括两个凹部（11，12），以暴露的接触表面（6），并通过所述封装层（3）的部分区域（8），所述支撑体（10）被引导的电连接区域的连接部（8）的承载体，并且在所述接触表面（6）的导电层（14），彼此电连接的接触表面（6）与所述电连接区域（8）。在半导体芯片（1）的主辐射方向（13）发射的辐射通过封装层（3），其有利地含有发光转换材料所发射的辐射的波长转换耦合输出。

10. 发明专利

JP2010021570A Substrate frame, substrate frame strip, and surface-mountable light-emitting semiconductor element 有权
标题翻译：基板框架，基板框架和表面安装的发光半导体元件
公开(公告)号：JP2010021570A
公开(公告)日：2010-01-28
申请号：JP2009238937
申请日：2009-10-16
申请人： Osram Opto Semiconductors Gmbh , オスラムオプトセミコンダクターズゲゼルシャフトミットベシュレンクテルハフツングOsram Opto Semiconductors GmbH
发明人： KRAEUTER GERTRUD , SORG JOERG ERICH
IPC分类号： H01L23/12 , H01L21/44 , H01L21/48 , H01L21/56 , H01L21/68 , H01L23/31 , H01L23/495 , H01L33/52 , H01L33/62
CPC分类号： H01L21/6835 , H01L21/4846 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/3121 , H01L23/49586 , H01L24/48 , H01L24/97 , H01L33/62 , H01L2221/68345 , H01L2221/68377 , H01L2224/05599 , H01L2224/16 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48472 , H01L2224/73265 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , Y10T29/49117 , Y10T29/49171 , Y10T436/173076 , Y10T436/188 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To further reduce the size of a structure, in particular, the height of the structure by providing a substrate frame (10) including a laminate provided with a support layer having an electric insulation property and a conductive connection conductor layer. SOLUTION: The support layer having an electric insulation property has at least one contact window (7) to the connection conductor layer; at least two external electrical connection conductors (2, 3) are formed on the conductive connection conductor layer; and at least one of the connection conductors is electrically connected through the contact window (7). COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题为了进一步减小结构的尺寸，特别是通过提供一种基板框架（10）来进一步减小结构的高度，所述基板框架（10）包括具有电绝缘性和导电连接的支撑层的层压板导体层。解决方案：具有电绝缘性能的支撑层具有至少一个与连接导体层的接触窗口（7）; 至少两个外部电连接导体（2,3）形成在导电连接导体层上; 并且所述连接导体中的至少一个通过所述接触窗（7）电连接。版权所有（C）2010，JPO＆INPIT

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