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1. 发明授权

US06664479B2 Flexible printed circuit board 有权
标题翻译：柔性印刷电路板
公开(公告)号：US06664479B2
公开(公告)日：2003-12-16
申请号：US09844097
申请日：2001-04-27
申请人： Nobuo Tanabe , Kenichi Okada , Yukihiko Kurosawa , Takayuki Imai , Sadamitsu Jumonji , Masahiko Arai , Masahiro Kaizu
发明人： Nobuo Tanabe , Kenichi Okada , Yukihiko Kurosawa , Takayuki Imai , Sadamitsu Jumonji , Masahiko Arai , Masahiro Kaizu
IPC分类号： H05K100
CPC分类号： H05K3/386 , H05K1/0393 , H05K3/281
摘要： A flexible printed circuit board (FPC) comprises a base film; a base film side adhesive layer provided on the base film; a metal foil layer on which a pattern circuit is formed, provided on the base film side adhesive layer; and a cover layer side adhesive layer provided on the metal foil layer, wherein at least one of the base film side adhesive and the cover layer side adhesive layer has a higher glass transition temperature than an operating temperature of the flexible printed circuit board, so that the FPC has a stable flexibility at high temperature.
摘要翻译：柔性印刷电路板（FPC）包括基膜; 设置在基膜上的基膜侧粘合剂层; 形成有图案电路的金属箔层，设置在基膜侧粘合层上; 以及设置在金属箔层上的覆盖层侧粘合剂层，其中基膜侧粘合剂和覆盖层侧粘合剂层中的至少一个具有比柔性印刷电路板的操作温度更高的玻璃化转变温度，使得 FPC在高温下具有稳定的柔韧性。

2. 外观设计

USD496337S1 Diaphragm for a switch 失效
标题翻译：开关的隔膜
公开(公告)号：USD496337S1
公开(公告)日：2004-09-21
申请号：US29190721
申请日：2003-09-26
申请人： Masahiro Kaizu , Koji Hirai
设计人： Masahiro Kaizu , Koji Hirai

3. 发明授权

US06442043B1 Chip assembly module of bump connection type using a multi-layer printed circuit substrate 失效
标题翻译：使用多层印刷电路基板的凸块连接型芯片组装模块
公开(公告)号：US06442043B1
公开(公告)日：2002-08-27
申请号：US09635338
申请日：2000-08-09
申请人： Yoshihito Seki , Masahiro Kaizu
发明人： Yoshihito Seki , Masahiro Kaizu
IPC分类号： H05K118
CPC分类号： H01L23/42 , H01L21/563 , H01L23/36 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81191 , H01L2924/00014 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A multi-layer structured printed circuit substrate having an upper conductive layer and a lower conductive layer with an inter-layer insulating layer is used. A chip assembly part of bump connection type is formed by forming openings in a portion of the upper conductive layer and the inter-layer insulating layer in order to expose the lower conductive layer. A bear chip is buried in the chip assembly part for assembly. A sealing member is filled in the lower space of the bear chip. A flat plate type radiating plate having an opening corresponding to the chip assembly part is located on the substrate and a heat conductive adhesive is filled between the radiating plate and the bear chip.
摘要翻译：使用具有上导电层和具有层间绝缘层的下导电层的多层结构印刷电路基板。通过在上导电层和层间绝缘层的一部分中形成开口而形成突起连接型的芯片组件部分，以暴露下导电层。将芯片埋在芯片组装部件中进行组装。密封构件填充在熊芯片的下部空间中。具有对应于芯片组装部分的开口的平板型散热板位于基板上，并且在散热板和熊芯片之间填充导热粘合剂。

4. 发明授权

US06387734B1 Semiconductor package, semiconductor device, electronic device and production method for semiconductor package 有权
标题翻译：半导体封装，半导体器件，电子器件及半导体封装的生产方法
公开(公告)号：US06387734B1
公开(公告)日：2002-05-14
申请号：US09762681
申请日：2001-05-24
申请人： Masatoshi Inaba , Takanao Suzuki , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka
发明人： Masatoshi Inaba , Takanao Suzuki , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka
IPC分类号： H01L2144
CPC分类号： H01L23/3114 , H01L24/05 , H01L24/11 , H01L24/12 , H01L2224/0231 , H01L2224/0401 , H01L2224/05551 , H01L2224/05557 , H01L2224/05558 , H01L2224/11334 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/12033 , H01L2924/12042 , H01L2924/14 , H01L2924/351 , H01L2924/00
摘要： An insulating layer (3) is formed on a Si wafer (1). An opening portion is made in this insulating layer (3), and subsequently a rerouting layer (2) is formed. Next, a resin layer (4) is formed on the rerouting layer (2). The resin layer (4) is then cured so that the rerouting layer (2) and a Cu foil (5) are bonded to each other through the resin layer (4). Thereafter, a ring-like opening portion (4a) is made in the resin layer (4), and a Cu plating layer (8) is formed inside this opening portion (4a).
摘要翻译：在Si晶片（1）上形成绝缘层（3）。在该绝缘层（3）中形成开口部，随后形成重路由层（2）。接着，在重路由层（2）上形成树脂层（4）。然后使树脂层（4）固化，使得重新布线层（2）和Cu箔（5）通过树脂层（4）彼此接合。之后，在树脂层（4）中形成有环状的开口部（4a），在该开口部（4a）的内部形成有Cu镀层（8）。

5. 发明授权

US07157363B2 Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion 有权
标题翻译：用于制造半导体封装的方法，其具有形成在树脂突出部上的重路由电极
公开(公告)号：US07157363B2
公开(公告)日：2007-01-02
申请号：US10949386
申请日：2004-09-27
申请人： Takanao Suzuki , Masatoshi Inaba , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka , Masatoshi Inaba , Nobuyuki Sadakata , Mutsumi Masumoto , Kenji Masumoto
发明人： Takanao Suzuki , Masatoshi Inaba , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka , Masatoshi Inaba , Nobuyuki Sadakata , Mutsumi Masumoto , Kenji Masumoto
IPC分类号： H01L21/44
CPC分类号： H01L24/10 , H01L21/56 , H01L23/3107 , H01L23/3114 , H01L23/525 , H01L24/13 , H01L2224/02125 , H01L2224/0231 , H01L2224/02351 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05548 , H01L2224/05567 , H01L2224/05572 , H01L2224/05644 , H01L2224/13 , H01L2224/13021 , H01L2224/13022 , H01L2224/13023 , H01L2224/13099 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2224/05552 , H01L2924/00 , H01L2924/00014
摘要： An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.
摘要翻译：形成在与电极焊盘（2）相适应的位置处具有开口部（3a）的绝缘层（3）。接着，在绝缘层（3）上形成树脂突起部（4）。此后，形成抗蚀剂膜，该抗蚀剂膜具有在与开口部分（31a）相适应的区域中形成的开口部分，树脂突出部分（4）和夹在其间的区域。通过使用抗蚀剂膜作为掩模，通过电解铜电镀形成Cu镀层（6）。

6. 发明申请

US20060016679A1 Membrane for key switch and the key switch 有权
标题翻译：钥匙开关和钥匙开关膜
公开(公告)号：US20060016679A1
公开(公告)日：2006-01-26
申请号：US10527399
申请日：2003-09-11
申请人： Masahiro Kaizu , Tadanori Ominato , Koji Hirai
发明人： Masahiro Kaizu , Tadanori Ominato , Koji Hirai
IPC分类号： H01H5/18
CPC分类号： H01H13/702 , H01H13/48 , H01H2203/054 , H01H2205/018 , H01H2215/036
摘要： The present invention provides a key switch diaphragm capable of obtaining a good click feeling and capable of avoiding contact failure and having a high durability. A key switch diaphragm 30 comprises a thin plate having flexibility and conductivity, and the key switch diaphragm 30 includes a truncated pedestal 16, and a spherical domical portion 18 being raised toward an upper portion of the pedestal 16 on the side of the upper portion of the pedestal 16. The domical portion 18 is provided at its substantially central portion with an outwardly raised portion 32 being raised toward an outer surface of the domical portion 18. An edge of the outwardly raised portion 32 on the side of its inner surface forms a contact 34.
摘要翻译：本发明提供一种能够获得良好的咔嗒感并能够避免接触不良并具有高耐久性的钥匙开关隔膜。钥匙开关隔膜30包括具有柔性和导电性的薄板，并且钥匙开关隔膜30包括截头基座16和朝向基座16的上部的上侧部分的凸起部分18上升的球形圆顶部分18 基座16。圆顶部分18设置在其基本上中心部分处，向外的凸起部分32朝向顶部18的外表面升高。在其内表面侧上的向外凸起部分32的边缘形成触点34。

7. 发明授权

US07023088B2 Semiconductor package, semiconductor device and electronic device 失效
标题翻译：半导体封装，半导体器件和电子器件
公开(公告)号：US07023088B2
公开(公告)日：2006-04-04
申请号：US10442298
申请日：2003-05-21
申请人： Takanao Suzuki , Masatoshi Inaba , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka , Masatoshi Inaba , Nobuyuki Sadakata , Mutsumi Masumoto , Kenji Masumoto
发明人： Takanao Suzuki , Masatoshi Inaba , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka , Masatoshi Inaba , Nobuyuki Sadakata , Mutsumi Masumoto , Kenji Masumoto
IPC分类号： H01L23/48
CPC分类号： H01L24/10 , H01L21/56 , H01L23/3107 , H01L23/3114 , H01L23/525 , H01L24/13 , H01L2224/02125 , H01L2224/0231 , H01L2224/02351 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05548 , H01L2224/05567 , H01L2224/05572 , H01L2224/05644 , H01L2224/13 , H01L2224/13021 , H01L2224/13022 , H01L2224/13023 , H01L2224/13099 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2224/05552 , H01L2924/00 , H01L2924/00014
摘要： An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.
摘要翻译：形成在与电极焊盘（2）相适应的位置处具有开口部（3a）的绝缘层（3）。接着，在绝缘层（3）上形成树脂突起部（4）。此后，形成抗蚀剂膜，该抗蚀剂膜具有在与开口部分（31a）相适应的区域中形成的开口部分，树脂突出部分（4）和夹在其间的区域。通过使用抗蚀剂膜作为掩模，通过电解铜电镀形成Cu镀层（6）。

8. 发明申请

US20050037539A1 Semiconductor package, semiconductor device, electronic device, and method for producing semiconductor package 有权
标题翻译：半导体封装，半导体器件，电子器件以及半导体封装的制造方法
公开(公告)号：US20050037539A1
公开(公告)日：2005-02-17
申请号：US10949386
申请日：2004-09-27
申请人： Takanao Suzuki , Masatoshi Inaba , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka , Masatoshi Inaba , Nobuyuki Sadakata , Mutsumi Masumoto , Kenji Masumoto
发明人： Takanao Suzuki , Masatoshi Inaba , Tadanori Ominato , Masahiro Kaizu , Akihito Kurosaka , Masatoshi Inaba , Nobuyuki Sadakata , Mutsumi Masumoto , Kenji Masumoto
IPC分类号： H01L21/56 , H01L23/31 , H01L23/485 , H01L23/525 , H01L21/44
CPC分类号： H01L24/10 , H01L21/56 , H01L23/3107 , H01L23/3114 , H01L23/525 , H01L24/13 , H01L2224/02125 , H01L2224/0231 , H01L2224/02351 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05548 , H01L2224/05567 , H01L2224/05572 , H01L2224/05644 , H01L2224/13 , H01L2224/13021 , H01L2224/13022 , H01L2224/13023 , H01L2224/13099 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2224/05552 , H01L2924/00 , H01L2924/00014
摘要： An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.
摘要翻译：形成在与电极焊盘（2）一致的位置具有开口部（3a）的绝缘层（3）。接着，在绝缘层（3）上形成树脂突起部（4）。此后，形成抗蚀剂膜，其具有在与开口部分（3a），树脂突出部分（4）和夹在其间的区域相适应的区域中形成的开口部分。通过使用抗蚀剂膜作为掩模，通过电解铜电镀形成Cu镀层（6）。

9. 发明授权

US5471023A Light illumination membrane switch with reduced size and improved light illumination 失效
标题翻译：具有减小尺寸和改善光照照明的光照明薄膜开关
公开(公告)号：US5471023A
公开(公告)日：1995-11-28
申请号：US995896
申请日：1992-12-23
申请人： Masahiro Kaizu , Atsuhiro Horii
发明人： Masahiro Kaizu , Atsuhiro Horii
IPC分类号： H01H13/02 , H01H13/06 , H01H13/702 , H01H9/00
CPC分类号： H01L24/33 , H01H13/702 , H01H2213/01 , H01H2219/014 , H01H2219/04 , H01H2219/056 , H01H2219/06 , H01H2219/062 , H01H2223/002 , H01H2231/05 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/12041 , H01L2924/12042 , H01L2924/16153 , H01L2924/181
摘要： A light illumination membrane switch having a configuration with a reduced size, capable of realizing an effective light illumination of the keys and a highly reliable operation even under the high humidity environment. The switch has a light source section using an LED bare chip element for emitting lights to illuminate the key section which is directly mounted on the electrode circuit member of the printed circuit board. The switch may include a translucent diffuser member having a cavity region for directly transmitting the lights emitted from the light source section to the key section. The switch may include a translucent diffuser member having a side wall portion defining an opening such that the translucent diffuser member and the printed circuit board are assembled together by inserting the printed circuit board into the opening defined by the side wall portion. The switch may include a translucent diffuser member having reflective coating layer formed thereon for reflecting the lights emitted from the light source section into the translucent diffuser member.
摘要翻译：一种具有尺寸减小的结构的光照明薄膜开关，即使在高湿度环境下，也能实现键的有效光照射和高可靠性的操作。开关具有使用LED裸芯片元件的光源部分，用于发射光以照亮直接安装在印刷电路板的电极电路部件上的键部分。开关可以包括具有用于将从光源部分发射的光直接传递到键部分的空腔区域的半透明漫射器部件。开关可以包括半透明的扩散器构件，其具有限定开口的侧壁部分，使得通过将印刷电路板插入由侧壁部分限定的开口中而将透光漫射构件和印刷电路板组装在一起。开关可以包括其上形成有反射涂层的半透明漫射构件，用于将从光源部分发射的光反射到半透明漫射构件中。

10. 发明授权

US07205491B2 Membrane for key switch and the key switch 有权
标题翻译：钥匙开关和钥匙开关膜
公开(公告)号：US07205491B2
公开(公告)日：2007-04-17
申请号：US10527399
申请日：2003-09-11
申请人： Masahiro Kaizu , Tadanori Ominato , Koji Hirai
发明人： Masahiro Kaizu , Tadanori Ominato , Koji Hirai
IPC分类号： H01H9/26
CPC分类号： H01H13/702 , H01H13/48 , H01H2203/054 , H01H2205/018 , H01H2215/036
摘要： The present invention provides a key switch diaphragm capable of obtaining a good click feeling and capable of avoiding contact failure and having a high durability. A key switch diaphragm 30 comprises a thin plate having flexibility and conductivity, and the key switch diaphragm 30 includes a truncated pedestal 16, and a spherical domical portion 18 being raised toward an upper portion of the pedestal 16 on the side of the upper portion of the pedestal 16. The domical portion 18 is provided at its substantially central portion with an outwardly raised portion 32 being raised toward an outer surface of the domical portion 18. An edge of the outwardly raised portion 32 on the side of its inner surface forms a contact 34.
摘要翻译：本发明提供一种能够获得良好的咔嗒感并能够避免接触不良并具有高耐久性的钥匙开关隔膜。钥匙开关隔膜30包括具有柔性和导电性的薄板，并且钥匙开关隔膜30包括截头基座16和朝向基座16的上部的上侧部分的凸起部分18上升的球形圆顶部分18 基座16。圆顶部分18设置在其基本上中心部分处，向外的凸起部分32朝向顶部18的外表面升高。在其内表面侧上的向外凸起部分32的边缘形成触点34。

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