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1. 发明授权

US5431579A Socket for IC package 失效
标题翻译： IC封装插座
公开(公告)号：US5431579A
公开(公告)日：1995-07-11
申请号：US272840
申请日：1994-07-11
申请人： Nobuaki Kishi , Nobuhisa Arai , Masanori Takagishi , Hiroshi Henmi
发明人： Nobuaki Kishi , Nobuhisa Arai , Masanori Takagishi , Hiroshi Henmi
IPC分类号： H01L23/32 , G01R1/04 , H01R33/76 , H05K7/10 , H01R11/22
CPC分类号： G01R1/0433 , H05K7/1023
摘要： A receiving tray 6 is disposed on a pedestal surface 1a of a base member 1 vertically and movably, while below the pedestal surface 1a are disposed a push-up member 7 interlocked with the receiving tray and a spring 8 for urging the push-up member 7 downwards. A seating surface if for package leads P2 is formed along side portions of the pedestal surface 1a, and a large number of contacts 2 are arranged side by side, the contacts 2 having respective contact portions 2a for contact with the leads P2 which contact portions 2a are urged inwards to obtain a predetermined contact pressure for the leads. There are used movable cams 4 adapted to rotate upon depression of a cover 5 which covers the base member, to displace the contact portions 2a of the contacts 2 outwards away from the package leads P2. The movable cams 4 are each provided with an actuating arm 4c which comes into abutment with the push-up member 7 upon depression of the cover 5 and consequent rotation of the cam 4 to push up the receiving tray 6.
摘要翻译：接收托盘6垂直且可移动地设置在基座构件1的基座面1a上，而基座面1a的下方配置有与接收托盘互锁的上推构件7和用于推压上推构件的弹簧8 7向下如果沿着基座面1a的侧面形成包装引线P2的座面，并且大量的接点2并列配置，则接点2具有与接触部2a的引线P2接触的接触部2a 被向内推动以获得引线的预定接触压力。使用可移动凸轮4，该活动凸轮4适于在覆盖基部构件的盖子5的按压时旋转，以使接触件2的接触部分2a从封装引线P2向外移位。活动凸轮4分别设置有致动臂4c，该致动臂4c在按压盖5时与上推构件7抵接，随后凸轮4旋转以推动接收托盘6。

2. 发明授权

US5939891A Socket for IC package 失效
标题翻译： IC封装插座
公开(公告)号：US5939891A
公开(公告)日：1999-08-17
申请号：US831056
申请日：1997-04-01
申请人： Nobuaki Kishi , Masanori Takagishi , Ichiro Matsuo
发明人： Nobuaki Kishi , Masanori Takagishi , Ichiro Matsuo
IPC分类号： H01R13/629 , H01L23/32 , H01R13/193 , H01R33/76 , H05K7/10 , H01R11/22
CPC分类号： H05K7/1023 , H01R13/193
摘要： A new socket is provided for testing an IC package whereby the contact parts of the contacts are moved outward to be able to conduct attachment and detachment of an IC package without a load, the oxide film formed on the contacts of the IC package is removed to acquire a reliable conductivity, and a stress to deform the contacts of the IC package cannot be exerted. In the socket, the contact parts of the contacts come into contact with the contacts of the IC package while sliding outward (in the opposite direction to the receiving space for the IC package), and remove the oxide films on the surfaces of the IC contacts to secure a reliable conductivity. When the IC package is taken out, the contact parts of the contacts move outward, the supporting point moves inward by the swing of the engaging member; and thereby, the contact parts of the contacts go up virtually vertically in the initial state of the movement, and afterward, move oblique outward to come off from the contacts of the IC package. Thus, the load to the contacts of the IC package can be reduced to so low a level as possible.
摘要翻译：提供了用于测试IC封装的新插座，由此触点的接触部分向外移动以能够在没有负载的情况下进行IC封装的附接和拆卸，形成在IC封装的触点上的氧化膜被去除获得可靠的导电性，并且不能施加使IC封装的触点变形的应力。在插座中，触点的接触部分与IC封装的触点接触，同时向外滑动（与IC封装的接收空间相反的方向），并且去除IC触头表面上的氧化物膜以确保可靠的电导率。当IC封装被取出时，触头的接触部分向外移动，支撑点通过接合构件的摆动向内移动; 因此触点的接触部在运动的初始状态下几乎垂直地上升，然后向外斜向移动，从IC封装的触点脱离。因此，可以将IC封装的触点的负载降低到尽可能低的水平。

3. 发明授权

US5244404A IC socket 失效
标题翻译： IC插座
公开(公告)号：US5244404A
公开(公告)日：1993-09-14
申请号：US687706
申请日：1991-04-19
申请人： Nobuaki Kishi , Norio Kobayashi , Junji Ishida
发明人： Nobuaki Kishi , Norio Kobayashi , Junji Ishida
IPC分类号： H01R33/76 , H01L23/32 , H05K7/10
CPC分类号： H05K7/1023
摘要： This invention relates to an IC socket, and more particularly an IC socket comprising a socket base plate having contacts on which the IC lead wires of the mounted IC are mounted and contacted, a pushing cover to be closed against the socket base plate through IC, and a pushing member for pressing the IC lead wires against the contacts in response to the closing operation of the pushing cover. Means for making a positive prevention of the displacements of the pushing positions of the IC lead wires by the pushing member is provided, that is, the pushing cover is rotatably supported on the socket base plate, the pushing member is supported on the socket base plate separate from the pushing cover and the pivoting shaft is supported in a longitudinal hole extending in a vertical direction and the pushing cover can be rotated and moved up and down vertically.
摘要翻译：本发明涉及一种IC插座，更具体地说，涉及一种IC插座，其具有：插座基板，其具有安装了IC的IC引线的接点，通过IC与所述插座底板相接触的推盖，以及推动构件，用于响应于推盖的关闭操作将IC引线压靠在触点上。设置用于通过推动部件积极地防止IC引线的推压位置的装置，即，推盖被可旋转地支撑在插座底板上，推动构件被支撑在插座底板上与推盖分开并且枢转轴支撑在沿垂直方向延伸的纵向孔中，并且推盖可以被垂直地上下移动和移动。

4. 发明授权

US5387118A Socket for IC package 失效
标题翻译： IC封装插座
公开(公告)号：US5387118A
公开(公告)日：1995-02-07
申请号：US103756
申请日：1993-08-10
申请人： Nobuaki Kishi , Makoto Hoshi , Tetsuya Osawa , Ichiro Matsuo
发明人： Nobuaki Kishi , Makoto Hoshi , Tetsuya Osawa , Ichiro Matsuo
IPC分类号： H01L23/32 , H01R33/76 , H05K7/10 , H01R13/62
CPC分类号： H05K7/1023
摘要： A socket for an IC package includes a base member having a receptacle space for the IC package, a plurality of contacts arranged in parallel along the sides of the receptacle space of the base member. The contacts each have a contact portion for contact with a corresponding lead of the IC package received in the receptacle space. A spring portion urges the contact portion inwardly to obtain a contact pressure against a lead. A connecting shaft is pivotally supported vertically along each row of the contacts, and is associated with the contacts. A cover covers the base member, and the connecting shaft pivots by depression of the cover to displace the contact portion of each contact outwardly away from the corresponding lead of the IC package against a biasing force of the spring portion. The contact has a curved, first spring portion extending upwardly and inwardly from an inside edge of a plate portion. A second spring portion is bent inwardly from a front end of the first spring portion and is contiguous to the contact portion, and a projection is formed on an upper surface of the second spring portion. The connecting portion has an engaging recess for engagement with the projection and also has an engaging face for engagement with the portion behind the projection. The cover includes inclined surface for allowing the movable cams to move pivotally outwardly.
摘要翻译：用于IC封装的插座包括具有用于IC封装的插座空间的基座构件，沿着基座构件的容置空间的侧面平行布置的多个触点。触点各具有用于与容纳空间中容纳的IC封装的相应导线接触的接触部分。弹簧部分向内推动接触部分以获得针对引线的接触压力。连接轴沿着每一排触点垂直地枢转地支撑，并且与触点相关联。盖子覆盖基座构件，并且连接轴通过按压盖枢转，以抵抗弹簧部分的偏压力将每个触头的接触部分从外部远离IC封装的引线移开。接触件具有从板部分的内边缘向上和向内延伸的弯曲的第一弹簧部分。第二弹簧部分从第一弹簧部分的前端向内弯曲并且与接触部分邻接，并且突起形成在第二弹簧部分的上表面上。连接部分具有用于与突起接合的接合凹槽，并且还具有用于与突出部分后面的部分接合的接合面。该盖包括用于允许可动凸轮向外转动的倾斜表面。

5. 发明授权

US5326271A IC socket 失效
标题翻译： IC插座
公开(公告)号：US5326271A
公开(公告)日：1994-07-05
申请号：US24396
申请日：1993-03-01
申请人： Nobuaki Kishi , Norio Kobayashi , Junji Ishida
发明人： Nobuaki Kishi , Norio Kobayashi , Junji Ishida
IPC分类号： H01R33/76 , H01L23/32 , H05K7/10 , H01R9/09
CPC分类号： H05K7/1023
摘要： The invention relates to an IC socket, and more particularly an IC socket comprising a socket base plate having contacts on which the IC lead wires of the mounted IC are mounted and contacted, a pushing cover to be closed against the socket base plate through IC, and a pushing member for pressing the IC lead wires against the contacts in response to the closing operation of the pushing cover. Means for making a positive prevention of the displacements of the pushing positions of the IC lead wires by the pushing member is provided, that is, the pushing cover is rotatably supported on the socket base plate, the pushing member is supported on the socket base plate separate from the pushing cover and the pivoting shaft is supported in a longitudinal hole extending in a vertical direction and the pushing cover can be rotated and moved up and down vertically.
摘要翻译：本发明涉及一种IC插座，更具体地说，涉及一种IC插座，包括具有接触件的插座基板，安装有IC的IC导线被安装和接触;按压盖，通过IC与基座板相接，以及推动构件，用于响应于推盖的关闭操作将IC引线压靠在触点上。设置用于通过推动部件积极地防止IC引线的推压位置的装置，即，推盖被可旋转地支撑在插座底板上，推动构件被支撑在插座底板上与推盖分开并且枢转轴支撑在沿垂直方向延伸的纵向孔中，并且推盖可以被垂直地上下移动和移动。

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