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1. 发明专利

JP2004343030A Wiring circuit board, manufacturing method thereof, circuit module provided with this wiring circuit board 审中-公开
公开(公告)号：JP2004343030A
公开(公告)日：2004-12-02
申请号：JP2003307897
申请日：2003-08-29
申请人： North:Kk , 株式会社ノース
发明人： IIJIMA ASAO , ENDO KIMIYOSHI , IKENAGA KAZUO , OHIRA HIROSHI
IPC分类号： G02F1/1333 , H01L23/12 , H05K1/02 , H05K1/14 , H05K3/34
CPC分类号： H01L24/73 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/01029 , H01L2924/01078 , H01L2924/14 , H01L2924/15311 , H01L2924/3025 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To reduce the number of steps required for forming solder balls 12 for connecting bumps 6 of a wiring circuit board 2 using the bumps 6 as an interlayer connecting means to another board, e.g. a wiring layer 16 of a printed circuit board 14 to achieve low-cost manufacturing of the wiring circuit board 2. SOLUTION: A plurality of bumps 6 are formed directly or via an etching barrier layer 8 on the surface portion of a wiring layer 10, and an interlayer insulating film 4 is formed on a portion where the bumps 6 are not formed on the bump forming surface of the wiring layer 10, and a solder ball 12 is directly formed on the top of each of the solder balls 6. COPYRIGHT: (C)2005,JPO&NCIPI

2. 发明专利

JP2005303133A Wiring board and its producing process 有权
标题翻译：接线板及其生产工艺
公开(公告)号：JP2005303133A
公开(公告)日：2005-10-27
申请号：JP2004119205
申请日：2004-04-14
申请人： North:Kk , 株式会社ノース
发明人： OHIRA HIROSHI , HARADA SATOSHI , IKENAGA KAZUO , ENDO KIMIYOSHI , IIJIMA ASAO
IPC分类号： H05K1/11 , H01L23/12 , H05K3/00 , H05K3/06 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To improve reliability in connection between the top surface of a metal bump and a wiring layer connected thereto, to improve yield of a wiring board, the wiring board using the metal bump as an interlayer connection means, and further to enhance electrical characteristics by enhancing an insulating part between wiring layers or between wiring boards. SOLUTION: The top surface of a metal bump 28 and a wiring film 10 (16) connected thereto are connected by direct metal bonding of metals, for example, copper-to-copper bonding. Furthermore, air or a foamed resin 12 containing air is used as an interlayer insulating film, Thus, reliability in the connection between the top surface of the metal bump and the wiring layer is improved, and yield of a wiring board can be enhanced. When interlayer insulation using air or the foamed resin is desired, the dielectric constant of an interlayer insulator is reduced to lower parasitic capacitance of the wiring circuit board or an electronic circuit using the same, thereby improving circuit characteristics and performance. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题为了提高金属凸块的上表面和与其连接的布线层之间的连接的可靠性，为了提高布线板的成品率，使用金属凸块作为层间连接装置的布线板，以及进一步通过增强布线层之间或布线板之间的绝缘部分来增强电特性。解决方案：通过金属的直接金属接合，例如铜 - 铜键合，金属凸块28的顶表面和与其连接的布线膜10（16）连接。此外，空气或含有空气的发泡树脂12用作层间绝缘膜。因此，金属凸块的顶表面与布线层之间的连接的可靠性得到改善，并且可以提高布线板的产量。当需要使用空气或发泡树脂的层间绝缘时，层间绝缘体的介电常数减小到降低布线电路板或使用其的电子电路的寄生电容，从而提高电路特性和性能。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005121604A Wiring board for ic inspection and its manufacturing method 有权
标题翻译： IC检验接线板及其制造方法
公开(公告)号：JP2005121604A
公开(公告)日：2005-05-12
申请号：JP2003359648
申请日：2003-10-20
申请人： Akutowan:Kk , North:Kk , 株式会社アクトワン , 株式会社ノース
发明人： OKUMA MASASHI , SUZUKI NOBUSHI , IKENAGA KAZUO , OHIRA HIROSHI
IPC分类号： G01R31/26 , H01R33/76
摘要： PROBLEM TO BE SOLVED: To provide a wiring board for IC inspection capable of adjusting properly the relative position between an IC electrode loaded on an IC acceptance part and an electrode for IC contact, by arranging properly the electrode for IC contact on the wiring board in the region (IC acceptance part) surrounded by an IC acceptance wall.
SOLUTION: This wiring board for IC inspection has a constitution wherein the IC acceptance wall 8 formed by molding, shaping and hardening a fluid insulating material is provided on the upper surface of the wiring board 1, and the IC acceptance wall 8 is bonded integrally with the upper surface of the wiring board 1 by shaping and hardening of the fluid insulating material, and a group of the electrodes 2 for IC contact carried by the wiring board 1 is arranged in the IC acceptance part 23 defined by the IC acceptance wall 8.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供用于IC检查的布线基板，可以适当地调整装载在IC接收部件上的IC电极和IC接触用电极之间的相对位置，通过适当地布置IC接触用电极区域内的接线板（IC验收部分）由IC验收墙包围。解决方案：用于IC检查的接线板具有这样的结构，其中在接线板1的上表面上设置有通过模制，成形和硬化流体绝缘材料形成的IC接收壁8，并且IC接收壁8是通过流体绝缘材料的成形和硬化与布线板1的上表面一体地结合在一起，并且由IC接受部23限定的IC接收部分23中布置由布线板1携带的一组用于IC接触的电极2 （C）2005，JPO＆NCIPI

4. 发明专利

JP2005045191A Manufacturing method for wiring circuit board and for multi-layer wiring board 审中-公开
标题翻译：电路板和多层接线板的制造方法
公开(公告)号：JP2005045191A
公开(公告)日：2005-02-17
申请号：JP2003289319
申请日：2003-08-07
申请人： North:Kk , 株式会社ノース
发明人： IIJIMA ASAO , IKENAGA KAZUO , OHIRA HIROSHI , MITSUNARI NAOHITO , ENDO KIMIYOSHI , KATO TAKASHI
IPC分类号： H05K3/40 , H01L23/12 , H05K3/46
CPC分类号： H01L2924/01029 , H01L2924/01078 , H01L2924/14 , H01L2924/3025
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for a wiring circuit board which is excellent in productivity and is highly integrated. SOLUTION: A surface whereon bumps 104 are formed is coated with a liquid-state insulating material using a curtain coater or the like, and a bake treatment is applied thereto to form an insulating film 107. The front surface of the insulating film 107 is ground until completely exposing a top surface of the bumps 104, thereby equalizing the thickness of the insulating film 107 and the height of the bumps 104. A projection 109 made of a metal is then formed on the top surface of the bumps 104 by plating. A metal layer 101 for wiring film formation is then partially etched to form wiring films 111. The wiring films 111 are connected with the bumps 104 via an etching stopper layer 105. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种生产率优异且高度一体化的布线电路板的制造方法。解决方案：使用帘式涂布机等在其上形成有凸起104的表面涂覆液态绝缘材料，并施加烘烤处理以形成绝缘膜107.绝缘膜的前表面 107被研磨直到完全暴露凸起104的顶表面，从而使绝缘膜107的厚度和凸块104的高度相等。然后，在凸块104的顶表面上形成由金属制成的突起109 电镀。然后对用于布线膜形成的金属层101进行部分蚀刻以形成布线膜111.布线膜111经由蚀刻阻挡层105与凸块104连接。版权所有（C）2005，JPO＆NCIPI

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