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    • 1. 发明授权
    • Liquid ejection head, liquid ejection device and liquid ejection method
    • 液体喷射头,液体喷射装置和液体喷射方法
    • US07690766B2
    • 2010-04-06
    • US11793083
    • 2005-12-07
    • Nobuhiro UenoYasuo NishiAtsuro Yanata
    • Nobuhiro UenoYasuo NishiAtsuro Yanata
    • B41J2/06
    • B41J2/04576B41J2/04581B41J2/04588B41J2/06B41J2/14233B41J2002/14475
    • A liquid ejection head having: a nozzle for ejecting a liquid; a flat nozzle plate on which the nozzle is provided; a cavity to store the liquid to be ejected from an ejection hole of the nozzle; a pressure generating section which generates pressure on the liquid in the nozzle and forms a meniscus of the liquid in the ejection hole of the nozzle; an electrostatic voltage applying section which applies electrostatic voltage between a base material and the liquid in the nozzle and the cavity, and generates electrostatic suction force; and an operation control section which controls applying of the electrostatic voltage by the electrostatic voltage applying section, and controls applying of drive voltage to drive the pressure generating portion, wherein a volume resistivity of the nozzle plate is 1015 Ωm or more.
    • 一种液体喷射头,具有:用于喷射液体的喷嘴; 设有喷嘴的扁平喷嘴板; 用于存储从喷嘴的喷射孔喷出的液体的空腔; 压力产生部分,其在喷嘴中的液体上产生压力并在喷嘴的喷射孔中形成液体的弯月面; 静电电压施加部,其在基材与喷嘴中的液体和空腔之间施加静电电压,并产生静电吸引力; 以及操作控制部,其控制由所述静电电压施加部施加静电电压,并且控制施加驱动电压来驱动所述压力产生部,其中所述喷嘴板的体积电阻率为1015Ω·cm以上。
    • 8. 发明授权
    • Anode bonding method and producing method of liquid droplet discharging head
    • 阳极接合方法及液滴喷头的制造方法
    • US08366861B2
    • 2013-02-05
    • US12733364
    • 2008-08-29
    • Nobuhiro Ueno
    • Nobuhiro Ueno
    • B32B37/00
    • B41J2/161B41J2/1623B41J2002/14491C03C27/00
    • Provided is an anode bonding method by which a silicon substrate and a glass substrate are well anodically bonded without generating positional shift, even when an electrode cannot be arranged on a surface on the opposite side to a bonding surface of a glass substrate and the bonding surface is large. The method for anodically bonding the glass substrate and the silicon substrate is provided with a step of placing on the glass substrate the silicon substrate whereupon a through hole is arranged; a step of bringing the anode electrode into contact with the surface of the overlapped silicon substrate opposite to the surface facing the glass substrate, and bringing an cathode electrode into contact with the glass substrate through the through hole arranged on the silicon substrate; and a step of applying a direct current voltage to the anode electrode and the cathode electrode in a state where the glass substrate and the silicon substrate are heated.
    • 提供了一种阳极接合方法,其中硅衬底和玻璃衬底良好地阳极结合而不产生位置偏移,即使当电极不能布置在与玻璃衬底的接合表面相对的表面上时,接合表面 很大 玻璃基板和硅基板的阳极接合方法具有在玻璃基板上放置硅基板,然后配置通孔的工序; 将阳极电极与与玻璃基板相对的面重叠的硅基板的表面接触的步骤,通过布置在硅基板上的贯通孔使阴极与玻璃基板接触; 以及在加热玻璃基板和硅基板的状态下,向阳极电极和阴极施加直流电压的工序。
    • 10. 发明申请
    • ANODE BONDING METHOD AND PRODUCING METHOD OD LIQUID DROPLET DISCHARGING HEAD
    • ANODE BONDING METHOD AND PRODUCTION METHOD OD LIQUID DROPLET DISCHARGING HEAD
    • US20100206475A1
    • 2010-08-19
    • US12733364
    • 2008-08-29
    • Nobuhiro Ueno
    • Nobuhiro Ueno
    • B32B37/00B32B38/00
    • B41J2/161B41J2/1623B41J2002/14491C03C27/00
    • Provided is an anode bonding method by which a silicon substrate and a glass substrate are well anodically bonded without generating positional shift, even when an electrode cannot be arranged on a surface on the opposite side to a bonding surface of a glass substrate and the bonding surface is large. The method for anodically bonding the glass substrate and the silicon substrate is provided with a step of placing on the glass substrate the silicon substrate whereupon a through hole is arranged; a step of bringing the anode electrode into contact with the surface of the overlapped silicon substrate opposite to the surface facing the glass substrate, and bringing an cathode electrode into contact with the glass substrate through the through hole arranged on the silicon substrate; and a step of applying a direct current voltage to the anode electrode and the cathode electrode in a state where the glass substrate and the silicon substrate are heated.
    • 提供了一种阳极接合方法,其中硅衬底和玻璃衬底良好地阳极结合而不产生位置偏移,即使当电极不能布置在与玻璃衬底的接合表面相对的表面上时,接合表面 很大 玻璃基板和硅基板的阳极接合方法具有在玻璃基板上放置硅基板,然后配置通孔的工序; 将阳极电极与与玻璃基板相对的面重叠的硅基板的表面接触的步骤,通过布置在硅基板上的贯通孔使阴极与玻璃基板接触; 以及在加热玻璃基板和硅基板的状态下,向阳极电极和阴极施加直流电压的工序。