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1. 发明授权

US09007981B2 Electronic device, signal transmission device, and signal transmission method 有权
标题翻译：电子装置，信号传输装置和信号传输方法
公开(公告)号：US09007981B2
公开(公告)日：2015-04-14
申请号：US13384120
申请日：2010-08-09
申请人： Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada , Naoto Nakamura , Yoshiyuki Akiyama
发明人： Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada , Naoto Nakamura , Yoshiyuki Akiyama
IPC分类号： H04H20/71 , H04B7/02 , H04B7/04
CPC分类号： H04B7/022 , H04B7/0413
摘要： Signal distribution, signal switching, and signal collection are performed with a simple configuration. An electronic device comprises a transmission unit (108) for transmitting, as a wireless signal, a signal to be transmitted and a reception unit (208) for receiving the wireless signal transmitted from the transmission unit. In the electronic device, a plurality of pairs of wireless signal transmission points in the transmission unit and wireless signal reception points in the reception unit can be formed. Using the pairs of transmission points and reception points make it possible to execute at least either one of signal distribution in which the same signal to be transmitted from a transmission point is transmitted to the multiple reception points and signal switching in which a signal to be transmitted from a transmission point is selectively transmitted to any of the multiple reception points. The signal to be transmitted is transmitted as a wireless signal. In this case, the signal distribution, signal switching, and signal collection are performed in a wireless signal portion. Since a portion where a signal transmission is performed through electric wiring does not interpose the portion where the signal distribution, signal switching, and signal collection are performed, the signal distribution, signal switching, and signal collection can be performed with a simple configuration.
摘要翻译：以简单的配置进行信号分配，信号切换和信号采集。电子设备包括用于作为无线信号发送要发送的信号的发送单元（108）和用于接收从发送单元发送的无线信号的接收单元（208）。在电子设备中，可以形成发送单元中的多对无线信号发送点和接收单元中的无线信号接收点。使用发送点和接收点对可以执行信号分配中的至少一个，其中从发送点发送的相同信号被发送到多个接收点，并且其中要发送的信号的信号切换从发送点选择性地发送到多个接收点中的任一个。要发送的信号作为无线信号发送。在这种情况下，在无线信号部分中执行信号分配，信号切换和信号采集。由于通过电线执行信号传输的部分不会插入执行信号分配，信号切换和信号收集的部分，所以可以以简单的配置进行信号分配，信号切换和信号收集。

2. 发明申请

US20120120862A1 ELECTRONIC DEVICE, SIGNAL TRANSMISSION DEVICE, AND SIGNAL TRANSMISSION METHOD 有权
标题翻译：电子设备，信号传输设备和信号传输方法
公开(公告)号：US20120120862A1
公开(公告)日：2012-05-17
申请号：US13384120
申请日：2010-08-09
申请人： Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada , Naoto Nakamura , Yoshiyuki Akiyama
发明人： Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada , Naoto Nakamura , Yoshiyuki Akiyama
IPC分类号： H04W92/00 , H04H20/71
CPC分类号： H04B7/022 , H04B7/0413
摘要： Signal distribution, signal switching, and signal collection are performed with a simple configuration. An electronic device comprises a transmission unit (108) for transmitting, as a wireless signal, a signal to be transmitted and a reception unit (208) for receiving the wireless signal transmitted from the transmission unit. In the electronic device, a plurality of pairs of wireless signal transmission points in the transmission unit and wireless signal reception points in the reception unit can be formed. Using the pairs of transmission points and reception points make it possible to execute at least either one of signal distribution in which the same signal to be transmitted from a transmission point is transmitted to the multiple reception points and signal switching in which a signal to be transmitted from a transmission point is selectively transmitted to any of the multiple reception points. The signal to be transmitted is transmitted as a wireless signal. In this case, the signal distribution, signal switching, and signal collection are performed in a wireless signal portion. Since a portion where a signal transmission is performed through electric wiring does not interpose the portion where the signal distribution, signal switching, and signal collection are performed, the signal distribution, signal switching, and signal collection can be performed with a simple configuration.
摘要翻译：以简单的配置进行信号分配，信号切换和信号采集。电子设备包括用于作为无线信号发送要发送的信号的发送单元（108）和用于接收从发送单元发送的无线信号的接收单元（208）。在电子设备中，可以形成发送单元中的多对无线信号发送点和接收单元中的无线信号接收点。使用发送点和接收点对可以执行信号分配中的至少一个，其中从发送点发送的相同信号被发送到多个接收点，并且其中要发送的信号的信号切换从发送点选择性地发送到多个接收点中的任一个。要发送的信号作为无线信号发送。在这种情况下，在无线信号部分中执行信号分配，信号切换和信号采集。由于通过电线执行信号传输的部分不会插入执行信号分配，信号切换和信号收集的部分，所以可以以简单的配置进行信号分配，信号切换和信号收集。

3. 发明授权

US08630209B2 Wireless transmission system and wireless transmission method 有权
标题翻译：无线传输系统和无线传输方式
公开(公告)号：US08630209B2
公开(公告)日：2014-01-14
申请号：US12850214
申请日：2010-08-04
申请人： Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada
发明人： Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada
IPC分类号： H04L5/14 , H04N5/225
CPC分类号： H04B3/52 , H01L23/48 , H01L23/66 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/105 , H01L27/0248 , H01L2223/6677 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2225/1023 , H01L2924/00014 , H01L2924/14 , H01L2924/3011 , H04L12/40013 , H05K1/0239 , H05K1/144 , H05K2201/09618 , H01L2224/45099 , H01L2924/00
摘要： Disclosed herein is a wireless transmission system, including: a plurality of systems of millimeter wave signal transmission lines capable of individually transmitting information in a millimeter waveband independently of each other; a sending section disposed on one end side of each of the plural systems of millimeter wave signal transmission lines; and a reception section disposed on the other end side of each of the plural systems of millimeter wave signal transmission lines. The sending section is adapted to convert a signal of an object of transmission into a millimeter wave signal and supply the millimeter wave signal to the millimeter signal transmission line. The reception section is adapted to receive the millimeter wave signal transmitted thereto through the millimeter wave signal transmission line and convert the received millimeter wave signal into the signal of the object of transmission.
摘要翻译：本文公开了一种无线传输系统，包括：能够独立于毫米波波段单独发送信息的多个毫米波信号传输线系统; 发送部，其设置在所述多个毫米波信号传输线系统中的每一个的一端侧; 以及设置在所述多个毫米波信号传输线系统中的每一个的另一端侧的接收部分。发送部分适于将传输对象的信号转换为毫米波信号，并将毫米波信号提供给毫米波信号传输线。接收部适于接收通过毫米波信号传输线传输的毫米波信号，并将接收的毫米波信号转换成传输对象的信号。

4. 发明申请

US20110038282A1 WIRELESS TRANSMISSION SYSTEM AND WIRELESS TRANSMISSION METHOD 有权
标题翻译：无线传输系统和无线传输方法
公开(公告)号：US20110038282A1
公开(公告)日：2011-02-17
申请号：US12850214
申请日：2010-08-04
申请人： Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada
发明人： Norihito Mihota , Hirofumi Kawamura , Yasuhiro Okada
IPC分类号： H04B7/00 , H04L5/14
CPC分类号： H04B3/52 , H01L23/48 , H01L23/66 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/105 , H01L27/0248 , H01L2223/6677 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2225/1023 , H01L2924/00014 , H01L2924/14 , H01L2924/3011 , H04L12/40013 , H05K1/0239 , H05K1/144 , H05K2201/09618 , H01L2224/45099 , H01L2924/00
摘要： Disclosed herein is a wireless transmission system, including: a plurality of systems of millimeter wave signal transmission lines capable of individually transmitting information in a millimeter waveband independently of each other; a sending section disposed on one end side of each of the plural systems of millimeter wave signal transmission lines; and a reception section disposed on the other end side of each of the plural systems of millimeter wave signal transmission lines. The sending section is adapted to convert a signal of an object of transmission into a millimeter wave signal and supply the millimeter wave signal to the millimeter signal transmission line. The reception section is adapted to receive the millimeter wave signal transmitted thereto through the millimeter wave signal transmission line and convert the received millimeter wave signal into the signal of the object of transmission.
摘要翻译：本文公开了一种无线传输系统，包括：能够独立于毫米波波段单独发送信息的多个毫米波信号传输线系统; 发送部，其设置在所述多个毫米波信号传输线系统中的每一个的一端侧; 以及设置在所述多个毫米波信号传输线系统中的每一个的另一端侧的接收部分。发送部分适于将传输对象的信号转换为毫米波信号，并将毫米波信号提供给毫米波信号传输线。接收部适于接收通过毫米波信号传输线传输的毫米波信号，并将接收的毫米波信号转换成传输对象的信号。

5. 发明申请

US20110037863A1 IMAGING DEVICE 审中-公开
标题翻译：成像装置
公开(公告)号：US20110037863A1
公开(公告)日：2011-02-17
申请号：US12850178
申请日：2010-08-04
申请人： Norihito Mihota , Hirofumi Kawamura , Youtarou Sanada , Ryuichi Yasuhara , Katsuhiko Ueno
发明人： Norihito Mihota , Hirofumi Kawamura , Youtarou Sanada , Ryuichi Yasuhara , Katsuhiko Ueno
IPC分类号： H04N5/228 , G03B17/00 , H01P3/12 , H02J17/00
CPC分类号： H04N5/23264 , G03B17/00 , H01Q9/285 , H02J17/00 , H02J50/12 , H02J50/70 , H04N5/23248 , H04N5/23258 , H04N5/2328 , H04N5/335
摘要： Disclosed herein is an imaging device including: a first substrate having a first communication device; a second substrate having a solid-state imaging device and second communication device to exchange signals with the first substrate; a shake correction section adapted to detect the shake of an enclosure and correct the shake based on the detection result by moving the first substrate in the plane vertical to the optical path; and a millimeter wave signal transmission line that permits transmission of information in the millimeter wave band between the first and second communication devices, wherein a signal to be transmitted between the first and second communication devices is converted into a millimeter wave signal first before being transmitted via the millimeter wave signal transmission line.
摘要翻译：本文公开了一种成像装置，包括：具有第一通信装置的第一基板; 具有固态成像装置的第二基板和与第一基板交换信号的第二通信装置; 抖动校正部，其适于通过在与所述光路垂直的平面中移动所述第一基板，基于所述检测结果来检测所述外壳的抖动并修正所述抖动; 以及允许在第一和第二通信设备之间的毫米波段中的信息传输的毫米波信号传输线，其中在第一和第二通信设备之间传输的信号首先被转换为毫米波信号，然后经过毫米波信号传输线。

6. 发明授权

US09337919B2 Signal transmission system, connector apparatus, electronic device, and signal transmission method 有权
标题翻译：信号传输系统，连接器装置，电子装置和信号传输方法
公开(公告)号：US09337919B2
公开(公告)日：2016-05-10
申请号：US13697210
申请日：2011-05-11
申请人： Hidekazu Kikuchi , Takayuki Mogi , Yoshiyuki Akiyama , Hirofumi Kawamura
发明人： Hidekazu Kikuchi , Takayuki Mogi , Yoshiyuki Akiyama , Hirofumi Kawamura
IPC分类号： H04B7/00 , H04B7/24 , H01P3/12 , H01P5/107 , H04B3/56 , H01R13/66 , H01R103/00 , H01R13/6461 , H01R24/28 , H01R24/76 , H05K1/02
CPC分类号： H01P5/02 , H01P1/208 , H01P3/12 , H01P3/121 , H01P3/165 , H01P5/024 , H01P5/082 , H01P5/087 , H01P5/1022 , H01P5/107 , H01P5/18 , H01P5/182 , H01P5/188 , H01R13/6461 , H01R13/665 , H01R24/28 , H01R24/76 , H01R2103/00 , H04B3/56 , H04B7/24 , H05K1/0225 , H05K1/0239 , H05K2201/093 , H05K2201/09672 , H05K2201/0969 , H05K2201/09754
摘要： A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.
摘要翻译：一种信号传输系统，包括：第一连接器装置和与第一连接器装置耦合的第二连接器装置。第一连接器装置和第二连接器装置耦合在一起以形成电磁场耦合单元，并且传输对象信号被转换成无线电信号，然后通过电磁场耦合单元在第一连接器装置和第二连接器装置。

7. 发明申请

US20130109317A1 SIGNAL TRANSMISSION SYSTEM, CONNECTOR APPARATUS, ELECTRONIC DEVICE, AND SIGNAL TRANSMISSION METHOD 有权
标题翻译：信号传输系统，连接器装置，电子设备和信号传输方法
公开(公告)号：US20130109317A1
公开(公告)日：2013-05-02
申请号：US13697210
申请日：2011-05-11
申请人： Hidekazu Kikuchi , Takayuki Mogi , Yoshiyuki Akiyama , Hirofumi Kawamura
发明人： Hidekazu Kikuchi , Takayuki Mogi , Yoshiyuki Akiyama , Hirofumi Kawamura
IPC分类号： H04B7/24
CPC分类号： H01P5/02 , H01P1/208 , H01P3/12 , H01P3/121 , H01P3/165 , H01P5/024 , H01P5/082 , H01P5/087 , H01P5/1022 , H01P5/107 , H01P5/18 , H01P5/182 , H01P5/188 , H01R13/6461 , H01R13/665 , H01R24/28 , H01R24/76 , H01R2103/00 , H04B3/56 , H04B7/24 , H05K1/0225 , H05K1/0239 , H05K2201/093 , H05K2201/09672 , H05K2201/0969 , H05K2201/09754
摘要： A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.
摘要翻译：一种信号传输系统，包括：第一连接器装置和与第一连接器装置耦合的第二连接器装置。第一连接器装置和第二连接器装置耦合在一起以形成电磁场耦合单元，并且传输对象信号被转换成无线电信号，然后通过电磁场耦合单元在第一连接器装置和第二连接器装置。

8. 发明申请

US20110165839A1 WAVE DIELECTRIC TRANSMISSION DEVICE, MANUFACTURING METHOD THEREOF, AND IN-MILLIMETER WAVE DIELECTRIC TRANSMISSION METHOD 有权
标题翻译：波导电力传输装置及其制造方法，以及内置波导传输方法
公开(公告)号：US20110165839A1
公开(公告)日：2011-07-07
申请号：US13063057
申请日：2009-09-15
申请人： Hirofumi Kawamura , Yasuhiro Okada
发明人： Hirofumi Kawamura , Yasuhiro Okada
IPC分类号： H04B5/00 , H01Q15/08 , H01P11/00
CPC分类号： H01P3/16 , G01S7/032 , G01S2013/9371 , H01P5/02 , H01Q9/0407 , H01Q9/045 , H04B1/3822 , H04B10/00 , H04B10/501 , H04B10/5161 , H04B10/556 , Y10T29/49016
摘要： Provided is an in-millimeter wave dielectric transmission device including a first signal processing board for processing a millimeter wave signal, a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal, and a viscoelastic member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The viscoelastic member constitutes a dielectric transmission path. With such a configuration, the viscoelastic member absorbs vibration when external force is applied to the signal processing boards, so that vibration of the first signal processing board and the second signal processing board can be reduced, and a millimeter wave signal between the signal processing boards can be transmitted through the viscoelastic member at a high speed without using connectors and cables.
摘要翻译：提供了一种毫米波介质传输装置，其包括用于处理毫米波信号的第一信号处理板，信号耦合到第一信号处理板以接收毫米波信号的第二信号处理板，并执行关于毫米波信号和设置在第一信号处理板和第二信号处理板之间并具有预定的相对介电常数和预定的介电损耗系数的粘弹元件。粘弹性构件构成电介质传输路径。通过这样的结构，当对信号处理板施加外力时，粘弹性体吸收振动，能够降低第一信号处理板和第二信号处理板的振动，并且信号处理板之间的毫米波信号可以高速传输通过粘弹性部件，而不使用连接器和电缆。

9. 发明授权

US08983399B2 Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system 有权
标题翻译：半导体装置及其制造方法，毫米波介质传输装置及其制造方法以及毫米波电介质传输系统
公开(公告)号：US08983399B2
公开(公告)日：2015-03-17
申请号：US13141726
申请日：2009-12-08
申请人： Hirofumi Kawamura , Yasuhiro Okada
发明人： Hirofumi Kawamura , Yasuhiro Okada
IPC分类号： H04B1/38 , H01L23/48 , H01L23/66 , H01L23/00 , H01L25/065 , H01L25/10 , H01P3/12 , H01Q9/04 , H01Q23/00
CPC分类号： H01Q21/00 , H01L23/48 , H01L23/66 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2223/6627 , H01L2223/6677 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01042 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1903 , H01L2924/19104 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01P3/121 , H01P3/122 , H01Q9/0407 , H01Q23/00 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.
摘要翻译：提供了一种毫米波介电传输装置。毫米波介质传输装置包括：设置在一个插入器基板上并能够进行毫米波介质传输的半导体芯片，连接到半导体芯片的天线结构，包括被构造成覆盖半导体的模制树脂的两个半导体封装芯片和天线结构，以及设置在两个半导体封装之间以传输毫米波信号的电介质传输路径。安装半导体封装，使得其天线结构被布置成介于其间的电介质传输路径。

10. 发明申请

US20110309893A1 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, IN-MILLIMETER-WAVE DIELECTRIC TRANSMISSION DEVICE, METHOD OF MANUFACTURING THE SAME, AND IN-MILLIMETER-WAVE DIELECTRIC TRANSMISSION SYSTEM 有权
标题翻译：半导体器件，其制造方法，内置波导介质传输器件，其制造方法和内置波导介质传输系统
公开(公告)号：US20110309893A1
公开(公告)日：2011-12-22
申请号：US13141726
申请日：2009-12-08
申请人： Hirofumi Kawamura , Yasuhiro Okada
发明人： Hirofumi Kawamura , Yasuhiro Okada
IPC分类号： H01P1/10 , H01L31/18
CPC分类号： H01Q21/00 , H01L23/48 , H01L23/66 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2223/6627 , H01L2223/6677 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01042 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1903 , H01L2924/19104 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01P3/121 , H01P3/122 , H01Q9/0407 , H01Q23/00 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.
摘要翻译：提供了一种毫米波介电传输装置。毫米波电介质传输装置包括设置在一个插入器基板上并能够进行毫米波电介质传输的半导体芯片，连接到半导体芯片的天线结构，包括被构造成覆盖半导体的模制树脂的两个半导体封装芯片和天线结构，以及设置在两个半导体封装之间以传输毫米波信号的电介质传输路径。安装半导体封装，使得其天线结构被布置成介于其间的电介质传输路径。

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