专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2012208304A Optoelectric hybrid substrate and manufacturing method thereof 有权
标题翻译：光电混合基板及其制造方法
公开(公告)号：JP2012208304A
公开(公告)日：2012-10-25
申请号：JP2011073617
申请日：2011-03-29
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TSUJITA YUICHI , HODONO MASAYUKI , NAGAFUJI AKIKO , INOUE MAYA , TAKASE MAYU
IPC分类号： G02B6/42 , H01S5/022
CPC分类号： G02B6/4202 , G02B6/4231 , Y10T29/49135
摘要： PROBLEM TO BE SOLVED: To provide an optoelectric hybrid substrate that has no need for the operation of alignment between a core in an optical waveguide unit and an optical element in an electrical circuit unit and has excellent mass productivity, and to provide a manufacturing method thereof.SOLUTION: An optoelectric hybrid substrate is formed by coupling an optical waveguide unit W to an electrical circuit unit E mounted with an optical element 10. The optical waveguide unit W includes notches 4, for positioning the electrical circuit unit, formed on at least one part of an under-clad layer and an over-clad layer. The notches 4 are formed to be positioned at a prescribed position relative to one end face 2a in a core 2. The electrical circuit unit E includes bent parts 15 which are formed by holding a portion of an electrical circuit board bent in the erected state and are fitted into the notches 4. The bent parts 15 are formed to be positioned at a prescribed position relative to the optical element 10. Then, the optical waveguide unit W is coupled to the electrical circuit unit E while the bent parts 15 are fitted into the notches 4.
摘要翻译：解决的问题：提供一种光电混合基板，其不需要在光波导单元中的芯与电路单元中的光学元件之间的对准操作，并且具有优异的批量生产率，并且提供一种其制造方法。解决方案：通过将光波导单元W耦合到安装有光学元件10的电路单元E来形成光电混合基板。光波导单元W包括用于定位形成在其上的电路单元的凹口4 下包层和外覆层的至少一部分。凹槽4形成为位于相对于芯部2中的一个端面2a的规定位置。电路单元E包括弯曲部15，其通过保持以直立状态弯曲的电路板的一部分而形成;以及弯曲部分15形成为相对于光学元件10定位在规定位置。然后，光波导单元W耦合到电路单元E，同时将弯曲部分15装配到缺点4.版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2012194401A Opto-electric hybrid substrate and manufacturing method of the same 审中-公开
标题翻译： OPTO-ELECTRIC HYBRID基板及其制造方法
公开(公告)号：JP2012194401A
公开(公告)日：2012-10-11
申请号：JP2011058573
申请日：2011-03-16
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： INOUE MAYA , HODONO MASAYUKI , NAGAFUJI AKIKO , TSUJITA YUICHI , MOTOGAMI MITSURU
IPC分类号： G02B6/122 , G02B6/42
CPC分类号： H05K1/0274 , G02B6/4214 , G02B6/424 , G02B6/4257 , G02B6/428 , H05K1/181 , H05K2201/09072 , H05K2201/10121 , Y10T29/4913
摘要： PROBLEM TO BE SOLVED: To provide an opto-electric hybrid substrate which eliminates the need for the operation of alignment between a core in an optical waveguide unit and an optical element in an electric circuit unit and which is excellent in mass productivity, and a manufacturing method of the same.SOLUTION: An opto-electric hybrid substrate is configured by combining an optical waveguide unit W and an electric circuit unit E mounted with an optical element 10 with each other. The optical waveguide unit W is provided with fitting holes 3a for positioning an electric circuit unit formed on the surface of an overclad layer 3, and the fitting holes 3a are positioned and formed at prescribed positions with respect to one end face 2a of a core 2. The electric circuit unit E is provided with projection parts 11a fitted in the fitting holes 3a, and the projection parts 11a are positioned and formed at prescribed positions with respect to the optical element 10. The optical waveguide unit W and the electric circuit unit E are combined with each other in a state where the projection parts 11a are fitted in the fitting holes 3a.
摘要翻译：解决的问题：为了提供光电混合基板，其不需要在光波导单元中的芯与电路单元中的光学元件之间的对准操作，并且其批量生产率优异，及其制造方法。解决方案：通过将安装有光学元件10的光波导单元W和电路单元E彼此组合来配置光电混合基板。光波导单元W设置有用于定位形成在外包层3的表面上的电路单元的装配孔3a，并且装配孔3a相对于芯2的一个端面2a定位并形成在规定位置电路单元E设置有嵌合在安装孔3a中的突出部11a，并且突出部11a相对于光学元件10定位并形成在规定位置。光波导单元W和电路单元E 在突出部11a嵌合于嵌合孔3a的状态下相互结合。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2009042299A Optical waveguide film and manufacturing method thereof 有权
标题翻译：光波导膜及其制造方法
公开(公告)号：JP2009042299A
公开(公告)日：2009-02-26
申请号：JP2007204487
申请日：2007-08-06
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HIKITA TAKAMI , HODONO MASAYUKI , NAGASAKI KUNIO
IPC分类号： G02B6/122 , G02B6/13
CPC分类号： G02B6/1221 , G02B6/138 , G02B6/43
摘要： PROBLEM TO BE SOLVED: To provide an optical waveguide film having a high connection reliability, by which, in positioning, separation is easy and superior positioning accuracy is obtained and, after the positioning, the film can be securely fixed, and also to provide a manufacturing method of the film. SOLUTION: A film 2 comprising an under-clad layer 5, an over-clad layer 7 and a core layer 6 covered by these clad layers is prepared. An adhesive layer 3 is formed on the surface of the under-clad layer 5 and a plurality of projection portions 4 are formed on a surface of the adhesive layer 3 and arranged at spaced intervals to one another. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有高连接可靠性的光波导膜，通过该光波导膜，在定位分离容易且获得优异的定位精度的同时，定位之后可以牢固地固定膜，并且还以提供薄膜的制造方法。解决方案：制备包括下覆层5，覆盖层7和被这些覆盖层覆盖的芯层6的膜2。在下覆层5的表面上形成粘合剂层3，并且在粘合剂层3的表面上形成有多个突出部分4，并以彼此间隔开的间隔布置。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008004855A Tape carrier for tab 审中-公开
标题翻译： TAPE CARRIER for TAB
公开(公告)号：JP2008004855A
公开(公告)日：2008-01-10
申请号：JP2006174734
申请日：2006-06-26
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HODONO MASAYUKI , NAKAMURA KEI , BABA TOSHIKAZU , ISHIMARU YASUTO
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a tape carrier for TAB capable of preventing any warpage from occurring without destroying any sprocket hole.
SOLUTION: A plurality of square sprocket holes 1S are formed on both sides of a tape carrier for TAB at a predetermined interval such that they are arranged in the lengthwise direction of the tape carrier for TAB. Reinforcing layers 30A to 30C are formed on a base insulating layer BIL in a band shaped region extending along both sides of the base insulating layer BIL in the lengthwise direction of the same. The reinforcing layer 30A comprises reinforcing sections 31a, 31b and a plurality of reinforcing sections 32a, 32b. The reinforcing part 31a and the reinforcing part 31b are respectively formed on the base insulating layer BIL on both sides of the base insulating layer BIL in the lengthwise direction of the same putting a plurality of sprocket holes 1S therebetween. The reinforcing part 32a and the reinforcing part 32b are respectively formed in the widthwise direction of the base insulating layer BIL such that they surround the vicinity of each sprocket hole 1S together with the reinforcing part 31a and the reinforcing part 31b.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于TAB的带载体，其能够防止任何翘曲发生而不破坏任何链轮孔。解决方案：多个方形链轮孔1S以预定的间隔形成在用于TAB的带载体的两侧上，使得它们沿着用于TAB的带载体的长度方向布置。加强层30A至30C形成在基底绝缘层BIL上，该基底绝缘层BIL沿着基底绝缘层BIL沿其长度方向的两侧延伸的带状区域。加强层30A包括加强部31a，31b和多个加强部32a，32b。加强部31a和加强部31b分别形成在基部绝缘层BIL的基底绝缘层BIL的沿其长度方向的两侧的基底绝缘层BIL上，使多个链轮孔1S位于它们之间。加强部32a和加强部32b分别形成在基底绝缘层BIL的宽度方向上，使得它们与加强部31a和加强部31b一起包围在各链轮孔1S附近。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2012053186A Optical sensor module 有权
标题翻译：光传感器模块
公开(公告)号：JP2012053186A
公开(公告)日：2012-03-15
申请号：JP2010194397
申请日：2010-08-31
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HODONO MASAYUKI
IPC分类号： G02B6/42 , G02B6/122 , H01L33/48
CPC分类号： G02B6/4231 , G02B6/4245 , G02B6/4255
摘要： PROBLEM TO BE SOLVED: To provide an optical sensor unit with decreased dispersion in optical coupling loss of the core of an optical waveguide unit and the optical element of a substrate unit.SOLUTION: An optical waveguide unit Whaving substrate unit engaging vertical grooves 60 and a substrate unit Ehaving engagement plate portions 5a to be fitted in the vertical grooves 60 and projections P are individually produced, and the engagement plate portions 5a of the substrate unit Eare, at each of the projections, brought into fitting engagement with the vertical grooves 60 of the optical waveguide unit W. At this time, the projections P are deformed to accommodate the tolerances of the components, thereby preventing wobbling and warpage of the substrate unit E. Further, the vertical grooves 60 of the optical waveguide unit Ware formed in proper positions with respect to a light transmission face 2a of a core 2, and the engagement plate portions 5a of the substrate unit Eare formed in proper positions with respect to the optical element 8. Therefore, the fitting engagement between the vertical grooves 60 and the engagement plate portions 5a permits proper positioning or automatic centering of the light transmission face 2a of the core 2 and the optical element 8.
摘要翻译：要解决的问题：提供一种光传感器单元，其具有减小的光波导单元的芯的光耦合损耗和基板单元的光学元件的分散。具有基板单元与垂直槽60接合的光波导单元W 2 和具有接合的基板单元E 2 单独地制造安装在垂直槽60和突起P中的板部分5a，并且在每个突起处，基板单元E 2 的接合板部分5a，与光波导单元W 2 的垂直槽60配合接合。此时，突起P变形以适应部件的公差，从而防止基板单元E 2 的摆动和翘曲。此外，光波导单元W 2 的垂直槽60相对于铁芯2的光透射面2a形成在适当的位置，并且接合板部分5a 基板单元E 2 相对于光学元件8形成在适当的位置。因此，垂直槽60和接合板部分5a之间的配合接合允许适当的定位或芯2的光传输面2a和光学元件8的自动对中。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2011186036A Method of manufacturing optical sensor module and optical sensor module obtained thereby 审中-公开
标题翻译：制造光学传感器模块的方法和获得的光学传感器模块
公开(公告)号：JP2011186036A
公开(公告)日：2011-09-22
申请号：JP2010048911
申请日：2010-03-05
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HODONO MASAYUKI
IPC分类号： G02B6/122 , G02B6/42
CPC分类号： B29D11/00 , G02B6/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical sensor module which eliminates the need for the operation of alignment between a core in an optical waveguide unit and an optical element in a substrate unit and which does not deteriorate the accuracy of alignment even when the thickness of a protruding portion is less than 50 μm, and to provide the optical sensor module obtained thereby. SOLUTION: An optical waveguide unit W 2 including protruding portions 4 having vertical walls with a height less than 50 μm and groove portions 3b, and a substrate unit E 2 including positioning members P of respective positioning plate portions 5a to be positioned in the protruding portions 4 and fitting plate portions 5b to be fitted to the groove portions 3b are individually produced. Corners of the positioning members P are positioned on the vertical walls of the protruding portions 4, and the fitting plate portions 5a are fitted to the groove portions 3b, and they are integrated. In this case, the protruding portions 4 are formed at appropriate positions relative to the end face 2a for optical transmission and reception of a core 2. Also, the positioning members P are formed at appropriate positions relative to the optical element 8. Thus, the end face 2a for the optical transmission and reception of the core and the optical element 8 are automatically aligned. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造光学传感器模块的方法，其不需要在光波导单元中的芯与基板单元中的光学元件之间的对准操作，并且不会降低精度即使突出部分的厚度小于50μm，并且提供由此获得的光学传感器模块。
解决方案：包括具有高度小于50μm的垂直壁的突出部分4和槽部分3b以及基板单元E 2 的光波导单元W SB < 分别制造定位在突出部分4中的定位板部分5a的定位构件P和与槽部分3b配合的装配板部分5b。定位构件P的角部位于突出部4的垂直壁上，并且嵌合板部5a嵌合到槽部3b，并且它们被一体化。在这种情况下，突出部4形成在相对于端面2a的适当位置，用于芯部2的光学发送和接收。此外，定位构件P形成在相对于光学元件8的适当位置。因此，磁芯和光学元件8的光学传输和接收的端面2a自动对准。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2011064910A Opto-electric hybrid module and method of manufacturing the same 有权
标题翻译：光电混合模块及其制造方法
公开(公告)号：JP2011064910A
公开(公告)日：2011-03-31
申请号：JP2009214915
申请日：2009-09-16
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NISHIO SO , HODONO MASAYUKI
IPC分类号： G02B6/42 , G02B6/122 , H01L31/0232 , H01S5/022
CPC分类号： G02B6/4214 , H01L2224/48091 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an opto-electric hybrid module capable of shortening the distance between a light-emitting section or a light-receiving section of a semiconductor chip and a reflecting surface formed in a core to reduce optical losses between an opto-electric conversion substrate section and an optical waveguide section, and to provide a method of manufacturing the opto-electric hybrid module. SOLUTION: A recessed portion 3a is formed in a surface of an over cladding layer 3 of the optical waveguide section W 1 . At least part of the light-emitting section 7a or the light-receiving section of the semiconductor chip 7 for opto-electric conversion and at least part of a loop portion 8a of a bonding wire 8 in the opto-electric conversion substrate section E 1 are positioned within the recessed portion 3a, and, in this state, the opto-electric conversion substrate section E 1 is fixed on the optical waveguide section W 1 . This brings the light-emitting section 7a or the light-receiving section of the semiconductor chip 7 and the reflecting surface 2a formed in the core 2 closer to each other. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种光电混合模块，其能够缩短半导体芯片的发光部或受光部与形成在芯中的反射面之间的距离，以减小半导体芯片的光损耗光电转换基板部分和光波导部分，并且提供制造光电混合模块的方法。解决方案：在光波导部分W 1的上敷层3的表面上形成有凹部3a。用于光电转换的半导体芯片7的发光部分7a或光接收部分的至少一部分以及光电转换基板部分E中的接合线8的至少一部分环形部分8a， SB> 1 位于凹部3a内，并且在该状态下，光电转换基板部分E 1固定在光波导部分W <1> / SB>。这使得形成在芯体2中的半导体芯片7的发光部分7a或光接收部分和反射表面2a彼此接近。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2009265342A Method for manufacturing opto-electric hybrid board 有权
标题翻译：制造光电混合板的方法
公开(公告)号：JP2009265342A
公开(公告)日：2009-11-12
申请号：JP2008114329
申请日：2008-04-24
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HODONO MASAYUKI
IPC分类号： G02B6/13 , G02B6/122 , G02B6/42 , H05K1/02
CPC分类号： G02B6/13 , G02B6/4214 , G02B6/4224 , G02B6/43 , H05K1/0269 , H05K1/0274 , H05K3/0023 , H05K2201/09918
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing an opto-electric hybrid board which improves the alignment accuracy of an optical element with respect to a core of an optical waveguide. SOLUTION: When a core 7 of an optical waveguide W is formed on a surface of an electric circuit board E, the core 7 and optical element positioning alignment marks A are simultaneously formed from a photosensitive resin layer including a core 7 formation region and an alignment mark A formation region by a single photolithography process. In an optical element mounting step, a light emitting element 11 and a light receiving element 12 are mounted at proper positions with respect to the core 7 of the optical waveguide W with reference to the alignment marks A. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种提高光学元件相对于光波导的芯的对准精度的光电混合基板的制造方法。解决方案：当在电路板E的表面上形成光波导W的芯体7时，芯体7和光学元件定位对准标记A同时由包括芯部7形成区域的感光树脂层形成以及通过单个光刻工艺的对准标记A形成区域。在光学元件安装步骤中，参考对准标记A，发光元件11和光接收元件12相对于光波导W的芯体7安装在适当的位置。（C） 2010年，JPO＆INPIT

9. 发明专利

JP2009175275A Method of manufacturing optical waveguide device and optical waveguide device obtained thereby, and optical waveguide connecting structure used therefor 有权
标题翻译：制造光波导器件和获得的光波导器件的方法及其使用的光波导连接结构
公开(公告)号：JP2009175275A
公开(公告)日：2009-08-06
申请号：JP2008011886
申请日：2008-01-22
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HODONO MASAYUKI
IPC分类号： G02B6/122 , G02B6/13 , G02B6/42 , H01L31/0232
CPC分类号： G02B6/42 , G02B6/423 , G02B6/4239 , G02B6/4249 , H01L2224/48091 , H01L2924/1815 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical waveguide device by a simple step in which a light receiving/emitting element and an optical waveguide are optically coupled with superior accuracy, and to provide an optical waveguide device obtained thereby and an optical waveguide connecting structure used therefor. SOLUTION: An optical waveguide film is prepared in which a projected core pattern 11 is formed on an underclad layer 10. On a sealing resin layer 7 for sealing a light-receiving element 2 mounted on a substrate 1, a recess is formed whose bottom is superimposed on the light receiving part 2a of the light receiving/emitting element 2. The projected core pattern 11 of the optical waveguide film is fitted to the recess of the sealing resin layer, with the light receiving element 2 and the optical waveguide of the optical waveguide film optically coupled. Then, the core pattern 11 other than the fitting part is covered with an overclad layer 13. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：为了提供一种制造光波导器件的方法，该方法通过简单的步骤将光接收/发射元件和光波导以高精度光学耦合，并提供由此获得的光波导器件和用于其的光波导连接结构。解决方案：制备其中在下包层10上形成突出的芯图案11的光波导膜。在用于密封安装在基板1上的光接收元件2的密封树脂层7上形成凹部其底部叠加在光接收/发射元件2的光接收部分2a上。光导波导膜的投影芯图案11被配合到密封树脂层的凹部，光接收元件2和光波导的光学波导膜。然后，除了外包层13之外，除了装配部分之外的芯图案11被覆盖。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2009128430A Optical waveguide device production method, optical waveguide device produced by the method, and optical waveguide connection structure to be used for the device 有权
标题翻译：光波器件生产方法，通过该方法生产的光波导装置和用于装置的光波导连接结构
公开(公告)号：JP2009128430A
公开(公告)日：2009-06-11
申请号：JP2007300594
申请日：2007-11-20
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HODONO MASAYUKI
IPC分类号： G02B6/42 , H01L31/0232 , H01L33/54 , H01L33/56 , H01L33/62
CPC分类号： G02B6/4204 , G02B6/4201 , G02B6/424 , G02B6/4245 , G02B6/4255 , G02B6/4259 , G02B6/4269 , G02B6/4281 , H01L2224/45144 , H01L2224/48091 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an excellent optical waveguide device production method which ensures that a receptacle structure can be easily and highly accurately produced in a single step, to provide an optical waveguide device produced by the method, and to provide an optical waveguide connection structure to be used for the optical waveguide device. SOLUTION: The optical waveguide device includes a light emitting element 21 mounted on an upper surface of a board 20, and a core layer 29 which seals the light emitting element 21. The core layer 29 has an optical waveguide insertion recess 25 and an optical coupling lens 27 unitarily formed in a portion thereof opposed to a light emitting surface of the light emitting element 21. One end of an optical waveguide 30 is inserted in the recess 25 and fixed by a sealing resin 31. Thus, the optical waveguide 30 is optically coupled with a light emitting/receiving point of the light emitting element 21 in the core layer 29. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种优异的光波导器件制造方法，其能够确保在一个步骤中容易且高精度地制造插座结构，以提供通过该方法制造的光波导器件，并且提供一种用于光波导器件的光波导连接结构。解决方案：光波导器件包括安装在板20的上表面上的发光元件21和密封发光元件21的芯层29.芯层29具有光波导插入凹部25和光耦合透镜27在其与发光元件21的发光表面相对的部分中整体形成。光波导30的一端插入凹部25中并由密封树脂31固定。因此，光波导 30与芯层29中的发光元件21的发光/接收点光学耦合。版权所有（C）2009，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式