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1. 发明授权

US07625693B2 Method of fabricating one-way transparent optical system 有权
标题翻译：制造单向透明光学系统的方法
公开(公告)号：US07625693B2
公开(公告)日：2009-12-01
申请号：US11295636
申请日：2005-12-07
申请人： O-gweon Seo , Kae-dong Back , Chang-seung Lee , Kyu-sik Kim , Duck-su Kim , Byoung-ho Cheong
发明人： O-gweon Seo , Kae-dong Back , Chang-seung Lee , Kyu-sik Kim , Duck-su Kim , Byoung-ho Cheong
IPC分类号： G03F1/00
CPC分类号： G02B5/003 , G02B1/11 , G02B3/0006 , G02B3/0018 , G03C1/00
摘要： A method of fabricating a one-way transparent optical system by which external light is effectively intercepted and internal light passes nearly without loss is provided. The method includes: forming a silver halide on a transparent substrate; aligning a mask in which a predetermined pattern is formed, on the transparent substrate and exposing the silver halide using the mask; developing and fixing the exposed silver halide and forming a plurality of light-absorbing materials on the transparent substrate; and forming protrusion structures having a shape of a convex lens shape for refracting incident light toward a corresponding light-absorbing material of the light-absorbing materials, on the transparent substrate on which the light-absorbing materials are formed.
摘要翻译：提供了一种制造单向透明光学系统的方法，通过该方法可以有效地遮断外部光线，并且内部光线几乎没有损失。该方法包括：在透明基板上形成卤化银; 将形成有预定图案的掩模对准在透明基板上，并使用掩模曝光卤化银; 显影和固定曝光的卤化银并在透明基板上形成多个光吸收材料; 以及在其上形成有光吸收材料的透明基板上形成具有用于将入射光折射到相应的光吸收材料的光吸收材料的凸透镜形状的突起结构。

2. 发明申请

US20060134533A1 Method of fabricating one-way transparent optical system 有权
公开(公告)号：US20060134533A1
公开(公告)日：2006-06-22
申请号：US11295636
申请日：2005-12-07
申请人： O-gweon Seo , Kae-dong Back , Chang-seung Lee , Kyu-sik Kim , Duck-su Kim , Byoung-ho Cheong
发明人： O-gweon Seo , Kae-dong Back , Chang-seung Lee , Kyu-sik Kim , Duck-su Kim , Byoung-ho Cheong
IPC分类号： G03F1/00
CPC分类号： G02B5/003 , G02B1/11 , G02B3/0006 , G02B3/0018 , G03C1/00
摘要： A method of fabricating a one-way transparent optical system by which external light is effectively intercepted and internal light passes nearly without loss is provided. The method includes: forming a silver halide on a transparent substrate; aligning a mask in which a predetermined pattern is formed, on the transparent substrate and exposing the silver halide using the mask; developing and fixing the exposed silver halide and forming a plurality of light-absorbing materials on the transparent substrate; and forming protrusion structures having a shape of a convex lens shape for refracting incident light toward a corresponding light-absorbing material of the light-absorbing materials, on the transparent substrate on which the light-absorbing materials are formed.

3. 发明申请

US20110058852A1 CHARGING DEVICE AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS INCLUDING THE SAME 审中-公开
标题翻译：充电装置和电子图像形成装置，包括它们
公开(公告)号：US20110058852A1
公开(公告)日：2011-03-10
申请号：US12876385
申请日：2010-09-07
申请人： Hee-moon Jeong , Kae-dong Back , Jin-ho Lee
发明人： Hee-moon Jeong , Kae-dong Back , Jin-ho Lee
IPC分类号： G03G15/02
CPC分类号： G03G15/0208 , G03G15/0291 , G03G2215/02
摘要： A charging device and an electrophotographic image forming apparatus including the same. A charging electrode of the charging device includes a porous insulating layer including a plurality of hollow rods vertically formed on a substrate formed of a conductive material, and a conductive nano structure formed in the hollow rods of the porous insulating layer. A grid electrode is supported by a spacer and is separated from the nano structure of the charging electrode. Furthermore, the charging electrode of the charging device may include a plurality of protrusions formed on a substrate, a porous insulating layer formed on the plurality of protrusions, and a conductive nano structure formed in hollow rods of the porous insulating layer.
摘要翻译：一种充电装置和包括该充电装置的电子照相成像装置。充电装置的充电电极包括多孔绝缘层，多孔绝缘层包括垂直形成在由导电材料形成的基板上的多个中空棒，以及形成在多孔绝缘层的中空棒中的导电纳米结构。栅极由间隔物支撑并与充电电极的纳米结构分离。此外，充电装置的充电电极可以包括形成在基板上的多个突起，形成在多个突起上的多孔绝缘层，以及形成在多孔绝缘层的中空棒中的导电纳米结构。

4. 发明申请

US20070024691A1 Image drum and a manufacturing method thereof 审中-公开
标题翻译：图像鼓及其制造方法
公开(公告)号：US20070024691A1
公开(公告)日：2007-02-01
申请号：US11397703
申请日：2006-04-05
申请人： Kyu-ho Shin , Won-kyoung Choi , Jong-kwang Kim , Kae-dong Back , Chang-youl Moon
发明人： Kyu-ho Shin , Won-kyoung Choi , Jong-kwang Kim , Kae-dong Back , Chang-youl Moon
IPC分类号： B41J2/39
CPC分类号： B41J2/395 , G03G15/348 , G03G2217/0075
摘要： An image drum and method of producing the same is provided. The drum includes a drum body having a pair of semi-cylindrical members, each being oppositely bonded and having a bonding surface having electrodes being separated from one another by insulating areas, and line electrodes formed on the periphery; a control unit including conductive parts corresponding to the line electrodes, and nonconductive parts interposed between the conductive parts, and disposed inside the drum body; and a connecting member electrically coupling the line electrodes to the control unit. The method includes cutting a cylindrical member into two semi-cylindrical members; oxidizing the surfaces of the members; forming electrodes on each of the cut surfaces; partially oxidizing a substrate; bonding the two semi-cylindrical members across the substrate such that the electrodes and the conductive parts couple together; and forming line electrodes on the periphery of the members.
摘要翻译：提供了一种图像鼓及其制造方法。滚筒包括具有一对半圆柱形构件的鼓体，每个半圆柱体构件相对地接合并且具有通过绝缘区域彼此分离的电极和在周边上形成的线电极的接合表面; 控制单元，其包括对应于所述线电极的导电部分，以及插入在所述导电部件之间的非导电部件，并且设置在所述鼓体内; 以及将线路电极电耦合到控制单元的连接构件。该方法包括将圆柱形构件切割成两个半圆柱形构件; 氧化构件的表面; 在每个切割表面上形成电极; 部分氧化底物; 将两个半圆柱形构件跨过衬底结合，使得电极和导电部件耦合在一起; 以及在所述构件的周边上形成线电极。

5. 发明授权

US07926177B2 Method of forming hydrophobic coating layer on surface of nozzle plate of inkjet printhead 失效
标题翻译：在喷墨打印头喷嘴板表面形成疏水涂层的方法
公开(公告)号：US07926177B2
公开(公告)日：2011-04-19
申请号：US11425204
申请日：2006-06-20
申请人： Sung-gyu Kang , Kae-dong Back , Seung-mo Lim , Jae-woo Chung
发明人： Sung-gyu Kang , Kae-dong Back , Seung-mo Lim , Jae-woo Chung
IPC分类号： B23P17/00 , B21D53/76 , B41J2/15 , B41J2/145
CPC分类号： B41J2/1433 , B41J2/1606 , B41J2/162 , B41J2/1628 , B41J2/1631 , B41J2/1643 , Y10T29/49401
摘要： A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.
摘要翻译：在喷墨打印头的喷嘴板的表面上形成疏水涂层的方法包括在喷嘴板中形成多个喷嘴，每个喷嘴具有出口，在喷嘴板的表面上堆叠膜以覆盖每个喷嘴的出口，在每个喷嘴的内壁上形成预定的金属层，并且使用电镀方法将膜的内表面覆盖每个喷嘴的出口，从该表面移除该膜喷嘴板，在喷嘴板的表面上形成疏水涂层，以覆盖通过每个喷嘴的出口暴露的金属层，并且去除形成在每个喷嘴的内壁上的金属层和疏水涂层形成在金属层的表面上。

6. 发明授权

US07794799B1 Process for producing array plate for biomolecules having hydrophilic and hydrophobic regions 有权
标题翻译：制备具有亲水和疏水区域的生物分子阵列板的方法
公开(公告)号：US07794799B1
公开(公告)日：2010-09-14
申请号：US10438334
申请日：2003-05-15
申请人： Woon-bae Kim , Chang-ho Cho , Kae-dong Back , Hwan-young Choi
发明人： Woon-bae Kim , Chang-ho Cho , Kae-dong Back , Hwan-young Choi
IPC分类号： B05D3/00
CPC分类号： B82Y30/00 , B01J19/0046 , B01J2219/00274 , B01J2219/00432 , B01J2219/00585 , B01J2219/00596 , B01J2219/00605 , B01J2219/0061 , B01J2219/00612 , B01J2219/00619 , B01J2219/00626 , B01J2219/00637 , B01J2219/00659 , B01J2219/00722 , B01J2219/00725 , B01J2219/00731 , B01L3/5088 , B01L2200/12 , C07B2200/11 , C40B40/06 , C40B40/10 , C40B40/12 , C40B60/14
摘要： A method for manufacturing an array plate for biomolecules includes coating a surface of a substrate with a hydrophobic material to form a hydrophobic layer having initial hydrophobic properties, etching the hydrophobic layer through an etch mask placed thereon to form a hydrophilic binding site, removing the etch mask, and processing the remaining region of the hydrophobic layer to recover the initial hydrophobic properties. A method for manufacturing a biochip using this array plate, includes processing the surface of the hydrophilic binding site of the array plate to increase an affinity of biomolecules to the hydrophilic binding site, and applying a solution containing biomolecules to the surface of the hydrophilic binding site.
摘要翻译：用于制造生物分子阵列板的方法包括用疏水材料涂覆基材的表面以形成具有初始疏水性质的疏水层，通过其上放置的蚀刻掩模蚀刻疏水层以形成亲水性结合位点，除去蚀刻掩模，并处理疏水层的剩余区域以恢复初始疏水性质。使用该阵列板制造生物芯片的方法包括加工阵列板的亲水性结合位点的表面以增加生物分子对亲水结合位点的亲和力，并将含有生物分子的溶液施加到亲水结合位点的表面。

7. 发明授权

US07510968B2 Cap for semiconductor device package, and manufacturing method thereof 有权
标题翻译：半导体器件封装用封装及其制造方法
公开(公告)号：US07510968B2
公开(公告)日：2009-03-31
申请号：US11412900
申请日：2006-04-28
申请人： Moon-chul Lee , Jong-oh Kwon , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
发明人： Moon-chul Lee , Jong-oh Kwon , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
IPC分类号： H01L21/44
CPC分类号： B81C1/00301 , B81B2207/095 , H01L23/04 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A cap for a semiconductor device package, including a body formed at a predetermined thickness with a cavity. The cap further includes a first seed layer formed on an inner circumference of a first via hole formed at a predetermined depth from the cavity formation surface of the body, a second seed layer formed on an inner circumference of a second via hole formed at a predetermined depth from the opposite surface to the cavity formation surface of the body, and plating materials filled in the first via hole and the second via hole.
摘要翻译：一种用于半导体器件封装的帽，包括以预定厚度形成有空腔的主体。所述盖还包括形成在与所述主体的空腔形成表面形成在预定深度的第一通孔的内周上的第一籽晶层，形成在形成为预定的第二通孔的第二通孔的内周上的第二籽晶层深度从主体的相对表面到空腔形成表面，以及填充在第一通孔和第二通孔中的电镀材料。

8. 发明申请

US20070013058A1 Packaging chip having interconnection electrodes directly connected to plural wafers and fabrication method therefor 有权
标题翻译：具有直接连接到多个晶片的互连电极的封装芯片及其制造方法
公开(公告)号：US20070013058A1
公开(公告)日：2007-01-18
申请号：US11481012
申请日：2006-07-06
申请人： Min-seog Choi , Kae-dong Back , In-sang Song , Woon-bae Kim , Byung-gil Jeong , Kyu-dong Jung
发明人： Min-seog Choi , Kae-dong Back , In-sang Song , Woon-bae Kim , Byung-gil Jeong , Kyu-dong Jung
IPC分类号： H01L23/34
CPC分类号： H01L25/0657 , H01L21/76898 , H01L23/481 , H01L25/50 , H01L2224/9202 , H01L2225/06513 , H01L2225/06541 , H03H9/0547
摘要： A packaging chip formed with plural wafers. The packaging chip includes plural wafers stacked in order and plural interconnection electrodes directly connecting the plural wafers from an upper surface of an uppermost wafer of the plural wafers to the other wafers. At least one or more of the plural wafers mounts a predetermined circuit device thereon. Further, at least one or more wafers of the plural wafers have a cavity of a predetermined size. Meanwhile, the packaging chip further includes plural pads independently arranged on the upper surface of the uppermost wafer one another and electrically connected to the plural interconnection electrodes respectively. Accordingly, the present invention can enhance the performance and reliability of a packaging chip and improve fabrication yield.
摘要翻译：形成有多个晶片的封装芯片。封装芯片包括依次堆叠的多个晶片和从多个晶片的最上面的晶片的上表面直接连接多个晶片到另一个晶片的多个互连电极。多个晶片中的至少一个或多个在其上安装预定的电路装置。此外，多个晶片的至少一个或多个晶片具有预定尺寸的空腔。同时，封装芯片还包括独立地布置在最上面的晶片的上表面上并分别电连接到多个互连电极的多个焊盘。因此，本发明可以提高封装芯片的性能和可靠性，并提高制造成品率。

9. 发明授权

US08051561B2 Method of manufacturing an image drum 失效
标题翻译：图像鼓的制造方法
公开(公告)号：US08051561B2
公开(公告)日：2011-11-08
申请号：US12133414
申请日：2008-06-05
申请人： Eung-yeoul Yoon , Kae-dong Back , Kyu-ho Shin , Jin-seung Choi
发明人： Eung-yeoul Yoon , Kae-dong Back , Kyu-ho Shin , Jin-seung Choi
IPC分类号： H01R43/00 , H05K13/00
CPC分类号： G03G15/32 , G03G15/751 , Y10T29/49002 , Y10T29/49139 , Y10T29/49147 , Y10T29/49155 , Y10T29/49169 , Y10T29/49174 , Y10T29/49227
摘要： A method of manufacturing an image drum includes fixing a control circuit board inside the drum body so that a plurality of terminals of the control circuit board are located in the slot formed longitudinally on the drum body, forming an insulation layer to the entire external surface of the drum body, forming connection parts by removing parts of the insulation layer where the terminals of the control circuit board are formed, forming electrode forming grooves including the insulation layer as a base on the external surface of the drum body comprising the connection parts thereon, and forming a plurality of ring electrodes to be connected to respective terminals among the plurality of the terminals, respectively, through the connection parts.
摘要翻译：一种制造图象滚筒的方法包括将控制电路板固定在滚筒本体内部，使得控制电路板的多个端子位于纵向形成在滚筒主体上的槽中，在绝缘层的整个外表面上形成绝缘层通过去除形成控制电路板的端子的绝缘层的部分来形成连接部分，在其上包括连接部分的滚筒主体的外表面上形成包括绝缘层作为基底的电极形成槽，并且分别通过连接部分形成多个环形电极以分别连接到多个端子中的各个端子。

10. 发明授权

US07579685B2 Wafer level packaging cap and fabrication method thereof 有权
标题翻译：晶圆级封装盖及其制造方法
公开(公告)号：US07579685B2
公开(公告)日：2009-08-25
申请号：US11339500
申请日：2006-01-26
申请人： Moon-chul Lee , Woon-bae Kim , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
发明人： Moon-chul Lee , Woon-bae Kim , Kae-dong Back , Qian Wang , Jun-sik Hwang , Kyu-dong Jung
IPC分类号： H01L23/12 , H01L23/043
CPC分类号： B81C1/00301 , B81B2207/095 , H01L21/76898 , H01L23/04 , H01L23/10 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on a bottom surface a cavity providing a space for receiving the device, and integrally combined with the device wafer, a plurality of metal lines formed on the bottom surface of the cap wafer to correspond to a plurality of device pads formed on the device wafer to be electrically connected to the device, a plurality of buffer portions connected to the plurality of metal lines and comprising a buffer wafer with a plurality of grooves and a metal filled in the plurality of grooves, a plurality of connection rods electrically connected to the plurality of buffer portions and penetrating the cap wafer from a top portion of the buffer portion, and a plurality of cap pads formed on a top surface of the cap wafer and electrically connected to a plurality of connection rods.
摘要翻译：提供了一种用于晶片级封装的晶片级封装盖及其方法。覆盖其上具有器件的器件晶片的晶片级封装盖包括盖晶片，其在底表面上具有提供用于接收器件的空间并与器件晶片整体结合的空腔，形成在底部的多个金属线盖片晶片的表面对应于形成在器件晶片上以电连接到器件的多个器件焊盘，多个缓冲部分连接到多个金属线并且包括具有多个沟槽的缓冲晶片和填充在所述多个槽中的金属，多个连接杆，电连接到所述多个缓冲部分，并且从所述缓冲部分的顶部穿透所述盖片;以及形成在所述盖片的顶表面上的多个帽垫并且电连接到多个连接杆。

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