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1. 发明申请

US20050032347A1 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces 有权
标题翻译：用于接触基底和由具有电接触表面的基底组成的装置的电接触表面的方法
公开(公告)号：US20050032347A1
公开(公告)日：2005-02-10
申请号：US10491137
申请日：2001-09-25
申请人： Kerstin Hase , Laurence Amigues , Herbert Schwarzbauer , Norbert Seliger , Karl Weidner , Jorg Zapf , Matthias Rebhan
发明人： Kerstin Hase , Laurence Amigues , Herbert Schwarzbauer , Norbert Seliger , Karl Weidner , Jorg Zapf , Matthias Rebhan
IPC分类号： H01L23/051 , H01L23/373 , H01L23/482 , H01L25/07 , H01L25/18 , H05K1/03 , H05K3/10 , H05K3/32 , H05K3/46 , H01L21/44 , H01L21/4763
CPC分类号： H05K3/4605 , H01L23/051 , H01L23/3735 , H01L23/482 , H01L24/24 , H01L24/82 , H01L25/072 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45124 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H05K1/0306 , H05K3/108 , H05K3/32 , H05K3/4632 , H05K2201/0129 , H05K2201/0154 , H05K2203/068 , H05K2203/085 , H05K2203/1469 , H01L2924/00 , H01L2224/48
摘要： A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.
摘要翻译：将基于聚酰亚胺或环氧树脂的薄膜在真空下层压到基材的表面上，使得薄膜紧密地覆盖表面并附着在其上。在表面上形成的接触表面通过打开薄膜中的窗口而被覆盖。在每个未覆盖的接触表面和一层金属之间以平面方式建立接触。这就形成了大面积接触，为功率半导体芯片提供高电流密度。

2. 发明申请

US20070216025A1 Device having a contacting structure 有权
标题翻译：具有接触结构的装置
公开(公告)号：US20070216025A1
公开(公告)日：2007-09-20
申请号：US11728900
申请日：2007-03-27
申请人： Norbert Seliger , Karl Weidner , Jorg Zapf
发明人： Norbert Seliger , Karl Weidner , Jorg Zapf
IPC分类号： H01L23/485
CPC分类号： H01L24/82 , H01L23/5389 , H01L24/24 , H01L25/072 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45015 , H01L2224/45124 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/15787 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01L2224/48 , H01L2924/00 , H01L2924/2076 , H01L2924/01004 , H01L2924/00015
摘要： A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.
摘要翻译：将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

3. 发明申请

US20060192290A1 Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours 有权
标题翻译：功率半导体的连接技术包括一层遵循表面轮廓的电绝缘材料
公开(公告)号：US20060192290A1
公开(公告)日：2006-08-31
申请号：US10547173
申请日：2004-01-26
申请人： Norbert Seliger , Karl Weidner , Jorg Zapf
发明人： Norbert Seliger , Karl Weidner , Jorg Zapf
IPC分类号： H01L23/48 , H01L21/4763
CPC分类号： H01L24/82 , H01L23/5389 , H01L24/24 , H01L25/072 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45015 , H01L2224/45124 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/15787 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01L2224/48 , H01L2924/00 , H01L2924/2076 , H01L2924/01004 , H01L2924/00015
摘要： A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.
摘要翻译：将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

4. 发明申请

US20070175656A1 Electrical component on a substrate and method for production thereof 有权
标题翻译：基板上的电气部件及其制造方法
公开(公告)号：US20070175656A1
公开(公告)日：2007-08-02
申请号：US10551207
申请日：2004-03-09
申请人： Franz Auerbach , Bernd Gutsmann , Thomas Licht , Norbert Seliger , Kart Weidner , Jorg Zapf
发明人： Franz Auerbach , Bernd Gutsmann , Thomas Licht , Norbert Seliger , Kart Weidner , Jorg Zapf
IPC分类号： H05K1/16
CPC分类号： H01L23/552 , H01L23/49844 , H01L23/5389 , H01L24/24 , H01L24/36 , H01L24/40 , H01L24/82 , H01L24/86 , H01L24/97 , H01L2224/45124 , H01L2224/73267 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H01L2924/3025 , H01L2224/82 , H01L2924/00 , H01L2224/48 , H01L2224/37099
摘要： In an arrangement having at least one substrate, at least one electrical component is disposed on a surface section of the substrate and is provided with an electrical contact area, and at least one electrical contact lug has an electrical connecting area electrically contacting the contact area of the component. The connecting area of the contact lug and the contact area of the component are interconnected so that at least one zone of the contact lug protrudes beyond the area of the component. The contact lug is provided with at least one electrically conducting film while the electrically conducting film is provided with the electrical connecting area of the contact lug. The arrangement is particularly useful for large-area, low-inductive contacting of power semiconductor chips, as it allows for high current density.
摘要翻译：在具有至少一个基板的布置中，至少一个电气部件设置在基板的表面部分上并且设置有电接触区域，并且至少一个电接触凸耳具有电接触区域的接触面积组件。接触片的连接区域和部件的接触区域互连，使得接触片的至少一个区域突出超出部件的区域。接触片设置有至少一个导电膜，而导电膜设置有接触片的电连接区域。这种布置对于功率半导体芯片的大面积低电感接触特别有用，因为它允许高电流密度。

5. 发明申请

US20070190290A1 Economical minaturized assembly and connection technology for leds and other optoelectronic modules 有权
标题翻译： LED和其他光电子模块的经济小型化组装和连接技术
公开(公告)号：US20070190290A1
公开(公告)日：2007-08-16
申请号：US10579542
申请日：2004-10-27
申请人： Ewald Gunther , Jorg-Erich Sorg , Karl Weidner , Jorg Zapf
发明人： Ewald Gunther , Jorg-Erich Sorg , Karl Weidner , Jorg Zapf
IPC分类号： B32B3/10
CPC分类号： H01L33/486 , H01L24/24 , H01L24/82 , H01L24/97 , H01L31/0203 , H01L33/44 , H01L33/46 , H01L33/62 , H01L2224/2402 , H01L2224/24051 , H01L2224/24226 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/12041 , H01L2924/12044 , H01L2924/15747 , H01L2924/181 , Y10T428/24331 , H01L2224/82 , H01L2924/00
摘要： An economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules is provided. A manufactured item in accordance with this technology includes a substrate with an optoelectronic component contacted in a planar manner.
摘要翻译：提供了一种用于LED和其他光电子模块的经济型小型化组装和连接技术。根据该技术的制造物品包括具有以平面方式接触的光电子部件的基板。

6. 发明授权

US07759754B2 Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules 有权
标题翻译： LED和其他光电模块的经济型小型化组装和连接技术
公开(公告)号：US07759754B2
公开(公告)日：2010-07-20
申请号：US10579542
申请日：2004-10-27
申请人： Ewald Gunther , Jorg-Erich Sorg , Karl Weidner , Jorg Zapf
发明人： Ewald Gunther , Jorg-Erich Sorg , Karl Weidner , Jorg Zapf
IPC分类号： H01L31/113
CPC分类号： H01L33/486 , H01L24/24 , H01L24/82 , H01L24/97 , H01L31/0203 , H01L33/44 , H01L33/46 , H01L33/62 , H01L2224/2402 , H01L2224/24051 , H01L2224/24226 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/12041 , H01L2924/12044 , H01L2924/15747 , H01L2924/181 , Y10T428/24331 , H01L2224/82 , H01L2924/00
摘要： An economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules is provided. A manufactured item in accordance with this technology includes a substrate with an optoelectronic component contacted in a planar manner.
摘要翻译：提供了一种用于LED和其他光电子模块的经济型小型化组装和连接技术。根据该技术的制造物品包括具有以平面方式接触的光电子部件的基板。

7. 发明授权

US07274102B2 Contacting device, testing method and corresponding production method 有权
标题翻译：接触装置，试验方法及相应的生产方法
公开(公告)号：US07274102B2
公开(公告)日：2007-09-25
申请号：US11374391
申请日：2006-03-13
申请人： Andreas Wolter , Jorg Zapf
发明人： Andreas Wolter , Jorg Zapf
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： G01R1/0466 , G01R1/0483 , H01L2224/81385
摘要： A contacting device comprises a carrier device with a first surface, a plurality of first terminal regions on the first surface, at least one elastic elevation on the first surface, and a plurality of interconnects, each running from a respective of the first terminal regions to an upper side of the elastic elevation. The plurality of first terminal regions is configured so that signals of a tester device can be fed to the plurality of first terminal regions, the interconnects have first contact regions located at the upper side of the elastic elevation configured to be contacted electrically with corresponding second contact regions of an integrated circuit, and the first contact regions comprise first particles for roughening the surface of the first contact regions.
摘要翻译：接触装置包括具有第一表面的载体装置，第一表面上的多个第一端子区域，第一表面上的至少一个弹性高度以及多个互连件，每个互连件从相应的第一端子区域延伸到弹性高度的上侧。多个第一端子区域被配置为使得测试器装置的信号可以被馈送到多个第一端子区域，互连具有位于弹性高度的上侧的第一接触区域，其被配置为与相应的第二接触件电接触区域，并且第一接触区域包括用于使第一接触区域的表面粗糙化的第一颗粒。

8. 发明授权

US09364863B2 Method for forming an ultrasound transducer array 有权
标题翻译：用于形成超声换能器阵列的方法
公开(公告)号：US09364863B2
公开(公告)日：2016-06-14
申请号：US13748415
申请日：2013-01-23
申请人： Stefan Stegmeier , Jorg Zapf , Xuanming Lu
发明人： Stefan Stegmeier , Jorg Zapf , Xuanming Lu
IPC分类号： H04R31/00 , B06B1/06 , H01L27/20 , H01L41/33 , H01L41/338
CPC分类号： B06B1/0629 , H01L27/20 , H01L41/33 , H01L41/338
摘要： An ultrasound transducer array is formed with stealth dicing. A laser is used to form defects within the piezoelectric substrate and along the desired kerf locations. The substrate is fractured along the defects. A controlled expansion, such as using thermal expansion, may be used to establish the desired kerf width. Spacers may be used to maintain the desired kerf width. The kerfs are filled to create the ultrasound transducer array.
摘要翻译：超声换能器阵列形成有隐形切割。使用激光器在压电基片内形成缺陷并沿着所需的切口位置。基板沿缺陷断裂。可以使用诸如使用热膨胀的受控膨胀来建立所需的切口宽度。垫片可用于保持所需的切口宽度。填充切口以创建超声换能器阵列。

9. 发明申请

US20050150685A1 Configuration having an electronic device electrically connected to a printed circuit board 有权
标题翻译：具有与印刷电路板电连接的电子装置的结构
公开(公告)号：US20050150685A1
公开(公告)日：2005-07-14
申请号：US11008081
申请日：2004-12-09
申请人： Harry Hedler , Jorg Zapf
发明人： Harry Hedler , Jorg Zapf
IPC分类号： H01L21/60 , H01L23/31 , H01L23/485 , H01L23/498 , H05K3/28 , H05K1/18
CPC分类号： B23P19/00 , H01L23/3185 , H01L23/49894 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/02333 , H01L2224/0401 , H01L2224/13008 , H01L2224/131 , H01L2224/13566 , H01L2224/1357 , H01L2224/136 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/81193 , H01L2224/81355 , H01L2224/81395 , H01L2224/81815 , H01L2224/8192 , H01L2224/83907 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/19043 , H05K1/16 , H05K3/284 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49155 , Y10T29/53178 , H01L2224/29099 , H01L2924/00014
摘要： A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board with external contacts. The printed circuit board is electrically coupled to the electronic device. At least the metallic surfaces of the configuration are covered by a plasma-polymerized polymer layer.
摘要翻译：一种配置以及一种配置方法，其中该配置具有至少一个具有相关接触连接的电子设备和至少一个具有外部触点的印刷电路板。印刷电路板电耦合到电子设备。至少该构型的金属表面被等离子体聚合的聚合物层覆盖。

10. 发明申请

US20140203687A1 Stealth Dicing for Ultrasound Transducer Array 有权
标题翻译：超声波传感器阵列隐形切片
公开(公告)号：US20140203687A1
公开(公告)日：2014-07-24
申请号：US13748415
申请日：2013-01-23
申请人： Stefan Stegmeier , Jorg Zapf , Xuanming Lu
发明人： Stefan Stegmeier , Jorg Zapf , Xuanming Lu
IPC分类号： H01L41/35 , H01L41/08
CPC分类号： B06B1/0629 , H01L27/20 , H01L41/33 , H01L41/338
摘要： An ultrasound transducer array is formed with stealth dicing. A laser is used to form defects within the piezoelectric substrate and along the desired kerf locations. The substrate is fractured along the defects. A controlled expansion, such as using thermal expansion, may be used to establish the desired kerf width. Spacers may be used to maintain the desired kerf width. The kerfs are filled to create the ultrasound transducer array.
摘要翻译：超声换能器阵列形成有隐形切割。使用激光器在压电基片内形成缺陷并沿着所需的切口位置。基板沿缺陷断裂。可以使用诸如使用热膨胀的受控膨胀来建立所需的切口宽度。垫片可用于保持所需的切口宽度。填充切口以创建超声换能器阵列。

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