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1. 发明授权

US06881611B1 Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device 有权
标题翻译：用于制造半导体器件的方法和模具，半导体器件和用于安装器件的方法
公开(公告)号：US06881611B1
公开(公告)日：2005-04-19
申请号：US09635124
申请日：2000-08-08
申请人： Norio Fukasawa , Toshimi Kawahara , Muneharu Morioka , Mitsunada Osawa , Yasuhiro Shinma , Hirohisa Matsuki , Masanori Onodera , Junichi Kasai , Shigeyuki Maruyama , Masao Sakuma , Yoshimi Suzuki , Masashi Takenaka
发明人： Norio Fukasawa , Toshimi Kawahara , Muneharu Morioka , Mitsunada Osawa , Yasuhiro Shinma , Hirohisa Matsuki , Masanori Onodera , Junichi Kasai , Shigeyuki Maruyama , Masao Sakuma , Yoshimi Suzuki , Masashi Takenaka
IPC分类号： B29C43/18 , H01L21/301 , H01L21/56 , H01L21/68 , H01L23/24 , H01L23/31 , H01L23/495 , H01L23/498 , H01L25/065 , H01L25/10 , H01L29/06 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/568 , B29C43/18 , B29C2043/3444 , B29C2043/3628 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/566 , H01L23/24 , H01L23/3107 , H01L23/3114 , H01L23/3121 , H01L23/3128 , H01L23/49572 , H01L23/4985 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L29/0657 , H01L2221/68377 , H01L2224/02371 , H01L2224/04105 , H01L2224/13022 , H01L2224/13024 , H01L2224/16225 , H01L2224/16235 , H01L2224/274 , H01L2224/29111 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83191 , H01L2224/85001 , H01L2224/92125 , H01L2224/97 , H01L2225/06517 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06572 , H01L2225/06579 , H01L2225/06582 , H01L2225/06586 , H01L2225/06589 , H01L2225/1005 , H01L2225/1064 , H01L2225/107 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0134 , H01L2924/15174 , H01L2924/15184 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/16195 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3011 , H01L2924/3511 , H01L2924/00 , H01L2924/01028 , H01L2924/01051 , H01L2924/3512 , H01L2224/05599 , H01L2924/00012
摘要： A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.
摘要翻译：一种方法包括：树脂密封步骤，在模具20的空腔28中，将布置有凸块12的半导体元件11的基板16设置在树脂密封步骤中，将树脂35供应到凸块12的位置，使得形成密封凸块12的树脂层13，使由树脂层13密封的凸块12的至少端部露出使突出部12的端部从树脂层13露出的突出电极曝光工序，以及分离工序与树脂层13一起切割基板16，使得半导体元件11彼此分离。

2. 发明授权

US5747874A Semiconductor device, base member for semiconductor device and semiconductor device unit 失效
标题翻译：半导体器件，半导体器件用基板和半导体器件单元
公开(公告)号：US5747874A
公开(公告)日：1998-05-05
申请号：US529784
申请日：1995-09-18
申请人： Masaaki Seki , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Lim Cheang Hai , Koki Otake , Susumu Abe , Junichi Kasai , Masao Sakuma , Yoshimi Suzuki , Yasuhiro Shinma
发明人： Masaaki Seki , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Lim Cheang Hai , Koki Otake , Susumu Abe , Junichi Kasai , Masao Sakuma , Yoshimi Suzuki , Yasuhiro Shinma
IPC分类号： H01L23/13 , H01L23/31 , H01L23/498 , H01L23/538 , H01L25/10 , H01L23/02
CPC分类号： H01L23/49816 , H01L23/13 , H01L23/3128 , H01L23/49805 , H01L25/105 , H01L2224/32225 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2224/83385 , H01L2224/8547 , H01L2225/1023 , H01L2225/1041 , H01L2225/1094 , H01L23/5387 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107
摘要： A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.
摘要翻译：半导体器件包括半导体元件，半导体器件基底元件，其具有安装有半导体元件的元件安装部分，设置在半导体器件基底元件上并与半导体元件电连接的外部连接端子，以及密封半导体元件的树脂元件。半导体器件基底部件包括基部和由基部支撑的引线部。引线部分电连接到外部连接端子。半导体器件基体具有弯曲部分，其中引线部分位于半导体器件基底部件的外侧。弯曲部分位于半导体器件基底部件的边缘部分。

3. 发明授权

US6022759A Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit 失效
标题翻译：半导体装置的制造方法，半导体装置用基板和半导体装置装置
公开(公告)号：US6022759A
公开(公告)日：2000-02-08
申请号：US25327
申请日：1998-02-18
申请人： Masaaki Seki , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Lim Cheang Hai , Koki Otake , Susumu Abe , Junichi Kasai , Masao Sakuma , Yoshimi Suzuki , Yasuhiro Shinma
发明人： Masaaki Seki , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Lim Cheang Hai , Koki Otake , Susumu Abe , Junichi Kasai , Masao Sakuma , Yoshimi Suzuki , Yasuhiro Shinma
IPC分类号： H01L23/13 , H01L23/31 , H01L23/498 , H01L23/538 , H01L25/10 , H01L21/44 , H01L21/58
CPC分类号： H01L23/49816 , H01L23/13 , H01L23/3128 , H01L23/49805 , H01L25/105 , H01L2224/32225 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2224/83385 , H01L2224/8547 , H01L2225/1023 , H01L2225/1041 , H01L2225/1094 , H01L23/5387 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107
摘要： A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.
摘要翻译：半导体器件包括半导体元件，半导体器件基底元件，其具有安装半导体元件的元件安装部分，设置在半导体器件基底元件上并与半导体元件电连接的外部连接端子，以及密封半导体元件的树脂元件。半导体器件基底部件包括基部和由基部支撑的引线部。引线部分电连接到外部连接端子。半导体器件基体具有弯曲部分，其中引线部分位于半导体器件基底部件的外侧。弯曲部分位于半导体器件基底部件的边缘部分。

4. 发明授权

US5666064A Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device 失效
标题翻译：半导体器件，用于承载半导体器件的载体，以及测试和制造半导体器件的方法
公开(公告)号：US5666064A
公开(公告)日：1997-09-09
申请号：US441462
申请日：1995-05-15
申请人： Junichi Kasai , Kazuto Tsuji , Norio Taniguchi , Takashi Mashiko , Masao Sakuma , Yukio Saigo , Yoshiyuki Yoneda , Masashi Takenaka
发明人： Junichi Kasai , Kazuto Tsuji , Norio Taniguchi , Takashi Mashiko , Masao Sakuma , Yukio Saigo , Yoshiyuki Yoneda , Masashi Takenaka
IPC分类号： G01R1/04 , H01L21/56 , H01L21/68 , H01L23/31 , H01L23/433 , H01L23/495 , H01L23/58 , G01R31/28
CPC分类号： G01R1/0433 , G01R1/04 , H01L21/565 , H01L21/6835 , H01L22/32 , H01L23/3107 , H01L23/4334 , H01L23/49517 , H01L23/49541 , H01L23/49555 , H01L23/49572 , H01L2221/68313 , H01L2224/16245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/181 , H01L2924/3011
摘要： A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.
摘要翻译：半导体器件包括分别由内部引线和外部引线构成的多个引线，与引线的内部引线电连接的半导体芯片，以及至少封装引线和半导体芯片的内部引线的封装外引线延伸到封装外面。该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分外部引线仅在封装的阶梯部分内延伸到封装的外侧。

5. 发明授权

US5736428A Process for manufacturing a semiconductor device having a stepped encapsulated package 失效
标题翻译：具有阶梯式密封包装的半导体器件的制造方法
公开(公告)号：US5736428A
公开(公告)日：1998-04-07
申请号：US789661
申请日：1997-01-27
申请人： Junichi Kasai , Kazuto Tsuji , Norio Taniguchi , Takashi Mashiko , Masao Sakuma , Yukio Saigo , Yoshiyuki Yoneda , Masashi Takenaka
发明人： Junichi Kasai , Kazuto Tsuji , Norio Taniguchi , Takashi Mashiko , Masao Sakuma , Yukio Saigo , Yoshiyuki Yoneda , Masashi Takenaka
IPC分类号： G01R1/04 , H01L21/56 , H01L21/68 , H01L23/31 , H01L23/433 , H01L23/495 , H01L23/58 , H01L21/58 , H01L21/60 , H01L21/66
CPC分类号： G01R1/0433 , G01R1/04 , H01L21/565 , H01L21/6835 , H01L22/32 , H01L23/3107 , H01L23/4334 , H01L23/49517 , H01L23/49541 , H01L23/49555 , H01L23/49572 , H01L2221/68313 , H01L2224/16245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/181 , H01L2924/3011
摘要： A process for manufacturing semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.
摘要翻译：一种制造半导体器件的方法，包括分别由内部引线和外部引线构成的多个引线，与内部引线电连接的半导体芯片以及至少封装引线和半导体芯片的内部引线的封装外引线延伸到封装外面。该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分外部引线仅在封装的阶梯部分内延伸到封装的外侧。

6. 发明授权

US5750421A Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device 失效
标题翻译：半导体器件，用于承载半导体器件的载体，以及测试和制造半导体器件的方法
公开(公告)号：US5750421A
公开(公告)日：1998-05-12
申请号：US789625
申请日：1997-01-27
申请人： Junichi Kasai , Kazuto Tsuji , Norio Taniguchi , Takashi Mashiko , Masao Sakuma , Yukio Saigo , Yoshiyuki Yoneda , Masashi Takenaka
发明人： Junichi Kasai , Kazuto Tsuji , Norio Taniguchi , Takashi Mashiko , Masao Sakuma , Yukio Saigo , Yoshiyuki Yoneda , Masashi Takenaka
IPC分类号： G01R1/04 , H01L21/56 , H01L21/68 , H01L23/31 , H01L23/433 , H01L23/495 , H01L23/58 , H01L21/60
CPC分类号： G01R1/0433 , G01R1/04 , H01L21/565 , H01L21/6835 , H01L22/32 , H01L23/3107 , H01L23/4334 , H01L23/49517 , H01L23/49541 , H01L23/49555 , H01L23/49572 , H01L2221/68313 , H01L2224/16245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/181 , H01L2924/3011
摘要： A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.
摘要翻译：一种半导体器件，包括分别由内部引线和外部引线构成的多个引线，与内部引线电连接的半导体芯片，以及至少封装引线和半导体芯片的内部引线的封装，引线从封装外部延伸。该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分外部引线仅在封装的阶梯部分内延伸到封装的外侧。

7. 发明授权

US5475259A Semiconductor device and carrier for carrying semiconductor device 失效
标题翻译：半导体器件和承载半导体器件的载体
公开(公告)号：US5475259A
公开(公告)日：1995-12-12
申请号：US961161
申请日：1992-10-16
申请人： Junichi Kasai , Kazuto Tsuji , Norio Taniguchi , Takashi Mashiko , Masao Sakuma , Yukio Saigo , Yoshiyuki Yoneda , Masashi Takenaka
发明人： Junichi Kasai , Kazuto Tsuji , Norio Taniguchi , Takashi Mashiko , Masao Sakuma , Yukio Saigo , Yoshiyuki Yoneda , Masashi Takenaka
IPC分类号： G01R1/04 , H01L21/56 , H01L21/68 , H01L23/31 , H01L23/433 , H01L23/495 , H01L23/58 , H01L23/02 , H01L23/12 , H01L23/48 , H01L29/40
CPC分类号： G01R1/0433 , G01R1/04 , H01L21/565 , H01L21/6835 , H01L22/32 , H01L23/3107 , H01L23/4334 , H01L23/49517 , H01L23/49541 , H01L23/49555 , H01L23/49572 , H01L2221/68313 , H01L2224/16245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/181 , H01L2924/3011
摘要： A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.
摘要翻译：半导体器件包括分别由内部引线和外部引线构成的多个引线，与引线的内部引线电连接的半导体芯片，以及至少封装引线和半导体芯片的内部引线的封装外引线延伸到封装外面。该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分外部引线仅在封装的阶梯部分内延伸到封装的外侧。

8. 发明申请

US20130015564A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20130015564A1
公开(公告)日：2013-01-17
申请号：US13494408
申请日：2012-06-12
申请人： Hirohisa Matsuki , Masao Sakuma
发明人： Hirohisa Matsuki , Masao Sakuma
IPC分类号： H01L23/552 , H01L21/60
CPC分类号： H01L23/552 , H01L21/561 , H01L21/76898 , H01L24/05 , H01L24/16 , H01L24/73 , H01L24/81 , H01L24/92 , H01L24/97 , H01L2223/6677 , H01L2224/0401 , H01L2224/04026 , H01L2224/0557 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/73253 , H01L2224/81815 , H01L2224/92125 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/12042 , H01L2924/15311 , H01L2924/16152 , H01L2924/167 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01Q1/2283 , H01Q9/0407 , H01L2224/81 , H01L2224/05552 , H01L2924/00
摘要： A semiconductor device (semiconductor module) includes a circuit board (module board) and a semiconductor element mounted on the circuit board. A shielding layer that blocks electromagnetic waves is disposed on the upper surface of the semiconductor element, and an antenna element is disposed over the shielding layer. The semiconductor element and the antenna element are electrically connected to each other by a connecting portion. This structure enables the semiconductor device to be reduced in size and to have both an electromagnetic-wave blocking function and an antenna function.
摘要翻译：半导体器件（半导体模块）包括电路板（模块板）和安装在电路板上的半导体元件。阻挡电磁波的屏蔽层设置在半导体元件的上表面上，天线元件设置在屏蔽层之上。半导体元件和天线元件通过连接部分彼此电连接。该结构能够使半导体器件的尺寸减小并具有电磁波阻挡功能和天线功能。

9. 发明授权

US08994153B2 Semiconductor device having antenna element and method of manufacturing same 有权
标题翻译：具有天线元件的半导体器件及其制造方法
公开(公告)号：US08994153B2
公开(公告)日：2015-03-31
申请号：US13494408
申请日：2012-06-12
申请人： Hirohisa Matsuki , Masao Sakuma
发明人： Hirohisa Matsuki , Masao Sakuma
IPC分类号： H01L23/552 , H01L21/56 , H01L23/00 , H01Q1/22 , H01Q9/04 , H01L21/768
CPC分类号： H01L23/552 , H01L21/561 , H01L21/76898 , H01L24/05 , H01L24/16 , H01L24/73 , H01L24/81 , H01L24/92 , H01L24/97 , H01L2223/6677 , H01L2224/0401 , H01L2224/04026 , H01L2224/0557 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/73253 , H01L2224/81815 , H01L2224/92125 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/12042 , H01L2924/15311 , H01L2924/16152 , H01L2924/167 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01Q1/2283 , H01Q9/0407 , H01L2224/81 , H01L2224/05552 , H01L2924/00
摘要： A semiconductor device (semiconductor module) includes a circuit board (module board) and a semiconductor element mounted on the circuit board. A shielding layer that blocks electromagnetic waves is disposed on the upper surface of the semiconductor element, and an antenna element is disposed over the shielding layer. The semiconductor element and the antenna element are electrically connected to each other by a connecting portion. This structure enables the semiconductor device to be reduced in size and to have both an electromagnetic-wave blocking function and an antenna function.
摘要翻译：半导体器件（半导体模块）包括电路板（模块板）和安装在电路板上的半导体元件。阻挡电磁波的屏蔽层设置在半导体元件的上表面上，天线元件设置在屏蔽层之上。半导体元件和天线元件通过连接部分彼此电连接。该结构能够使半导体器件的尺寸减小并具有电磁波阻挡功能和天线功能。

10. 发明授权

US5656864A Semiconductor device having upper and lower package bodies and manufacturing method thereof 失效
标题翻译：具有上封装体和下封装体的半导体器件及其制造方法
公开(公告)号：US5656864A
公开(公告)日：1997-08-12
申请号：US602269
申请日：1996-02-16
申请人： Hiroyuki Mitsue , Masashi Takenaka , Masao Sakuma
发明人： Hiroyuki Mitsue , Masashi Takenaka , Masao Sakuma
IPC分类号： H01L21/56 , H01L21/60 , H01L23/28 , H01L23/31 , H01L23/433 , H01L23/50 , H01L23/12 , H01L23/04
CPC分类号： H01L21/565 , H01L23/3107 , H01L23/4334 , H01L2224/50
摘要： A semiconductor device in which molding resin is not adhered on test pads of leads extending from a junction of an upper package half-body and a lower package half-body. The semiconductor device can effectively release heat generated by a semiconductor chip molded in a package of the semiconductor device. The semiconductor device includes a semiconductor chip having a plurality of leads connected thereto. A package of the semiconductor device is formed by means of molding. The package is constructed of a first package portion and a second package portion integrally formed into one package. The first package portion has a horizontal section smaller than that of the second package portion so that a portion of each of the leads extends from a part of the package between the first package portion and the second package portion and is exposed on a surface of the second package portion. The semiconductor chip is positioned within the second package portion. A supporting member is provided in the second package portion for supporting the portion of each of the leads and is located inside the second package portion so as to prevent deformation of the leads during molding of the package.
摘要翻译：一种半导体器件，其中模制树脂不粘附在从上封装半体和下封装半体的接合部延伸的引线的测试焊盘上。半导体器件可以有效地释放由半导体器件的封装中模制的半导体芯片产生的热量。半导体器件包括具有与其连接的多个引线的半导体芯片。通过模制形成半导体器件的封装。该包装由一体形成一个包装的第一包装部分和第二包装部分构成。第一封装部分具有比第二封装部分小的水平部分，使得每个引线的一部分从封装的一部分在第一封装部分和第二封装部分之间延伸并暴露在第二包装部分。半导体芯片位于第二封装部分内。支撑构件设置在第二包装部分中，用于支撑每个引线的部分，并且位于第二封装部分的内部，以防止封装成型期间引线的变形。

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