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1. 发明申请

US20070056366A1 Flow sensor 有权
标题翻译：流量传感器
公开(公告)号：US20070056366A1
公开(公告)日：2007-03-15
申请号：US11330969
申请日：2006-01-13
申请人： Noriyuki Sakuma , Naoki Yamamoto , Kenichi Takeda , Hiroshi Fukuda
发明人： Noriyuki Sakuma , Naoki Yamamoto , Kenichi Takeda , Hiroshi Fukuda
IPC分类号： G01F1/68
CPC分类号： G01F1/6845 , G01F1/699 , G01P5/10
摘要： The present invention provides a technology capable of achieving a highly-sensitive flow sensor, by forming a metal film having a relatively high TCR on a semiconductor substrate via an insulating film. A measurement device which is a thermal fluid flow sensor includes a heat element, resistance temperature detectors (upstream-side resistance temperature detector and downstream-side resistance temperature detector), and a resistance temperature detector for air which are all formed of a first metal film. The first metal film is formed of an α-Ta film having a resistivity lower than three times the resistivity of a Ta ingot and obtained by deposition through sputtering on an amorphous film containing metal.
摘要翻译：本发明提供一种能够通过在绝缘膜上在半导体衬底上形成具有较高TCR的金属膜来实现高灵敏度的流量传感器的技术。作为热流体流量传感器的测量装置包括热元件，电阻温度检测器（上游侧电阻温度检测器和下游侧电阻温度检测器）以及空气的电阻温度检测器，全部由第一金属膜。第一金属膜由具有低于Ta锭的电阻率的三倍的α-Ta膜形成，并且通过溅射沉积在含有金属的非晶膜上而获得。

2. 发明授权

US07404320B2 Flow sensor using a heat element and a resistance temperature detector formed of a metal film 有权
标题翻译：使用热元件的流量传感器和由金属膜形成的电阻温度检测器
公开(公告)号：US07404320B2
公开(公告)日：2008-07-29
申请号：US11330969
申请日：2006-01-13
申请人： Noriyuki Sakuma , Naoki Yamamoto , Kenichi Takeda , Hiroshi Fukuda
发明人： Noriyuki Sakuma , Naoki Yamamoto , Kenichi Takeda , Hiroshi Fukuda
IPC分类号： G01F1/68
CPC分类号： G01F1/6845 , G01F1/699 , G01P5/10
摘要： The present invention provides a technology capable of achieving a highly-sensitive flow sensor, by forming a metal film having a relatively high TCR on a semiconductor substrate via an insulating film. A measurement device which is a thermal fluid flow sensor includes a heat element, resistance temperature detectors (upstream-side resistance temperature detector and downstream-side resistance temperature detector), and a resistance temperature detector for air which are all formed of a first metal film. The first metal film is formed of an α-Ta film having a resistivity lower than three times the resistivity of a Ta ingot and obtained by deposition through sputtering on an amorphous film containing metal.
摘要翻译：本发明提供一种能够通过在绝缘膜上在半导体衬底上形成具有较高TCR的金属膜来实现高灵敏度的流量传感器的技术。作为热流体流量传感器的测量装置包括热元件，电阻温度检测器（上游侧电阻温度检测器和下游侧电阻温度检测器）以及空气的电阻温度检测器，全部由第一金属膜。第一金属膜由具有低于Ta锭的电阻率的三倍的α-Ta膜形成，并且通过溅射沉积在含有金属的非晶膜上而获得。

3. 再颁专利

USRE43660E1 Flow sensor using a heat element and a resistance temperature detector formed of a metal film 有权
标题翻译：使用热元件的流量传感器和由金属膜形成的电阻温度检测器
公开(公告)号：USRE43660E1
公开(公告)日：2012-09-18
申请号：US12805390
申请日：2010-07-28
申请人： Noriyuki Sakuma , Naoki Yamamoto , Kenichi Takeda , Hiroshi Fukuda
发明人： Noriyuki Sakuma , Naoki Yamamoto , Kenichi Takeda , Hiroshi Fukuda
IPC分类号： G01F1/68
CPC分类号： G01F1/6845 , G01F1/699 , G01P5/10
摘要： The present invention provides a technology capable of achieving a highly-sensitive flow sensor, by forming a metal film having a relatively high TCR on a semiconductor substrate via an insulating film. A measurement device which is a thermal fluid flow sensor includes a heat element, resistance temperature detectors (upstream-side resistance temperature detector and downstream-side resistance temperature detector), and a resistance temperature detector for air which are all formed of a first metal film. The first metal film is formed of an α-Ta film having a resistivity lower than three times the resistivity of a Ta ingot and obtained by deposition through sputtering on an amorphous film containing metal.
摘要翻译：本发明提供一种能够通过在绝缘膜上在半导体衬底上形成具有较高TCR的金属膜来实现高灵敏度的流量传感器的技术。作为热流体流量传感器的测量装置包括热元件，电阻温度检测器（上游侧电阻温度检测器和下游侧电阻温度检测器）以及空气的电阻温度检测器，全部由第一金属膜。第一金属膜由电阻率低于Ta锭的电阻率的三倍且通过溅射沉积在含有金属的非晶膜上获得的α-Ta膜形成。

4. 发明授权

US06596638B1 Polishing method 有权
标题翻译：抛光方法
公开(公告)号：US06596638B1
公开(公告)日：2003-07-22
申请号：US09618999
申请日：2000-07-18
申请人： Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
发明人： Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
IPC分类号： H01L21302
CPC分类号： C23F3/06 , B24B37/04 , C09G1/02 , C09K3/1463 , H01L21/02074 , H01L21/3212 , H01L21/7684
摘要： A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items, such as slurries and polishing pads, is reduced. A metal film formed on an insulating film having a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.
摘要翻译：抑制了划痕，剥离，凹陷和侵蚀的抛光技术，不需要复杂的清洁处理和浆料供应/处理设备，并且消耗品如浆料和抛光垫的成本降低。在具有凹槽的绝缘膜上形成的金属膜用含有氧化剂和使氧化物水溶性但不含抛光磨料的物质的抛光溶液抛光。

5. 发明授权

US07279425B2 Polishing method 有权
标题翻译：抛光方法
公开(公告)号：US07279425B2
公开(公告)日：2007-10-09
申请号：US11581375
申请日：2006-10-17
申请人： Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
发明人： Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
IPC分类号： H01L21/302
CPC分类号： C23F3/06 , B24B37/04 , C09G1/02 , C09K3/1463 , H01L21/02074 , H01L21/3212 , H01L21/7684
摘要： A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced. A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.
摘要翻译：抑制了划痕，剥离，凹陷和侵蚀的抛光技术，不需要复杂的清洁工艺和浆料供应/加工设备，并且消耗品如浆料和抛光垫的成本降低。在包含凹槽的绝缘膜上形成的金属膜用含有氧化剂和使氧化物溶于水但不含抛光磨料的物质的抛光溶液抛光。

6. 发明申请

US20050074967A1 Polishing method 有权
标题翻译：抛光方法
公开(公告)号：US20050074967A1
公开(公告)日：2005-04-07
申请号：US10441063
申请日：2003-05-20
申请人： Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
发明人： Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
IPC分类号： B24B37/00 , B24B37/04 , C09G1/02 , C09K3/14 , H01L21/02 , H01L21/304 , H01L21/321 , H01L21/4763
CPC分类号： C23F3/06 , B24B37/04 , C09G1/02 , C09K3/1463 , H01L21/02074 , H01L21/3212 , H01L21/7684
摘要： A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.
摘要翻译：抑制了划痕，剥离，凹陷和侵蚀的抛光技术，不需要复杂的清洁处理和浆料供应/处理设备，并且消耗品如浆料和抛光垫的成本降低。在绝缘膜上形成的金属膜包括用包含氧化剂的抛光溶液和使氧化物水溶性但不含抛光磨料的物质抛光的凹槽。

7. 发明授权

US06864584B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US06864584B2
公开(公告)日：2005-03-08
申请号：US10272942
申请日：2002-10-18
申请人： Yuko Hanaoka , Kenji Hinode , Kenichi Takeda , Daisuke Kodama , Noriyuki Sakuma
发明人： Yuko Hanaoka , Kenji Hinode , Kenichi Takeda , Daisuke Kodama , Noriyuki Sakuma
IPC分类号： H01L23/52 , H01L21/3205 , H01L23/532 , H01L23/48 , H01L29/40
CPC分类号： H01L23/53209 , H01L2924/0002 , H01L2924/00
摘要： In extremely minute copper wiring the width or the thickness of which is equal to or shorter than approximately the double length of the mean free path of a copper atom, a value of the resistance may be larger, compared with aluminum wiring of the same extent and it is difficult to realize wiring having small resistance. To solve such a problem, aluminum wiring is used for wiring having form in which the respective resistivities ρ of both wirings have the relation of ρAl
摘要翻译：在极细铜线中，其宽度或厚度等于或小于铜原子的平均自由程的双倍长度，与相同程度的铝布线相比，电阻值可能较大，难以实现电阻小的布线。为了解决这样的问题，铝布线用于布线，其中两个布线的电阻率rho具有rhoAl = rhoCu的关系。结果，可以实现具有小电阻的半导体器件，高速传输信号并且设置有多层布线层。

8. 发明授权

US06117775A Polishing method 有权
公开(公告)号：US06117775A
公开(公告)日：2000-09-12
申请号：US182438
申请日：1998-10-30
申请人： Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
发明人： Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
IPC分类号： B24B37/00 , B24B37/04 , C09G1/02 , C09K3/14 , H01L21/02 , H01L21/304 , H01L21/321 , H01L21/302
CPC分类号： C23F3/06 , B24B37/04 , C09G1/02 , C09K3/1463 , H01L21/02074 , H01L21/3212 , H01L21/7684
摘要： A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items, such as slurries and polishing pads, is reduced. A metal film formed on an insulating film having a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.

9. 发明授权

US07132367B2 Polishing method 有权
标题翻译：抛光方法
公开(公告)号：US07132367B2
公开(公告)日：2006-11-07
申请号：US10441063
申请日：2003-05-20
申请人： Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
发明人： Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
IPC分类号： H01L21/302
CPC分类号： C23F3/06 , B24B37/04 , C09G1/02 , C09K3/1463 , H01L21/02074 , H01L21/3212 , H01L21/7684
摘要： A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.
摘要翻译：抑制了划痕，剥离，凹陷和侵蚀的抛光技术，不需要复杂的清洁处理和浆料供应/处理设备，并且消耗品如浆料和抛光垫的成本降低。在绝缘膜上形成的金属膜包括用包含氧化剂的抛光溶液和使氧化物水溶性但不含抛光磨料的物质抛光的凹槽。

10. 发明授权

US07563716B2 Polishing method 有权
标题翻译：抛光方法
公开(公告)号：US07563716B2
公开(公告)日：2009-07-21
申请号：US11693383
申请日：2007-03-29
申请人： Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
发明人： Seiichi Kondo , Yoshio Homma , Noriyuki Sakuma , Kenichi Takeda , Kenji Hinode
IPC分类号： H01L21/302
CPC分类号： C23F3/06 , B24B37/04 , C09G1/02 , C09K3/1463 , H01L21/02074 , H01L21/3212 , H01L21/7684
摘要： A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced. A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.
摘要翻译：抑制了划痕，剥离，凹陷和侵蚀的抛光技术，不需要复杂的清洁工艺和浆料供应/加工设备，并且消耗品如浆料和抛光垫的成本降低。在包含凹槽的绝缘膜上形成的金属膜用含有氧化剂和使氧化物溶于水但不含抛光磨料的物质的抛光溶液抛光。

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