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    • 1. 发明授权
    • Laser machining apparatus
    • 激光加工设备
    • US5310986A
    • 1994-05-10
    • US52897
    • 1993-04-26
    • Nobuyuki ZumotoToshinori YagiMasao IzumoMasaaki Tanaka
    • Nobuyuki ZumotoToshinori YagiMasao IzumoMasaaki Tanaka
    • B23K26/06H01L21/00H05K3/00B23K26/00
    • H05K3/0026B23K26/066H01L21/67092H05K2203/056
    • A laser machining apparatus comprises a mask, a reflecting mirror and an imaging optical system. The laser light reflected by the mask and also by the reflecting mirror passes through the mask and images on the work for machining the work. The laser machining apparatus comprises means for causing said mask to move in parallel with said work for machining the work. This laser machining apparatus is able to machine a work having a large surface using small apertured mask. Another type of laser machining apparatus comprises a mask and a platform and an imaging optical system. The mask and the work are puts in the same plane of the platform and driven so that the image of the mask is mapped on the work via the imaging optical system. The laser machining apparatus is able to machine a large area at low price and high accuracy.
    • 激光加工装置包括掩模,反射镜和成像光学系统。 由掩模和反射镜反射的激光通过掩模和工件上的图像进行加工。 激光加工设备包括用于使所述面罩与所述工件并行移动以便加工工件的装置。 该激光加工装置能够使用小孔径掩模加工具有大表面的工件。 另一种类型的激光加工设备包括掩模和平台以及成像光学系统。 掩模和工作放在平台的同一平面上并被驱动,使得掩模的图像经由成像光学系统映射到工件上。 激光加工设备能够以低价格和高精度加工大面积。