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1. 发明专利

JP2010205361A Suspension substrate with circuit and its manufacturing method 审中-公开
标题翻译：具有电路的悬挂基板及其制造方法
公开(公告)号：JP2010205361A
公开(公告)日：2010-09-16
申请号：JP2009052200
申请日：2009-03-05
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TAMURA YASUSHI , SUEZAKI RYOJI , OSAWA TETSUYA , TANABE HIROYUKI , KANEKAWA HITONORI
IPC分类号： G11B5/60 , G11B21/21 , H05K1/05 , H05K3/28 , H05K3/44
CPC分类号： G03F7/2022 , G03F1/144 , G03F1/70 , G11B5/4846 , H05K1/056 , H05K3/0023 , H05K3/28 , H05K2201/0191 , H05K2203/0505 , H05K2203/0588 , Y10T29/49155 , Y10T29/49156
摘要： PROBLEM TO BE SOLVED: To provide a suspension substrate with a circuit, preventing a damage of a cover insulating layer or a conductor patten during insertion into an E block, and also to provide its manufacturing method. SOLUTION: The suspension substrate 1 with a circuit is equipped with: a metal support substrate 6, a base insulating layer 7 formed on the substrate 6; a conductor pattern 8 formed on the layer 7; a cover insulating layer 9 formed on the base insulating layer 7 to cover the conductor pattern 8; and an insertion part 5 inserted into the E block. The thickness T1 of the cover insulating layer 9 in the insertion part 5 is set larger than the thickness T2 of the cover insulating layer 9 in a part other than the insertion part 5. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有电路的悬架基板，防止在插入E块期间覆盖绝缘层或导体受损的损坏，并且还提供其制造方法。解决方案：具有电路的悬架基板1配备有：金属支撑基板6，形成在基板6上的基底绝缘层7; 形成在层7上的导体图案8; 形成在基底绝缘层7上以覆盖导体图案8的覆盖绝缘层9; 以及插入到E块中的插入部5。插入部5中的覆盖绝缘层9的厚度T1被设定为比插入部5以外的部分中的覆盖绝缘层9的厚度T2大。（C）2010，JPO＆INPIT

2. 发明专利

JP2010276775A Negative photosensitive material and photosensitive substrate using the same, and negative pattern forming method 有权
标题翻译：使用相同的负光敏材料和感光基材，以及负图案形成方法
公开(公告)号：JP2010276775A
公开(公告)日：2010-12-09
申请号：JP2009127715
申请日：2009-05-27
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HIRASHIMA KATSUTOSHI , FUJII HIROFUMI , TAMURA YASUSHI , SUEZAKI RYOJI
IPC分类号： G03F7/038 , B32B27/34 , C08G73/10 , G03F7/004 , G03F7/38 , H01L21/027
CPC分类号： G03F7/0387 , G03F7/0045 , G03F7/38 , H05K1/056 , H05K3/0023 , H05K3/0082 , H05K3/287 , H05K3/4092 , H05K2201/0154 , H05K2201/0394 , H05K2201/09036 , H05K2201/0969 , H05K2203/056 , H05K2203/1476 , Y10S430/107
摘要： PROBLEM TO BE SOLVED: To provide a negative photosensitive material which strikes a balance between a low coefficient of linear expansion and a low hygroscopic expansion coefficient, and excels in gradation and PI etchability when a pattern is formed, and to provide a photosensitive substrate using the same.
SOLUTION: The negative photosensitive material contains (A) a polyimide precursor having a specific structural unit and (B) a specific pyridine derivative. The photosensitive substrate is obtained by forming a coating film layer comprising the negative photosensitive material on a surface of a supporting substrate.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种在低线性膨胀系数和低吸湿膨胀系数之间达到平衡的负感光材料，并且当形成图案时具有优异的灰度和PI可蚀刻性，并提供感光性底物使用相同。解决方案：负型感光材料包含（A）具有特定结构单元的聚酰亚胺前体和（B）特定的吡啶衍生物。通过在支撑基板的表面上形成包含负型感光材料的涂膜层，可以得到感光性基材。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2010135514A Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：JP2010135514A
公开(公告)日：2010-06-17
申请号：JP2008309049
申请日：2008-12-03
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TAMURA YASUSHI , FURUTA KENJI , ISHII ATSUSHI , SUEZAKI RYOJI
IPC分类号： H05K3/28 , G11B5/60
摘要： PROBLEM TO BE SOLVED: To provide a wired circuit board which further suppresses a peeling of a cover insulating layer from a conductor wire.
SOLUTION: A plurality of conductor wires 2 are formed side by side on an upper face of a base substrate 1, and the conductor wires are covered with a cover insulating layer 3 made of polyimide to form the wired circuit board. Here, when a thickness of the cover insulating layer from an upper face of the conductor wire 2 is t1, a thickness of the cover insulating layer from the upper face of the base substrate at the center of a space between the conductor wires is t2, a thickness of the conductor wire from the upper face of the base substrate is tc, and then a thickness of the cover insulating layer from the side of the conductor wire to a lateral direction at a height of [(t2+tc)/2] from the upper face of the base substrate is t3, the cover insulating layer is formed so as to satisfy t1≥t2 and t1>t3, so that stress following thermal shrinkage of the cover insulating layer is reduced.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供进一步抑制覆盖绝缘层与导线剥离的布线电路板。解决方案：在基底基板1的上表面上并排地形成多根导线2，并且用由聚酰亚胺制成的覆盖绝缘层3覆盖导线以形成布线电路板。这里，当覆盖绝缘层从导体线2的上表面的厚度为t1时，覆盖绝缘层的厚度从基底的上表面在导线之间的空间的中心处的厚度为t2，从基底基板的上表面的导线的厚度为tc，然后在[（t2 + tc）/ 2]的高度处，覆盖绝缘层从导线侧的横向方向的厚度，从基底基板的上表面是t3，覆盖绝缘层形成为满足t1≥t2和t1> t3，使得覆盖绝缘层的热收缩之后的应力减小。版权所有（C）2010，JPO＆INPIT

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