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1. 发明授权

US09758594B2 Stable multivalent antibody 有权
公开(公告)号：US09758594B2
公开(公告)日：2017-09-12
申请号：US12989600
申请日：2009-04-27
申请人： Nobuaki Takahashi
发明人： Nobuaki Takahashi
IPC分类号： C07K16/28 , C07K16/00 , C07K16/46 , A61K39/395
CPC分类号： C07K16/468 , A61K39/39591 , C07K16/2818 , C07K16/2878 , C07K2317/51 , C07K2317/56 , C07K2317/622 , C07K2317/624 , C07K2317/626 , C07K2317/64 , C07K2319/00
摘要： The present invention relates to a multivalent antibody comprising multiple heavy chain variable regions of antibody linked to each other via a linker comprising an amino acid sequence encoding an immunoglobulin domain or a fragment thereof.

2. 发明授权

US09059429B2 Manufacturing method for organic electroluminescent panel and organic electroluminescent panel manufactured using the same 有权
标题翻译：使用其制造的有机电致发光面板和有机电致发光面板的制造方法
公开(公告)号：US09059429B2
公开(公告)日：2015-06-16
申请号：US13640355
申请日：2011-04-18
申请人： Masaaki Murayama , Nobuaki Takahashi , Daisuke Numakura
发明人： Masaaki Murayama , Nobuaki Takahashi , Daisuke Numakura
IPC分类号： H01J9/00 , H01L51/52
CPC分类号： H01L51/5246
摘要： A simple manufacturing method for an organic electroluminescent panel in which organic electroluminescent elements are arranged and sealed by a sealing adhesive. The electroluminescent panel has excellent sealing properties and excellent durability as a result of the organic electroluminescent elements being adhered to one another by a heat-curable adhesive. The manufacturing method is for an organic electroluminescent panel in which at least a first electrode, an organic functional layer containing a light-emitting layer, an organic electroluminescent element having a second electrode, and a sealing substrate are bonded together on a substrate by the heat-curable adhesive. The method includes forming a heat-curable adhesive layer on the sealing substrate, subjecting the heat-curable adhesive layer formed on the sealing substrate to pre-heating treatment, bonding the pre-heated heat-curable adhesive layer to the organic electroluminescent element, and subjecting the heat-curable adhesive layer to heat curing, in the given order.
摘要翻译：一种有机电致发光面板的简单制造方法，其中有机电致发光元件由密封胶布置和密封。电致发光面板由于有机电致发光元件通过热固性粘合剂彼此粘合而具有优异的密封性和优异的耐久性。该制造方法用于有机电致发光面板，其中至少第一电极，含有发光层的有机功能层，具有第二电极的有机电致发光元件和密封基板通过热量在基板上接合在一起可固化粘合剂。该方法包括在密封基板上形成热固性粘合剂层，对形成在密封基板上的热固性粘合剂层进行预热处理，将预热的可热固化粘合剂层接合到有机电致发光元件，以及以给定的顺序对热固性粘合剂层进行热固化。

3. 发明授权

US08911726B2 Stabilized human Igg4 antibodies 有权
标题翻译：稳定的人Igg4抗体
公开(公告)号：US08911726B2
公开(公告)日：2014-12-16
申请号：US11663340
申请日：2005-09-22
申请人： Nobuaki Takahashi , Hideaki Yoshida
发明人： Nobuaki Takahashi , Hideaki Yoshida
IPC分类号： A61K39/395 , C07K16/28 , C12N15/13 , C07K16/00
CPC分类号： C07K16/2878 , A61K39/39591 , C07K16/00 , C07K2317/21 , C07K2317/24 , C07K2317/52 , C07K2317/56 , C07K2317/76 , C07K2317/94
摘要： A highly stable mutant of human IgG4 antibody is provided. Such antibody is an antibody in which the CH3 domain of human IgG4 is substituted with the CH3 domain of human IgG1 and which exhibits inhibited aggregate formation, an antibody in which the CH3 and CH2 domains of human IgG4 are substituted with the CH3 and CH2 domains of human IgG1, respectively, or an antibody in which arginine at position 409 indicated in the EU index proposed by Kabat et al. of human IgG4 is substituted with lysine and which exhibits inhibited aggregate formation.
摘要翻译：提供了高度稳定的人IgG4抗体突变体。这样的抗体是其中人IgG4的CH3结构域被人IgG1的CH3结构域取代并且表现出抑制聚集体形成的抗体，其中人IgG4的CH 3和CH 2结构域被CH 3和CH 2结构域所取代的抗体或者其中在Kabat等人提出的欧盟指标中指出的409位精氨酸的抗体。的人IgG4被赖氨酸取代，并且其表现出抑制的聚集体形成。

4. 发明授权

US08728950B2 Coating method, and organic electroluminescence element 有权
标题翻译：涂布方法和有机电致发光元件
公开(公告)号：US08728950B2
公开(公告)日：2014-05-20
申请号：US13260068
申请日：2010-06-15
申请人： Shigetoshi Kawabe , Nobuaki Takahashi
发明人： Shigetoshi Kawabe , Nobuaki Takahashi
IPC分类号： H01L21/31
CPC分类号： H01L51/0004 , B05C5/025 , B05C5/0254 , B05D1/265 , B05D5/06 , H01L51/56
摘要： Disclosed are a coating method of forming a coating with a stable thickness from a coating solution with a low viscosity employing a slit-type die coater and an organic electroluminescence element prepared employing the coating method. The coating method employing a slit-type die coater comprises the steps of allowing a lip tip of the slit-type die coater to bring close to the substrate to form a coating solution bead between the lip tip and the substrate, and coating on the substrate a coating solution ejected from a slit outlet at the lip tip while relatively moving the slit-type die coater and the substrate, thereby forming at least two coating layers in the stripe shape, featured in that the lip tip has at least one groove in the coating region in the coating width direction, and a pressure at the slit outlet of the coating solution of the bead is negative or zero.
摘要翻译：公开了使用狭缝型模涂机和使用涂布法制备的有机电致发光元件，从具有低粘度的涂布溶液形成具有稳定厚度的涂层的涂布方法。使用狭缝型模涂机的涂布方法包括以下步骤：使狭缝型模涂机的唇尖靠近基板，以在唇尖和基板之间形成涂布溶液珠，并在基板上涂布在狭缝型模具涂布机和基板相对移动的同时从唇尖处的狭缝出口喷射的涂布溶液，从而形成至少两条条状涂层，其特征在于，唇尖在其中具有至少一个凹槽在涂布宽度方向上的涂布区域，珠的涂布溶液的狭缝出口处的压力为负或为零。

5. 发明申请

US20130315435A1 SPEAKER EDGE, METHOD FOR MANUFACTURING SAME AND SPEAKER 审中-公开
标题翻译：扬声器边缘，其制造方法和扬声器
公开(公告)号：US20130315435A1
公开(公告)日：2013-11-28
申请号：US13990721
申请日：2010-11-30
申请人： Masatoshi Sato , Nobuaki Takahashi , Masaru Nakagawa , Teruaki Kaiya , Junichi Sato
发明人： Masatoshi Sato , Nobuaki Takahashi , Masaru Nakagawa , Teruaki Kaiya , Junichi Sato
IPC分类号： H04R7/16 , H04R7/02
CPC分类号： H04R7/20 , B32B5/22 , B32B7/02 , B32B27/12 , H04R7/02 , H04R7/16 , H04R31/003 , H04R2231/001 , H04R2231/003 , H04R2307/204 , H04R2307/207 , H04R2499/11 , H04R2499/13 , H04R2499/15
摘要： A speaker edge includes a resin layer including a resin member and a fiber layer including a tangled fiber body. A melting temperature of the tangled fiber body is higher than a melting temperature of the resin member. The hardness of the tangled fiber body is lower than the hardness of the resin member.
摘要翻译：扬声器边缘包括包括树脂构件的树脂层和包括缠结纤维体的纤维层。缠结纤维体的熔融温度高于树脂部件的熔融温度。缠结纤维体的硬度低于树脂部件的硬度。

6. 发明授权

US08426311B2 Method and apparatus for manufacturing semiconductor device 失效
标题翻译：用于制造半导体器件的方法和装置
公开(公告)号：US08426311B2
公开(公告)日：2013-04-23
申请号：US12801458
申请日：2010-06-09
申请人： Nobuaki Takahashi , Masahiro Komuro
发明人： Nobuaki Takahashi , Masahiro Komuro
IPC分类号： H01L21/445
CPC分类号： C23C18/1651 , C23C18/1632 , C23C18/32 , C23C18/54 , H01L21/288 , H01L21/76898 , H01L24/03 , H01L24/05 , H01L24/10 , H01L24/13 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05556 , H01L2224/05644 , H01L2224/13 , H01L2224/13099 , H01L2224/48463 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/3025 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： A method for manufacturing a semiconductor device includes forming a laminated structure of a plurality of metal films on a semiconductor substrate using an electroless plating method. The forming of the metal films includes: performing an electroless plating process including a reduction reaction using a first plating tank; and performing an electroless plating process by only a substitution reaction using a second plating tank. The electroless plating process including the reduction reaction that is performed using the first plating tank is performed in a shading environment, and the electroless plating process performed by only the substitution reaction using the second plating tank is performed in a non-shading environment.
摘要翻译：一种半导体器件的制造方法包括使用无电镀法在半导体衬底上形成多个金属膜的叠层结构。金属膜的形成包括：使用第一镀槽进行包括还原反应的无电镀处理; 并且仅使用第二镀槽进行取代反应进行化学镀处理。包括使用第一镀槽进行的还原反应的化学镀处理在遮蔽环境中进行，并且在非遮蔽环境中进行仅使用第二镀槽的取代反应进行的化学镀处理。

7. 发明授权

US08177925B2 High-tensile steel plate, welded steel pipe or tube, and methods of manufacturing thereof 有权
标题翻译：高强度钢板，焊接钢管或管，及其制造方法
公开(公告)号：US08177925B2
公开(公告)日：2012-05-15
申请号：US11886423
申请日：2006-03-08
申请人： Nobuaki Takahashi , Masahiko Hamada , Shuji Okaguchi , Akihiro Yamanaka , Ichirou Seta
发明人： Nobuaki Takahashi , Masahiko Hamada , Shuji Okaguchi , Akihiro Yamanaka , Ichirou Seta
IPC分类号： C22C38/14 , C22C38/12 , C22C38/04 , C22C38/48 , C22C38/50 , C21D8/00 , C21D8/10 , C21D9/08
CPC分类号： C21D8/0226 , B21B3/02 , B21C37/08 , C21D8/10 , C21D9/08 , C21D9/50 , C21D2211/002 , C21D2211/005 , C22C38/002 , C22C38/005 , C22C38/02 , C22C38/04 , C22C38/08 , C22C38/12 , C22C38/14 , C22C38/40 , C22C38/42 , C22C38/44 , C22C38/46 , C22C38/50 , C22C38/58 , Y10S148/908 , Y10T428/12292
摘要： In a high-tensile steel plate according to the invention, the carbon equivalent Pcm represented in Expression (1) is from 0.180% to 0.220%, the surface hardness is a Vicker's hardness of 285 or less, the ratio of a Martensite Austenite constituent in the surface layer is not more than 10%, the ratio of a mixed structure of ferrite and bainite inside beyond the surface layer is not less than 90%, the ratio of the bainite in the mixed structure is not less than 10%, the thickness of the lath of bainite is not more than 1 μm, the length of the lath is not more than 20 μm, and the segregation ratio as the ratio of the Mn concentration in the center segregation part relative to the Mn concentration at a part in a depth equal to ¼ of the thickness of the plate from the surface is not more than 1.3. Pcm=C+Si/30+(Mn+Cu+Cr)/20+Ni/60+Mo/15+V/10+5B . . . (1) where the element symbols in Expression (1) represent the % by mass of the respective elements. In this way, the high-tensile steel plate according to the invention has a yield strength of at least 551 MPa and a tensile strength of at least 620 MPa as well as high toughness, high propagating shear fracture and high weldability.
摘要翻译：在本发明的高强度钢板中，式（1）所示的碳当量Pcm为0.180〜0.220％，表面硬度为维氏硬度为285以下，马氏体奥氏体成分表面层不超过10％，铁素体和贝氏体在表面层之外的混合结构的比例不小于90％，混合结构中的贝氏体比不小于10％，厚度贝氏体的板条的长度不超过1μm，板条的长度不大于20μm，偏析中心偏析部分的Mn浓度相对于一部分的Mn浓度的偏析比与表面厚度相当的1/4的厚度不大于1.3。 Pcm = C + Si / 30 +（Mn + Cu + Cr）/ 20 + Ni / 60 + Mo / 15 + V / 10 + 5B。。。（1）其中，式（1）中的元素符号表示各元素的质量％。这样，根据本发明的高强度钢板的屈服强度至少为551MPa，拉伸强度为至少620MPa，韧性高，传播剪切断裂高，焊接性高。

8. 发明申请

US20120032157A1 COATING METHOD, AND ORGANIC ELECTROLUMINESCENCE ELEMENT 有权
标题翻译：涂层方法和有机电致发光元件
公开(公告)号：US20120032157A1
公开(公告)日：2012-02-09
申请号：US13260068
申请日：2010-06-15
申请人： Shigetoshi Kawabe , Nobuaki Takahashi
发明人： Shigetoshi Kawabe , Nobuaki Takahashi
IPC分类号： H01L51/52 , B05D5/12
CPC分类号： H01L51/0004 , B05C5/025 , B05C5/0254 , B05D1/265 , B05D5/06 , H01L51/56
摘要： Disclosed are a coating method of forming a coating with a stable thickness from a coating solution with a low viscosity employing a slit-type die coater and an organic electroluminescence element prepared employing the coating method. The coating method employing a slit-type die coater comprises the steps of allowing a lip tip of the slit-type die coater to bring close to the substrate to form a coating solution bead between the lip tip and the substrate, and coating on the substrate a coating solution ejected from a slit outlet at the lip tip while relatively moving the slit-type die coater and the substrate, thereby forming at least two coating layers in the stripe shape, featured in that the lip tip has at least one groove in the coating region in the coating width direction, and a pressure at the slit outlet of the coating solution of the bead is negative or zero.
摘要翻译：公开了使用狭缝型模涂机和使用涂布法制备的有机电致发光元件，从具有低粘度的涂布溶液形成具有稳定厚度的涂层的涂布方法。使用狭缝型模涂机的涂布方法包括以下步骤：使狭缝型模涂机的唇尖靠近基板，以在唇尖和基板之间形成涂布溶液珠，并在基板上涂布在狭缝型模具涂布机和基板相对移动的同时从唇尖处的狭缝出口喷射的涂布溶液，从而形成至少两条条状涂层，其特征在于，唇尖在其中具有至少一个凹槽在涂布宽度方向上的涂布区域，珠的涂布溶液的狭缝出口处的压力为负或为零。

9. 发明申请

US20110199407A1 IMAGE FORMING APPARATUS 审中-公开
标题翻译：图像形成装置
公开(公告)号：US20110199407A1
公开(公告)日：2011-08-18
申请号：US12707827
申请日：2010-02-18
申请人： Satoshi Kaiho , Atsushi Kubota , Takashi Kado , Nobuaki Takahashi
发明人： Satoshi Kaiho , Atsushi Kubota , Takashi Kado , Nobuaki Takahashi
IPC分类号： B41J29/38
CPC分类号： B41J2/175 , B41J2/16585 , B41J2/17596 , B41J2/18 , B41J2/2114 , B41J3/543 , B41J25/003
摘要： The present invention provides, in an image forming apparatus configured to form an image on a recording medium with ejection liquids ejected from plural heads, a technique for enabling easy positioning of the respective plural heads. The image forming apparatus includes: plural heads including a reference head having a positioned section and configured to respectively eject ejection liquids onto a recording medium; a head base having plural head positioning sections on which the plural heads are respectively mounted to be positioned, whereon a reference-head positioning section on which the reference head should be mounted in cooperation with the positioned section of the reference head performs positioning at a degree of freedom of position adjustment lower than that of the other head positioning sections; and a conveying unit configured to convey the recording medium to a position opposed to the head base.
摘要翻译：本发明提供一种图像形成装置，该图像形成装置被配置为在从多个头部喷出的喷射液体的记录介质上形成图像，能够容易地定位各个头部的技术。图像形成装置包括：多个头部，包括具有定位部分的参考头部，并且被配置为分别将喷射液体喷射到记录介质上; 具有多个头部定位部分的头部基座，多个头部分别安装在该头部定位部分上，其中与参考头部的定位部分配合地安装参考头部的基准头定位部分以一定程度进行定位位置调整自由度低于其他头部定位部分的自由度; 以及传送单元，其构造成将记录介质传送到与头部基座相对的位置。

10. 发明申请

US20110076722A1 STABLE MULTIVALENT ANTIBODY 有权
标题翻译：稳定的多功能抗体
公开(公告)号：US20110076722A1
公开(公告)日：2011-03-31
申请号：US12989600
申请日：2009-04-27
申请人： Nobuaki Takahashi
发明人： Nobuaki Takahashi
IPC分类号： C12P21/00 , C07K16/00 , C12N15/13 , C12N15/63 , C12N5/00
CPC分类号： C07K16/468 , A61K39/39591 , C07K16/2818 , C07K16/2878 , C07K2317/51 , C07K2317/56 , C07K2317/622 , C07K2317/624 , C07K2317/626 , C07K2317/64 , C07K2319/00
摘要： The present invention relates to a multivalent antibody comprising multiple heavy chain variable regions of antibody linked to each other via a linker comprising an amino acid sequence encoding an immunoglobulin domain or a fragment thereof.
摘要翻译：本发明涉及包含通过包含编码免疫球蛋白结构域或其片段的氨基酸序列的接头彼此连接的多个抗体重链可变区的多价抗体。

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