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1. 发明申请

WO2014032702A1 LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING A LIGHT- EMITTING DEVICE 审中-公开
标题翻译：发光装置和制造发光装置的方法
公开(公告)号：WO2014032702A1
公开(公告)日：2014-03-06
申请号：PCT/EP2012/066698
申请日：2012-08-28
申请人： OSRAM OPTO SEMICONDUCTORS GMBH , LIM, Choo Hooi , OR, Choon-Keat , HUONG, Ling Hung , LIM, Choo Kean
发明人： LIM, Choo Hooi , OR, Choon-Keat , HUONG, Ling Hung , LIM, Choo Kean
IPC分类号： H01L33/44 , H01L33/62 , G09F9/33 , B32B17/10 , H01L33/56 , H01L25/075 , F21K99/00 , G09F13/22
CPC分类号： H01L33/62 , H01L25/0753 , H01L25/0756 , H01L33/44 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting device is describe which comprises a transparent carrier plate (1), at least two transparent conductor lines (2) on the transparent carrier plate (1), at least one light-emitting semiconductor chip (5) being arranged on the at least two transparent conductor lines (2) and being electrically connected to the at least two transparent conductor lines (2) by a transparent electrically conductive glue (4), and a parylene coating (6) covering the at least one light-emitting semiconductor chip (5) and the at least two transparent conductor lines (2). Furthermore, a method for manufacturing a light-emitting device is described.
摘要翻译：描述了一种发光器件，其包括透明载体板（1），透明载体板（1）上的至少两个透明导体线（2），至少一个发光半导体芯片（5）布置在至少两个透明导体线（2），并通过透明导电胶（4）与所述至少两个透明导体线（2）电连接，并且聚对二甲苯涂层（6）覆盖所述至少一个发光半导体芯片（5）和至少两条透明导线（2）。此外，描述了一种用于制造发光器件的方法。

2. 发明申请

WO2018149511A1 METHOD FOR PRODUCING A CARRIER FOR AN OPTOELECTRONIC COMPONENT, AND CARRIER FOR AN OPTOELECTRONIC COMPONENT 审中-公开
公开(公告)号：WO2018149511A1
公开(公告)日：2018-08-23
申请号：PCT/EP2017/053798
申请日：2017-02-20
申请人： OSRAM OPTO SEMICONDUCTORS GMBH
发明人： LIM, Choo Kean
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H05K3/007 , H05K2203/0703
摘要： The invention refers to a method for producing a carrier for an optoelectronic component, wherein a subcarrier is provided, wherein a first mask layer is deposited on the subcarrier, wherein the first mask layer has at least two mask openings extending from an upper side of the first mask layer to a bottom side of the first mask layer, wherein the first mask layer covers predetermined areas of the subcarrier and provides at least two free areas of the subcarrier in the mask openings, wherein electroconductive material is deposited in the mask openings and on the free areas of the subcarrier, wherein the first mask layer is removed providing two separate lead frame sections made of electroconductive material, wherein the two lead frame sections are arranged side by side with a free space between two side faces of the two lead frame sections, wherein mould material is formed in the free space between the two lead frame sections forming a mould material layer connecting the two side faces of the two lead frame sections, removing the subcarrier and attaining the carrier with two lead frame sections, wherein the lead frame sections are connected by a mould material layer.

3. 发明申请

WO2018134203A1 METHOD FOR PRODUCING AN OPTOELECTRONIC ELEMENT 审中-公开
公开(公告)号：WO2018134203A1
公开(公告)日：2018-07-26
申请号：PCT/EP2018/051017
申请日：2018-01-16
申请人： OSRAM OPTO SEMICONDUCTORS GMBH
发明人： CHONG, Chui Wai , LIM, Choo Kean , KOAY, Seon Tak , NG, Adelene , CHUAH, Teng Hai Ocean
IPC分类号： H01L33/00 , H01L33/48 , H01L33/58 , H01L33/50 , H01L33/60
摘要： The invention refers to a method for producing an optoelectronic element with a light emitting component (1), wherein at least above a part of a light emitting side of the light emitting component (1) a sacrificial layer (9) is arranged, wherein at least in a part of an outer surface of the sacrificial layer (9) an inverted optic structure is formed, wherein the outer surface of the sacrificial layer (9) is covered by a light transparent layer (13), wherein the inverted optic structure is transferred to an inner side of the light transparent layer (13) forming an optic structure (18), wherein the sacrificial layer (9) is removed and a gap is formed between the light emitting component (1) and the light transparent layer (13), and wherein the light transparent layer (13) comprises at the inner side thereof the optic structure (18).

4. 发明申请

WO2015055247A1 VERFAHREN ZUR HERSTELLUNG EINER VIELZAHL VON OBERFLÄCHENMONTIERBAREN TRÄGERVORRICHTUNGEN, ANORDNUNG EINER VIELZAHL VON OBERFLÄCHENMONTIERBAREN TRÄGERVORRICHTUNGEN UND OBERFLÄCHENMONTIERBARE TRÄGERVORRICHTUNG 审中-公开
标题翻译：用于生产表面的各种方法安装面的各种载流子器件的形成安装载流子器件和表面安装器件CARRIER
公开(公告)号：WO2015055247A1
公开(公告)日：2015-04-23
申请号：PCT/EP2013/071720
申请日：2013-10-17
申请人： OSRAM OPTO SEMICONDUCTORS GMBH
发明人： LIM, Choo Kean , CHANG, Chee Jia , OR, Choon Keat
IPC分类号： H01L33/48 , H01L23/488 , H01L21/48 , H01L23/00 , H05K3/00 , H05K3/34
CPC分类号： H01L23/49805 , H01L21/4846 , H01L21/4853 , H01L23/488 , H01L24/05 , H01L24/94 , H01L24/95 , H01L33/486 , H01L2924/01322 , H01L2933/0033 , H01L2924/00
摘要： Es wird ein Verfahren zur Herstellung einer Vielzahl von oberflächenmontierbaren Trägervorrichtungen angegeben. Das Verfahren umfasst insbesondere folgende Schritte: A) Bereitstellen einer Trägerplatte (10) mit einer ersten Hauptfläche (11) und einer der ersten Hauptfläche (11) gegenüberliegenden zweiten Hauptfläche (12), B) Aufbringen einer elektrischleitenden Schicht (2) auf die erste Hauptfläche (11) der Trägerplatte (10), C) Aufbringen einer Lotstoppmaske (30) auf einer der Trägerplatte (10) abgewandten Seite der elektrisch leitenden Schicht (2), wobei durch die Lotstoppmaske (30) eine Vielzahl aneinandergrenzender Bereiche (3) auf der elektrisch leitenden Schicht (2) ausgebildet wird, D) Aufbringen eines Lotmaterials (4) auf die Lotstoppmaske (30) und die elektrisch leitende Schicht (2), wobei die Lotstoppmaske (30) und die elektrisch leitende Schicht (2) zumindest stellenweise von dem Lotmaterial (4) bedeckt werden, E) Vereinzeln der Trägerplatte (10) und der elektrisch leitenden Schicht (2) entlang und durch die Lotstoppmaske (30) und das Lotmaterial (4), wobei das Lotmaterial (4) zumindest stellenweise auf der Lotstoppmaske (30) verbleibt.
摘要翻译：本发明提供一种制造多个表面安装器件的载体的方法。该方法包括特别是以下步骤：A）提供一个支撑板（10），具有第一主表面（11）和所述第一主表面中的一个（11）相对的第二主表面（12），B）在所述第一主表面上施加导电（2）层（11）在支撑板（10），C）将Lotstoppmaske（30）（在支撑板10中的一个）的面向从导电层（2），其中（由Lotstoppmaske远侧（30）包括多个在所述连续区域3）的被设计为施加钎焊材料的导电层（2），D）（4）（在Lotstoppmaske 30）和导电层（2），其中，所述Lotstoppmaske（30）和导电层（2）至少在从地方钎焊材料（4）覆盖，E）（2）和沿（通过Lotstoppmaske 30中分离载体板（10）和导电层）和焊接材料（4），其中，所述钎焊材料（4 ）至少在某些地方仍保留在Lotstoppmaske（30）。

5. 发明申请

WO2019048061A1 CARRIER AND OPTOELECTRONIC COMPONENT 审中-公开
公开(公告)号：WO2019048061A1
公开(公告)日：2019-03-14
申请号：PCT/EP2017/072692
申请日：2017-09-11
申请人： OSRAM OPTO SEMICONDUCTORS GMBH
发明人： OOI, Chee Eng , ITHNAIN, Ismail , LIM, Choo Kean , CHAN, Weng Heng
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： H01L33/62 , H01L33/486 , H01L2933/0066
摘要： The invention relates to a carrier for an optoelectronic semi-conductor chip, comprising a flat top side, a flat underside and a first side surface. The carrier comprises a first lead frame section,which ranges from the top side to the underside of the carrier, embedded within an insulating material. The first lead frame section comprises a first tie bar, extending to the first side surface. At the first side surface, the insulating material is arranged between the top side of the carrier and the first tie bar as well as between the under-side of the carrier and the first tie bar.

6. 发明申请

WO2019007513A1 METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT 审中-公开
公开(公告)号：WO2019007513A1
公开(公告)日：2019-01-10
申请号：PCT/EP2017/066950
申请日：2017-07-06
申请人： OSRAM OPTO SEMICONDUCTORS GMBH
发明人： LIM, Choo Kean , OR, Choon Keat , LIM, Choon Kim , CHAN, Ai Cheng
IPC分类号： H01L33/00 , H01L33/48 , H01L33/52 , H01L33/50 , H01L33/60 , H01L33/62
摘要： According to at least one embodiment the method for producing an optoelectronic component (100) comprises a step A), in which an intermediate film (1) is provided. In a step B) a plurality of optoelectronic semiconductor chips (2) is attached on predetermined locations of the intermediate film (1). In a step C) a cavity film (3) with a plurality of separated openings (30) is provided. In a step D) the cavity film (3) is attached to the intermediate film (1) such that each optoelectronic semiconductor chip (2) is associated with a respective opening (30). The cavity film (3) is thicker than the optoelectronic semiconductor chips (2) such that the cavity film (3) exceeds the optoelectronic semiconductor chips (2) in a direction away from the intermediate film (1). In a step E) a casting material (4) is filled in each of the openings (30) such that the optoelectronic semiconductor chips (2) are casted with the casting material (4). In a step F) the intermediate film (1) is removed.

7. 发明申请

WO2018145745A1 OPTOELECTRONIC SEMICONDUCTOR COMPONENT 审中-公开
公开(公告)号：WO2018145745A1
公开(公告)日：2018-08-16
申请号：PCT/EP2017/052814
申请日：2017-02-09
申请人： OSRAM OPTO SEMICONDUCTORS GMBH
发明人： LIM, Choo Kean , SUPRAMANIAM, Purusothama , KOAY, Seong Tak , PEE, Hui Ying
IPC分类号： H01L33/56
CPC分类号： H01L33/56
摘要： An optoelectronic semiconductor component comprises a housing body having a cavity. A potting material is arranged in the cavity. The potting material comprises embedded particles. The particles comprise aluminium.

8. 发明申请

WO2017114564A1 METHOD OF ETCHING A METAL LEAD FRAME 审中-公开
标题翻译：蚀刻金属铅框架的方法
公开(公告)号：WO2017114564A1
公开(公告)日：2017-07-06
申请号：PCT/EP2015/081355
申请日：2015-12-29
申请人： OSRAM OPTO SEMICONDUCTORS GMBH
发明人： ITHNAIN, Ismail , LIM, Choo Kean , CHAN, Weng Heng
IPC分类号： H01L21/48
CPC分类号： H01L21/4828
摘要： A method of etching a metal lead frame for a semiconductor chip includes the application of an etching agent to a metal plate using a first and a second spray nozzle, which are located on opposite sides of the metal plate. The volumetric flow rate of the etching agent applied to the metal plate via the first spray nozzle is at least 10 % different from the volumetric flow rate of the etching agent applied to the metal plate via the second spray nozzle. A metal plate with an etching trench extending from a first side of the metal plate to a second side of the metal plate is disclosed. The etching trench comprises a first section and a second section, wherein a first side wall and a second side wall of the etching trench are basically perpendicular to the first side of the metal plate in the first section. A third side wall and a fourth side wall limit the etching trench within the second section. The first section of the etching trench extends from the first side of the metal plate to approximately one third of the thickness of the metal plate and the second section extends from the second side of the metal plate to approximately two thirds of the thickness of the metal plate. The first side of the metal plate adjoins the first side wall, which adjoins the third side wall, which adjoins the second side of the metal plate. The first side of the metal plate adjoins the second side wall, which adjoins the fourth side wall, which adjoins the second side of the metal plate. The third and fourth side wall are inclined compared to the first and second side wall in a way that the distance between the first and the second side wall is smaller than the distance between the third and the fourth side wall.
摘要翻译：蚀刻用于半导体芯片的金属引线框架的方法包括使用第一和第二喷嘴将蚀刻剂施加到金属板，所述第一和第二喷嘴位于金属板的相对侧上。通过第一喷嘴施加到金属板上的蚀刻剂的体积流量与通过第二喷嘴施加到金属板上的蚀刻剂的体积流量不同至少10％。公开了一种具有从金属板的第一侧延伸到金属板的第二侧的蚀刻沟槽的金属板。蚀刻沟槽包括第一部分和第二部分，其中蚀刻沟槽的第一侧壁和第二侧壁基本垂直于第一部分中的金属板的第一侧。第三侧壁和第四侧壁将蚀刻沟槽限制在第二部分内。蚀刻槽的第一部分从金属板的第一侧延伸到金属板厚度的约三分之一，并且第二部分从金属板的第二侧延伸到金属厚度的约三分之二盘子。金属板的第一侧邻接第一侧壁，第一侧壁邻接第三侧壁，邻接金属板的第二侧。金属板的第一侧邻接与第四侧壁邻接的第二侧壁，第二侧壁邻接金属板的第二侧。与第一和第二侧壁相比，第三和第四侧壁以第一和第二侧壁之间的距离小于第三和第四侧壁之间的距离的方式倾斜。

9. 发明授权

EP3033570B1 LIGHT APPARATUS 有权
公开(公告)号：EP3033570B1
公开(公告)日：2018-10-17
申请号：EP13752607.5
申请日：2013-08-13
申请人： OSRAM Opto Semiconductors GmbH
发明人： NG, Kok Eng , LIM, Choo Kean , ONG, Eu Liong , YAP, Boon Liang
IPC分类号： F21V23/00
CPC分类号： F21V29/15 , F21V17/101 , F21V29/70 , F21Y2115/10
摘要： A light apparatus includes a first carrier with an optoelectronic component for generating electromagnetic radiation, a second carrier with at least one electronic component for controlling the optoelectronic component, and a thermally insulating layer arranged between, and attached to, the first and second carriers.

10. 发明公开

EP3033570A1 LIGHT APPARATUS 审中-公开
标题翻译： LICHTVORRICHTUNG
公开(公告)号：EP3033570A1
公开(公告)日：2016-06-22
申请号：EP13752607.5
申请日：2013-08-13
申请人： OSRAM Opto Semiconductors GmbH
发明人： NG, Kok Eng , LIM, Choo Kean , ONG, Eu Liong , YAP, Boon Liang
IPC分类号： F21V23/00
CPC分类号： F21V29/15 , F21V17/101 , F21V29/70 , F21Y2115/10
摘要： A light apparatus is disclosed. Embodiments of the light apparatus includes a first carrier with at least one electronic component for controlling an optoelectronic component, a second carrier with the optoelectronic component for generating electromagnetic radiation and a thermally insulating layer arranged between the first and second carriers, wherein the first and second carriers are attached to the insulating layer.
摘要翻译：公开了一种灯装置。光装置的实施例包括具有至少一个用于控制光电子部件的电子部件的第一载体，具有用于产生电磁辐射的光电子部件的第二载体和布置在第一和第二载体之间的隔热层，其中第一和第二载体载体附着在绝缘层上。

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