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    • 2. 发明申请
    • Image display device
    • 图像显示装置
    • US20070029924A1
    • 2007-02-08
    • US11498136
    • 2006-08-03
    • Nobuyuki UshifusaNobuhiko FukuokaShigeru MatsuyamaHiroshi KawasakiChikae KuboAkira IshiiHiroshi KikuchiTakuo TamuraYasushi Sano
    • Nobuyuki UshifusaNobuhiko FukuokaShigeru MatsuyamaHiroshi KawasakiChikae KuboAkira IshiiHiroshi KikuchiTakuo TamuraYasushi Sano
    • H01J63/04H01J1/62
    • H01J31/127H01J29/04H01J29/481
    • An image display device according to the present invention comprises a back panel on which a plurality of pixels each having a thin film electron emitter are arranged two-dimensionally, a front panel disposed opposite the back panel on which phosphor layer is formed, and a sealing frame with which the back panel and the front panel are fixed mutually to seal the plurality of pixels and the phosphor layer in a space enclosed by the back panel, the front panel, and the sealing frame, and is characterized in that double-layered signal lines each electrically connected to a group of the plurality of pixels are formed on the back panel, each of the double-layered signal lines consists of a lower-level electrode made from a silver paste and an upper-level electrode covering at least a part of the lower-level electrode laminated in this order on the back panel. The lower-level electrode is shaped e.g. by coating a groove formed in a surface of the back panel with the silver paste, and a surface of the upper-level electrode is used e.g. for an electrode of the thin film electron emitter, also. According to the configuration, the present invention reduces wiring resistance of the signal lines each electrically connected to the thin film electron emitters as well as improves planarity of each tunneling junction of the thin film electron emitters to suppress dispersion of electron emission property thereof among the pixels.
    • 根据本发明的图像显示装置包括:背面板,每个具有薄​​膜电子发射器的多个像素二维布置;前面板,与设置有荧光体层的后面板相对设置;以及密封 后面板和前面板相互固定的框架,用于将多个像素和荧光体层密封在由后面板,前面板和密封框所包围的空间中,其特征在于双层信号 在后面板上形成有与多个像素的一组电连接的线,每个双层信号线由由银膏制成的下层电极和覆盖至少一部分的上层电极组成, 的下层电极按顺序层压在后面板上。 下层电极的形状如 通过用银膏涂覆形成在后面板的表面中的凹槽,并且使用上层电极的表面。 对于薄膜电子发射体的电极也是如此。 根据该结构,本发明降低了与薄膜电子发射体电连接的信号线的布线电阻,并且提高了薄膜电子发射体的每个隧道结的平坦度,以抑制像素间的电子发射特性的分散 。
    • 5. 发明授权
    • Two-component curable solventless adhesive
    • 双组分固化无溶剂粘合剂
    • US08716427B2
    • 2014-05-06
    • US11658403
    • 2005-02-04
    • Akihiro ImaiKazuaki ImamuraTaiji MorimotoHiroshi KawasakiMikio Matsufuji
    • Akihiro ImaiKazuaki ImamuraTaiji MorimotoHiroshi KawasakiMikio Matsufuji
    • C08G18/00C09J4/00C09J101/00
    • C09J175/04C08G18/10
    • A two-component curable solventless adhesive which enables a laminated composite film comprising a barrier layer and a plastic film laminated with each other to maintain excellent appearance and adhesive strength for a long period even after a sterilization treatment at high temperature, and to appropriately adjust a reaction between a base resin and a curing agent during a production of the laminated composite film. The two-component curable solventless adhesive comprises a base resin and a curing agent, wherein the base resin contains a polyol having an acid group and a secondary or tertiary terminal hydroxyl group accounting for 30% or more of the entire terminal hydroxyl groups of the polyol, and the curing agent contains an isocyanate group-terminated urethane prepolymer containing at least an aralkyl polyisocyanate and/or a modified substance thereof as a raw polyisocyanate, and a content of a low molecular weight polyisocyanate is defined.
    • 即使在高温下进行灭菌处理后,能够使包含阻挡层和塑料膜的层合复合膜能够长时间保持良好的外观和粘合强度的双组分固化无溶剂粘合剂,并适当地调节 在层合复合膜的制造中,基础树脂与固化剂的反应。 双组分可固化无溶剂粘合剂包括基础树脂和固化剂,其中基础树脂含有具有酸基和仲或叔末端羟基的多元醇占多元醇全部末端羟基的30%以上 ,固化剂含有至少含有芳烷基多异氰酸酯和/或其改性物质的异氰酸酯基封端的氨基甲酸酯预聚物作为原料多异氰酸酯,并且定义了低分子量多异氰酸酯的含量。
    • 6. 发明授权
    • Printed circuit board and method of manufacturing the same
    • 印刷电路板及其制造方法
    • US08151455B2
    • 2012-04-10
    • US12143214
    • 2008-06-20
    • Kazunori HamadaHiroshi KawasakiTomoaki Ozaki
    • Kazunori HamadaHiroshi KawasakiTomoaki Ozaki
    • H05K3/02
    • H05K3/0047H05K1/0237H05K1/0268H05K3/429H05K2203/0207H05K2203/0242Y10T29/49124Y10T29/49156Y10T29/49167
    • A method of manufacturing a printed circuit board is provided. The method includes preliminarily forming a plurality of test pattern layers for detecting the depth of an inner layer in a multilayer printed circuit board such that at least a part of a lower test pattern layer is not overlaid with any upper test pattern layer when viewed from a drill entrance side, and preliminarily forming a surface conductor layer; applying a voltage between the surface conductor layer and the test pattern layers; performing drilling toward one test pattern layer, and detecting a current produced when the drill comes into contact with the test pattern to measure the depth of the layer (D1); performing drilling toward the other test pattern layer, and measuring the depth of the layer (D2); and performing drilling up to just before the conductor-wiring layer based on a depth calculated from D1 and D2.
    • 提供一种制造印刷电路板的方法。 该方法包括预先形成多个用于检测多层印刷电路板中的内层的深度的测试图案层,使得当从一个多层印刷电路板观察时,下部测试图案层的至少一部分不与任何上部测试图案层重叠 钻入口侧,并预先形成表面导体层; 在表面导体层和测试图案层之间施加电压; 对一个测试图案层执行钻孔,并且检测当钻头与测试图案接触时产生的电流以测量层(D1)的深度; 对另一测试图案层执行钻孔,并测量层的深度(D2); 并且基于从D1和D2计算的深度,在导体布线层之前执行钻孔。