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1. 发明授权

US08509278B2 Light emitting device and optical apparatus using the same 失效
标题翻译：发光装置及使用其的光学装置
公开(公告)号：US08509278B2
公开(公告)日：2013-08-13
申请号：US12929657
申请日：2011-02-07
申请人： Kazunari Saito , Noriyuki Banno , Kota Tokuda
发明人： Kazunari Saito , Noriyuki Banno , Kota Tokuda
IPC分类号： H01S5/00
CPC分类号： H01S5/22 , B82Y20/00 , G11B7/1275 , H01S5/02272 , H01S5/02461 , H01S5/02476 , H01S5/0425 , H01S5/2214 , H01S5/3432 , H01S5/34326 , H01S5/34333 , H01S5/4043 , H01S5/4087 , H01S2301/18
摘要： A light emitting device includes: a support base; a first light emitting element which is provided at one surface side of the support base and has a first substrate; and a second light emitting element which is provided between the first light emitting element and the support base and has a second substrate, which has a light emitting section as a semiconductor layer and a peripheral section other than the light emitting section at the first light emitting element side of the second substrate, and which has an embedded layer formed of a material with higher heat conductivity than the semiconductor layer in the peripheral section.
摘要翻译：发光装置包括：支撑基座; 第一发光元件，其设置在所述支撑基座的一个表面侧，并具有第一基板; 以及第二发光元件，其设置在所述第一发光元件和所述支撑基座之间，并且具有第二基板，所述第二基板在所述第一发光区域具有作为半导体层的发光部和除了所述发光部以外的周边部元件侧，并且具有由与周边部分中的半导体层相比更高的导热性的材料形成的嵌入层。

2. 发明申请

US20100215073A1 LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20100215073A1
公开(公告)日：2010-08-26
申请号：US12706822
申请日：2010-02-17
申请人： Hiroyuki Fukasawa , Yuichi Hamaguchi , Takeharu Asano , Keigo Aga , Noriyuki Banno
发明人： Hiroyuki Fukasawa , Yuichi Hamaguchi , Takeharu Asano , Keigo Aga , Noriyuki Banno
IPC分类号： H01S5/40 , H01L21/50
CPC分类号： H01S5/0224 , H01L24/29 , H01L24/83 , H01L2224/83 , H01L2924/351 , H01S5/02272 , H01S5/02276 , H01S5/32341 , H01S5/405 , H01S5/4087 , H01L2924/00
摘要： A light-emitting device formed by easily mounting a light-emitting element onto a supporting base and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a supporting base including a depression section on a top surface thereof, the depression section having an inclined surface on a side wall thereof; a first light-emitting element arranged on a bottom surface of the depression section; and a second light-emitting element arranged on the first light-emitting element and the supporting base.
摘要翻译：提供了通过将发光元件容易地安装到支撑基底上而形成的发光器件和制造发光器件的方法。发光装置包括：支撑基座，其在其顶表面上包括凹陷部分，所述凹陷部分在其侧壁上具有倾斜表面; 布置在所述凹陷部分的底表面上的第一发光元件; 以及布置在第一发光元件和支撑基座上的第二发光元件。

3. 发明申请

US20110211610A1 Light emitting device and optical apparatus using the same 失效
标题翻译：发光装置及使用其的光学装置
公开(公告)号：US20110211610A1
公开(公告)日：2011-09-01
申请号：US12929657
申请日：2011-02-07
申请人： Kazunari Saito , Noriyuki Banno , Kota Tokuda
发明人： Kazunari Saito , Noriyuki Banno , Kota Tokuda
IPC分类号： H01S5/40 , H01S5/323
CPC分类号： H01S5/22 , B82Y20/00 , G11B7/1275 , H01S5/02272 , H01S5/02461 , H01S5/02476 , H01S5/0425 , H01S5/2214 , H01S5/3432 , H01S5/34326 , H01S5/34333 , H01S5/4043 , H01S5/4087 , H01S2301/18
摘要： A light emitting device includes: a support base; a first light emitting element which is provided at one surface side of the support base and has a first substrate; and a second light emitting element which is provided between the first light emitting element and the support base and has a second substrate, which has a light emitting section as a semiconductor layer and a peripheral section other than the light emitting section at the first light emitting element side of the second substrate, and which has an embedded layer formed of a material with higher heat conductivity than the semiconductor layer in the peripheral section.
摘要翻译：发光装置包括：支撑基座; 第一发光元件，其设置在所述支撑基座的一个表面侧，并具有第一基板; 以及第二发光元件，其设置在所述第一发光元件和所述支撑基座之间，并且具有第二基板，所述第二基板在所述第一发光区域具有作为半导体层的发光部和除了所述发光部以外的周边部元件侧，并且具有由与周边部分中的半导体层相比更高的导热性的材料形成的嵌入层。

4. 发明授权

US08654810B2 Light-emitting device and method of manufacturing the same 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US08654810B2
公开(公告)日：2014-02-18
申请号：US12706822
申请日：2010-02-17
申请人： Hiroyuki Fukasawa , Yuichi Hamaguchi , Takeharu Asano , Keigo Aga , Noriyuki Banno
发明人： Hiroyuki Fukasawa , Yuichi Hamaguchi , Takeharu Asano , Keigo Aga , Noriyuki Banno
IPC分类号： H01S5/00
CPC分类号： H01S5/0224 , H01L24/29 , H01L24/83 , H01L2224/83 , H01L2924/351 , H01S5/02272 , H01S5/02276 , H01S5/32341 , H01S5/405 , H01S5/4087 , H01L2924/00
摘要： A light-emitting device formed by easily mounting a light-emitting element onto a supporting base and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a supporting base including a depression section on a top surface thereof, the depression section having an inclined surface on a side wall thereof; a first light-emitting element arranged on a bottom surface of the depression section; and a second light-emitting element arranged on the first light-emitting element and the supporting base.
摘要翻译：提供了通过将发光元件容易地安装到支撑基底上而形成的发光器件和制造发光器件的方法。发光装置包括：支撑基座，其在其顶表面上包括凹陷部分，所述凹陷部分在其侧壁上具有倾斜表面; 布置在所述凹陷部分的底表面上的第一发光元件; 以及布置在第一发光元件和支撑基座上的第二发光元件。

5. 发明申请

US20110006664A1 LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：发光装置及其制造方法
公开(公告)号：US20110006664A1
公开(公告)日：2011-01-13
申请号：US12888653
申请日：2010-09-23
申请人： Yuichi Hamaguchi , Noriyuki Banno
发明人： Yuichi Hamaguchi , Noriyuki Banno
IPC分类号： F21K99/00 , H01J9/00
CPC分类号： H01S5/4025 , G11B7/1275 , G11B2007/0006 , H01S5/02 , H01S5/4087
摘要： The present invention provides a light emitting device solving weakness caused by bonding between first and second light emitting elements and a method of manufacturing the same. A chip-shaped first light emitting element and a second light emitting element overlapped each other are disposed on a supporting base. Four island-shaped projections are provided on the top face of the supporting base, and support the second light emitting element. The projections are formed by wet-etching or dry-etching the supporting base, and a pad electrode is provided on the top face of the projection. The pad electrode is electrically connected to the second light emitting element and is also electrically connected to a wire.
摘要翻译：本发明提供一种解决由第一和第二发光元件之间的结合引起的弱点的发光器件及其制造方法。芯片形的第一发光元件和彼此重叠的第二发光元件设置在支撑基座上。四个岛形突起设置在支撑基座的顶面上，并支撑第二发光元件。通过对支撑基底进行湿式蚀刻或干法蚀刻来形成突起，并且在突起的顶面上设置焊盘电极。焊盘电极电连接到第二发光元件并且还电连接到电线。

6. 发明授权

US08138663B2 Light emitting device and method of manufacturing the same 失效
标题翻译：发光元件及其制造方法
公开(公告)号：US08138663B2
公开(公告)日：2012-03-20
申请号：US12888653
申请日：2010-09-23
申请人： Yuichi Hamaguchi , Noriyuki Banno
发明人： Yuichi Hamaguchi , Noriyuki Banno
IPC分类号： H01J1/62 , H01S5/00 , H05B33/00
CPC分类号： H01S5/4025 , G11B7/1275 , G11B2007/0006 , H01S5/02 , H01S5/4087
摘要： The present invention provides a light emitting device solving weakness caused by bonding between first and second light emitting elements and a method of manufacturing the same. A chip-shaped first light emitting element and a second light emitting element overlapped each other are disposed on a supporting base. Four island-shaped projections are provided on the top face of the supporting base, and support the second light emitting element. The projections are formed by wet-etching or dry-etching the supporting base, and a pad electrode is provided on the top face of the projection. The pad electrode is electrically connected to the second light emitting element and is also electrically connected to a wire.
摘要翻译：本发明提供一种解决由第一和第二发光元件之间的结合引起的弱点的发光器件及其制造方法。芯片形的第一发光元件和彼此重叠的第二发光元件设置在支撑基座上。四个岛形突起设置在支撑基座的顶面上，并支撑第二发光元件。通过对支撑基底进行湿式蚀刻或干法蚀刻来形成突起，并且在突起的顶面上设置焊盘电极。焊盘电极电连接到第二发光元件并且还电连接到电线。

7. 发明申请

US20110200064A1 Optical device and optical apparatus 审中-公开
标题翻译：光学装置和光学装置
公开(公告)号：US20110200064A1
公开(公告)日：2011-08-18
申请号：US12929274
申请日：2011-01-12
申请人： Noriyuki Banno
发明人： Noriyuki Banno
IPC分类号： H01S5/02
CPC分类号： H01S5/0224 , H01L2224/16145 , H01L2224/48463 , H01S5/0216 , H01S5/0226 , H01S5/02272 , H01S5/32341 , H01S5/4087
摘要： An optical device includes: an optical element having a first light-emitting region in the vicinity of a first surface and a first metal layer in contact with at least a region of the first surface which does not face the first light-emitting region; a support body disposed on the side of the optical element toward which the first surface faces; and a fuse-bonding layer disposed between the first surface and the support body and in a region which does not face the first light-emitting region, the fuse-bonding layer bonding the first metal layer and the support body.
摘要翻译：光学装置包括：具有在第一表面附近的第一发光区域和与第一表面的至少不与第一发光区域相对的区域的第一金属层的光学元件; 设置在所述光学元件的与所述第一表面面对的一侧的支撑体; 以及设置在所述第一表面和所述支撑体之间并且在不面对所述第一发光区域的区域中的熔丝接合层，所述熔丝键合层将所述第一金属层和所述支撑体接合。

8. 发明授权

US5739709A Phase frequency detecting circuit 失效
标题翻译：相位频率检测电路
公开(公告)号：US5739709A
公开(公告)日：1998-04-14
申请号：US721053
申请日：1996-09-26
申请人： Noriyuki Banno
发明人： Noriyuki Banno
IPC分类号： H03L7/085 , G01R23/06 , H03D3/02 , H03D13/00 , H03L7/087 , H04L27/227
CPC分类号： H03D13/003 , H03L7/087
摘要： A phase frequency detecting circuit is designed to produce an output voltage which varies with respect to an input phase difference between a base phase and a reference phase. Herein, a first phase frequency comparator produces a first phase error signal which is proportional to the input phase difference. A first integration circuit performs integration on the first phase error signal to produce a control voltage. Next, a second phase frequency comparator receives a frequency-divided base phase and a frequency-divided reference phase to produce a second phase error signal. A second integration circuit performs integration on the second phase error signal to produce a frequency-divided control voltage. An offset voltage creating circuit creates an offset voltage. Herein, the offset voltage is created based on the frequency-divided control voltage; and a sign thereof is determined responsive to a relationship between the control voltage and frequency-divided control voltage. An offset imparting circuit adds the offset voltage to the frequency-divided control voltage, then, the addition result is amplified to produce the output voltage. Incidentally, an amplifier can be further provided to produce an amplified output voltage based on the frequency-divided control voltage. The amplified output voltage is used instead of the frequency-divided control voltage and is delivered to the offset voltage creating circuit and offset imparting circuit.
摘要翻译：相位频率检测电路被设计成产生相对于基相和基准相位之间的输入相位差而变化的输出电压。这里，第一相位频率比较器产生与输入相位差成比例的第一相位误差信号。第一积分电路对第一相位误差信号进行积分以产生控制电压。接下来，第二相位频率比较器接收分频基极相位和分频基准相位以产生第二相位误差信号。第二积分电路对第二相位误差信号进行积分以产生分频控制电压。偏移电压产生电路产生偏移电压。这里，基于分频控制电压产生偏移电压; 并且响应于控制电压和分频控制电压之间的关系来确定其符号。偏移赋予电路将偏移电压加到分频控制电压上，然后相加结果被放大以产生输出电压。顺便提及，可以进一步提供放大器以根据分频控制电压产生放大的输出电压。使用放大的输出电压而不是分频控制电压，并且将其输送到偏移电压产生电路和偏移赋予电路。

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