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1. 发明授权

US06329474B1 Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole 失效
标题翻译：环氧苯酚 - 羟基苯甲醛缩合物，双酚 - 甲醛缩合物和掩蔽咪唑
公开(公告)号：US06329474B1
公开(公告)日：2001-12-11
申请号：US09541515
申请日：2000-04-03
申请人： Michitoshi Arata , Shigeo Sase , Nozomu Takano , Tomio Fukuda
发明人： Michitoshi Arata , Shigeo Sase , Nozomu Takano , Tomio Fukuda
IPC分类号： E32B2704
CPC分类号： H05K1/0373 , C08G59/3218 , C08G59/5073 , C08L61/06 , C08L61/12 , C08L63/00 , C08L63/04 , H01B3/40 , H01L23/145 , H01L2924/0002 , H05K1/0326 , H05K2201/012 , Y10T428/2915 , C08L2666/22 , C08L61/04 , H01L2924/00
摘要： An epoxy resin composition for printed wiring boards which comprises as the essential components (a) an epoxy resin obtained by epoxidizing a condensation product of a phenol with hydroxybenzaldehyde, (b) a condensation product of bisphenol A with formaldehyde, (c) a flame retardant, and (d) a curing accelerator, and a laminate for printed wiring boards which has a low hygroscopicity, a high heat resistance, good high-temperature characteristics, a high resistance against electrolytic corrosion, a high resistance against color change due to heating, and a high Tg.
摘要翻译：一种用于印刷线路板的环氧树脂组合物，其包含作为主要组分（a）通过苯酚与羟基苯甲醛的缩合产物环氧化获得的环氧树脂，（b）双酚A与甲醛的缩合产物，（c）阻燃剂，和（d）固化促进剂和印刷线路板的层压体，其具有低吸湿性，高耐热性，高温特性，高耐电腐蚀性，耐高温耐色变色性，和高Tg。

2. 发明授权

US06180250B2 Epoxy composition for printed circuit boards 失效
标题翻译：印刷电路板用环氧组合物
公开(公告)号：US06180250B2
公开(公告)日：2001-01-30
申请号：US08994967
申请日：1997-12-19
申请人： Michitoshi Arata , Shigeo Sase , Nozomu Takano , Tomio Fukuda
发明人： Michitoshi Arata , Shigeo Sase , Nozomu Takano , Tomio Fukuda
IPC分类号： B32B1504
CPC分类号： H05K1/0373 , B32B15/08 , C08G59/08 , C08G59/3218 , C08K5/0008 , C08L63/04 , H01L23/145 , H01L2924/0002 , H05K2201/012 , H05K2203/122 , Y10T428/31678 , C08L61/04 , H01L2924/00
摘要： To provide an epoxy resin composition for printed circuit boards which demonstrates little tendency to absorb moisture, high heat-resistance, favorable high temperature properties, resistance to metal migration, favorable anti-fade property at high temperatures, high Tg, high electric insulating performance and resistance against peeling of the copper foil when formed into a printed circuit board, there is provided epoxy resin composition for printed circuit boards, comprising: (a) epoxy resin obtained by glycidyl etherifying a condensation product of a phenol and hydroxybenzaldehyde; (b) a condensation product of bisphenol A and formaldehyde; (c) a flame retardant; (d) a curing agent; (e) one or both of a phenol antioxidant and an organic sulfur compound antioxidant; and (f) a urea derivative. This composition is highly suitable as a material for manufacturing epoxy resin prepreg in general and printed circuit boards.
摘要翻译：本发明提供一种印刷电路板用环氧树脂组合物，其耐湿性，耐热性，耐高温性，耐金属迁移性，耐高温下的抗褪色性，高Tg，高绝缘性，提供了形成印刷电路板时的铜箔的剥离性，提供了用于印刷电路板的环氧树脂组合物，其包含：（a）通过缩水甘油醚醚化苯酚和羟基苯甲醛的缩合产物得到的环氧树脂; （b）双酚A和甲醛的缩合产物; （c）阻燃剂; （d）固化剂; （e）苯酚抗氧化剂和有机硫化合物抗氧化剂中的一种或两种; 和（f）尿素衍生物。该组合物作为一般制造环氧树脂预浸料和印刷电路板的材料是非常适合的。

3. 发明授权

US06696155B1 Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances 失效
标题翻译：用于印刷线路板的预浸料，树脂清漆，树脂组合物和使用这些物质制造的印刷线路板的层压材料
公开(公告)号：US06696155B1
公开(公告)日：2004-02-24
申请号：US08981570
申请日：1997-12-23
申请人： Nozomu Takano , Shigeo Sase , Tomio Fukuda , Michitoshi Arata
发明人： Nozomu Takano , Shigeo Sase , Tomio Fukuda , Michitoshi Arata
IPC分类号： B32B900
CPC分类号： B32B27/04 , C03C25/40 , C08J5/06 , C08J5/08 , C08J5/24 , H05K1/0353 , Y02P20/582 , Y10S428/901 , Y10T428/24917 , Y10T428/2962 , Y10T428/2995 , Y10T428/31612 , Y10T428/31663
摘要： Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.
摘要翻译：通过用具有特定结构的硅酮低聚物，特别是三维交联的有机硅低聚物或使用通过混合制备的树脂清漆来处理基材或无机填料的表面，可以生产印刷布线板，具有用于浸渍基材的树脂清漆的硅氧烷低聚物，或通过将无机填料浸渍在这种用于表面处理的硅氧烷低聚物的溶液中，然后将树脂材料与溶液直接混合。

4. 发明授权

US06572968B2 Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards 有权
标题翻译：制造印刷电路板用预浸料的方法，用硅氧烷低聚物处理的玻璃纤维材料和印刷线路板用层压体
公开(公告)号：US06572968B2
公开(公告)日：2003-06-03
申请号：US09849219
申请日：2001-05-07
申请人： Nozomu Takano , Shigeo Sase , Tomio Fukuda , Michitoshi Arata
发明人： Nozomu Takano , Shigeo Sase , Tomio Fukuda , Michitoshi Arata
IPC分类号： B32B900
CPC分类号： B32B27/04 , C03C25/40 , C08J5/06 , C08J5/08 , C08J5/24 , H05K1/0353 , Y02P20/582 , Y10S428/901 , Y10T428/24917 , Y10T428/2962 , Y10T428/2995 , Y10T428/31612 , Y10T428/31663
摘要： Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.
摘要翻译：通过用具有特定结构的硅酮低聚物，特别是三维交联的有机硅低聚物或使用通过混合制备的树脂清漆来处理基材或无机填料的表面，可以生产印刷布线板，具有用于浸渍基材的树脂清漆的硅氧烷低聚物，或通过将无机填料浸渍在这种用于表面处理的硅氧烷低聚物的溶液中，然后将树脂材料与溶液直接混合。

5. 发明授权

US06692792B2 Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances 有权
标题翻译：用于印刷线路板的预浸料，树脂清漆，树脂组合物和使用这些物质制造的印刷线路板的层压材料
公开(公告)号：US06692792B2
公开(公告)日：2004-02-17
申请号：US10425623
申请日：2003-04-30
申请人： Nozomu Takano , Shigeo Sase , Tomio Fukuda , Michitoshi Arata
发明人： Nozomu Takano , Shigeo Sase , Tomio Fukuda , Michitoshi Arata
IPC分类号： B05D136
CPC分类号： B32B27/04 , C03C25/40 , C08J5/06 , C08J5/08 , C08J5/24 , H05K1/0353 , Y02P20/582 , Y10S428/901 , Y10T428/24917 , Y10T428/2962 , Y10T428/2995 , Y10T428/31612 , Y10T428/31663
摘要： Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.
摘要翻译：通过用具有特定结构的硅酮低聚物，特别是三维交联的有机硅低聚物或使用通过混合制备的树脂清漆来处理基材或无机填料的表面，可以生产印刷布线板，具有用于浸渍基材的树脂清漆的硅氧烷低聚物，或通过将无机填料浸渍在这种用于表面处理的硅氧烷低聚物的溶液中，然后将树脂材料与溶液直接混合。

6. 发明授权

US6156831A Modified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same 失效
标题翻译：改性氰酸酯基可固化树脂组合物和清漆，预浸料，金属包覆层压板，薄膜，印刷电路板和使用其的多层电路板
公开(公告)号：US6156831A
公开(公告)日：2000-12-05
申请号：US108204
申请日：1998-07-01
申请人： Shigeo Sase , Yasuyuki Mizuno , Takeshi Sugimura , Harumi Negishi
发明人： Shigeo Sase , Yasuyuki Mizuno , Takeshi Sugimura , Harumi Negishi
IPC分类号： C08K5/00 , C08K5/3492 , C08L71/12 , C08L79/04 , H05K1/00 , H05K1/03 , C08K5/34
CPC分类号： H05K1/0346 , C08K5/0066 , C08K5/34924 , C08L71/123 , C08L79/04 , H05K3/4676 , Y10S428/901 , Y10T428/24917
摘要： A modified cyanate ester group curable resin composition, and varnishes, prepregs, laminated boards adhered with metal foil, films, printed circuit boards, and multilayered circuit boards using the same, comprising: (A) a cyanate ester group compound(B) a monovalent phenolic group compound(C) a polyphenylene ether resin,(D) a flame retardant not reactive with the cyanate ester group compound, and(E) a metal group reaction catalyst.
摘要翻译：改性氰酸酯基可固化树脂组合物，以及用金属箔，膜，印刷电路板和使用该金属箔的多层电路板的清漆，预浸料，层压板，包括：（A）氰酸酯基化合物（B）酚类化合物（C），聚苯醚树脂，（D）与氰酸酯基化合物不反应的阻燃剂和（E）金属反应催化剂。

7. 发明授权

US06465083B1 METHOD OF MAKING VARNISH OF MODIFIED CYANATE ESTER GROUP CURABLE RESIN COMPOSITION, AND PREPREG, METAL CLAD LAMINATED BOARD, FILM, PRINTED CIRCUIT BOARD, AND MULTILAYERED CIRCUIT BOARD USING THE COMPOSITION 有权
标题翻译：改性氰基酯组可固化树脂组合物和PREPREG，金属层压板，薄膜，印刷电路板和使用组合物的多层电路板的制备方法
公开(公告)号：US06465083B1
公开(公告)日：2002-10-15
申请号：US09665289
申请日：2000-09-20
申请人： Shigeo Sase , Yasuyuki Mizuno , Takeshi Sugimura , Harumi Negishi
发明人： Shigeo Sase , Yasuyuki Mizuno , Takeshi Sugimura , Harumi Negishi
IPC分类号： B32B1508
CPC分类号： H05K1/0346 , C08K5/0066 , C08K5/34924 , C08L71/123 , C08L79/04 , H05K3/4676 , Y10S428/901 , Y10T428/24917 , C08L2666/20 , C08L71/00
摘要： A modified cyanate ester group curable resin composition, and varnishes, prepregs, laminated boards adhered with metal foil, films, printed circuit boards, and multilayered circuit boards using the same, comprising: (A) a cyanate ester group compound expressed by chemical formula (1), (where, R1 is and respective of and R2 and R3 is any one of hydrogen or methyl group, and the both can be the same or different from each other, (B) a monovalent phenolic group compound expressed by chemical formula (2), or formula (3), where R4 and R5 is any one of hydrogen atom or low alkyl group having 1 to 4 carbon atoms, and the both can be the same or different from each other, n is a positive integer of 1 or 2. (where, R6 is or (C) a polyphenylene ether resin, (D) a flame retardant not reactive with the cyanate ester group compound, and (E) a metal group reaction catalyst.
摘要翻译：改性氰酸酯基可固化树脂组合物和粘附有金属箔，薄膜，印刷电路板和使用其的多层电路板的清漆，预浸料，层压板，包括：（A）由化学式表示的氰酸酯基化合物 1）（其中，R 1和R 3分别为氢或甲基，R 3为氢或甲基中的任一个，两者可以相同或不同，（B）由化学式（2）表示的一价酚类化合物）或式（3），其中R 4和R 5是氢原子或具有1至4个碳原子的低级烷基中的任一个，并且两者可以相同或不同，n为1或1的整数，（其中，R6代表（C）聚苯醚树脂，（D）与氰酸酯基化合物不反应的阻燃剂和（E）金属反应催化剂。

8. 发明授权

US4362203A Process for preparing foundry cores or molds and binder materials used therefor 失效
标题翻译：用于制备铸造芯或模具和粘合剂材料的方法
公开(公告)号：US4362203A
公开(公告)日：1982-12-07
申请号：US248536
申请日：1981-03-27
申请人： Susumu Konii , Shigeo Sase , Masatoshi Yoshida , Shoei Kuroda , Takeshi Sumi
发明人： Susumu Konii , Shigeo Sase , Masatoshi Yoshida , Shoei Kuroda , Takeshi Sumi
IPC分类号： C08L61/00 , B22C1/10 , B22C1/22 , C08G8/04 , C08K3/22 , C08L61/04 , C08L61/10 , B22C1/18
CPC分类号： C08G8/04 , B22C1/2253 , C08K3/22
摘要： A novel process for preparing foundry cores or molds and binder materials used therefor are provided. The binder materials comprise (a) an alcohol-soluble phenolic resin, (b) a polyvalent metal hydroxide and/or oxide, (c) water, (d) an organic solvent, and (e) an alkali metal hydroxide. They are admixed with refractory particles, such as sand, and cured with carbon dioxide to form shaped foundry cores or molds. The process and materials of the invention bring about such advantages that curing may be performed with safe carbon dioxide, that shaped foundry cores or molds may be taken out from pattern immediately after curing, and that the products have a superior collapsibility after pouring a molten metal.
摘要翻译：提供了一种用于制备铸造芯或用于其的模具和粘合剂材料的新颖方法。粘合剂材料包括（a）醇溶性酚醛树脂，（b）多价金属氢氧化物和/或氧化物，（c）水，（d）有机溶剂和（e）碱金属氢氧化物。它们与耐火颗粒如砂混合，并用二氧化碳固化以形成成型铸造芯或模具。本发明的方法和材料带来了这样的优点：固化可以用安全的二氧化碳进行，成型的铸造芯或模具可以在固化后立即从图案中取出，并且产品在浇注熔融金属后具有优异的可收缩性。

9. 发明申请

US20070220963A1 Tire condition monitor device and method of manufacturing the same 有权
标题翻译：轮胎状态监测装置及其制造方法
公开(公告)号：US20070220963A1
公开(公告)日：2007-09-27
申请号：US11519146
申请日：2006-09-12
申请人： Satoshi Morita , Akira Momose , Naoki Hara , Shigeo Sase
发明人： Satoshi Morita , Akira Momose , Naoki Hara , Shigeo Sase
IPC分类号： G01M17/02
CPC分类号： C08G18/6204 , B60C23/0408 , B60C23/0494 , C08G18/6208 , C08G18/7671
摘要： A tire condition monitor device includes a circuit board mounted on a tire wheel for detecting a pneumatic pressure in an interior of a tire. The circuit board is covered with urethane resin. The urethane resin has finer resin meshes as compared with the conventional silicon resin serving as a board protecting resin. Since sulfur gas and water is hard to permeate through the urethane resin, gas barrier and dampproof properties can be improved. In a method of manufacturing the tire condition monitor device, a prebaking process is carried out before aboard protecting process of covering the circuit board with the urethane resin. Since moisture contained in the circuit board is vaporized, the circuit board covered with the urethane resin can reliably be protected from moisture.
摘要翻译：轮胎状态监视装置包括安装在轮胎车轮上的电路板，用于检测轮胎内部的气动压力。电路板用聚氨酯树脂覆盖。与用作板保护树脂的常规硅树脂相比，聚氨酯树脂具有更细的树脂网。由于硫气和水难以渗透通过聚氨酯树脂，因此可以提高阻气性和防潮性。在制造轮胎状态监视装置的方法中，在利用聚氨酯树脂覆盖电路板的保护处理之前进行预烘烤处理。由于包含在电路板中的水分蒸发，可以可靠地防止被聚氨酯树脂覆盖的电路板免受潮湿的影响。

10. 发明授权

US07392694B2 Tire condition monitor device and method of manufacturing the same 有权
标题翻译：轮胎状态监测装置及其制造方法
公开(公告)号：US07392694B2
公开(公告)日：2008-07-01
申请号：US11519146
申请日：2006-09-12
申请人： Satoshi Morita , Akira Momose , Naoki Hara , Shigeo Sase
发明人： Satoshi Morita , Akira Momose , Naoki Hara , Shigeo Sase
IPC分类号： G01M17/02
CPC分类号： C08G18/6204 , B60C23/0408 , B60C23/0494 , C08G18/6208 , C08G18/7671
摘要： A tire condition monitor device includes a circuit board mounted on a tire wheel for detecting a pneumatic pressure in an interior of a tire. The circuit board is covered with urethane resin. The urethane resin has finer resin meshes as compared with the conventional silicon resin serving as a board protecting resin. Since sulfur gas and water is hard to permeate through the urethane resin, gas barrier and dampproof properties can be improved. In a method of manufacturing the tire condition monitor device, a prebaking process is carried out before a board protecting process of covering the circuit board with the urethane resin. Since moisture contained in the circuit board is vaporized, the circuit board covered with the urethane resin can reliably be protected from moisture.
摘要翻译：轮胎状态监视装置包括安装在用于检测轮胎内部的气动压力的轮胎车轮上的电路板。电路板用聚氨酯树脂覆盖。与用作板保护树脂的常规硅树脂相比，聚氨酯树脂具有更细的树脂网。由于硫气和水难以渗透通过聚氨酯树脂，因此可以提高阻气性和防潮性。在制造轮胎状态监视装置的方法中，在用聚氨酯树脂覆盖电路板的板保护处理之前进行预烘烤处理。由于包含在电路板中的水分蒸发，可以可靠地防止被聚氨酯树脂覆盖的电路板免受潮湿的影响。

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