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1. 发明专利

JP2013166275A Extensibility organic base material having thermal insulating properties 审中-公开
标题翻译：具有热绝缘性能的可扩展有机基材
公开(公告)号：JP2013166275A
公开(公告)日：2013-08-29
申请号：JP2012030039
申请日：2012-02-15
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KITAHARA TATSUYA , NAITO TOMOYA , NAGASAKI KUNIO , SHIMURA AKIRA , MURAYAMA TSUNEKO , HIRANO HITOTSUGU
IPC分类号： B32B27/18 , B32B3/22 , B32B7/02
摘要： PROBLEM TO BE SOLVED: To provide an extensibility base material having thermal insulating properties that has extensibility, and that has a part in which a shape hardly changes even if being extended.SOLUTION: An extensibility organic base material having thermal insulating properties is a sheet-like organic base material that has extensibility such that a hardly extending part is formed in an extensibility matrix partially and integrally, the sheet-like organic base material contains a thermal insulating properties giving agent, and/or has a thermal insulating properties layer on at least one side of the sheet-like organic base material. It is desirable to use an inorganic hollow particles as the thermal insulating properties giving agent.
摘要翻译：要解决的问题：提供具有可延展性的具有绝热性的延展性基材，并且即使延伸，其形状几乎不变化的部分。解决方案：具有绝热性的可延展性有机基材是片状，作为有机基材，具有伸长性，使得几乎不延伸部分部分地并且整体地形成在延展性基体中，片状有机基材含有绝热性赋予剂，和/或至少具有绝热性层片状有机基材的一面。优选使用无机中空颗粒作为绝热性赋予剂。

2. 发明专利

JP2012039066A Heat-conductive sheet 审中-公开
标题翻译：导热片
公开(公告)号：JP2012039066A
公开(公告)日：2012-02-23
申请号：JP2011016922
申请日：2011-01-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IZUMITANI SEIJI , UCHIYAMA HISAE , FUKUOKA TAKAHIRO , HARA KAZUTAKA , HIRANO HITOTSUGU
IPC分类号： H01L23/36 , C08K3/38 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a heat conductive sheet that exhibits excellent thermoconductivity in the plane direction and achieves low water absorption.SOLUTION: A heat-conductive sheet 1 comprising plate-like boron nitride particles 2 has a coefficient of thermoconductivity of ≥4 W/m K in the plane direction (or the orthogonal direction) SD orthogonal to the thickness direction TD of the heat-conductive sheet 1, and water absorption of ≤3 mass%. The heat-conductive sheet 1 exhibits excellent thermoconductivity in the plane direction orthogonal to the thickness direction and has water absorption suppressed. As a result, the heat-conductive sheet 1 can suppress damage when exposed to a high temperature and can be used in various heat radiation applications as a heat-conductive sheet excellent both in handleability and in thermoconductivity in the plane direction.
摘要翻译：要解决的问题：提供在平面方向上显示出优异的导热性并实现低吸水性的导热片。解决方案：包含板状氮化硼颗粒2的导热片1在垂直于厚度方向TD的平面方向（或正交方向）SD上具有≥4W/ m K的导热系数导热片1，吸水率≤3质量％。导热片1在与厚度方向正交的平面方向上具有优异的导热性，并且抑制了吸水。结果，导热片1可以在暴露于高温时抑制损伤，并可用于各种热辐射应用中，作为在面方向上的可操作性和热导率优异的导热片。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2012039060A Heat-conductive sheet 审中-公开
标题翻译：导热片
公开(公告)号：JP2012039060A
公开(公告)日：2012-02-23
申请号：JP2011016916
申请日：2011-01-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IZUMITANI SEIJI , UCHIYAMA HISAE , FUKUOKA TAKAHIRO , HARA KAZUTAKA , HIRANO HITOTSUGU
IPC分类号： H01L23/36 , C08J5/18 , C08K3/28 , C08L101/00 , C09K5/08 , H01L23/373
CPC分类号： C09K5/14 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat conductive sheet that exhibits excellent flexibility and thermoconductivity in the plane direction.SOLUTION: The heat-conductive sheet 1 comprising plate-like boron nitride particles 2 at a rate of ≥35 mass% has a coefficient of thermoconductivity of ≥4 W/m K in the plane direction (orthogonal direction) SD orthogonal to the thickness direction TD of the heat-conductive sheet 1. This heat-conductive sheet 1 can be used in various heat radiation application as a heat-conductive sheet excellent both in handleability and in thermoconductivity in the plane direction SD.
摘要翻译：要解决的问题：提供在平面方向上显示优异的柔性和导热性的导热片。解决方案：包含板状氮化硼颗粒2的导热片1以≥35质量％的比例，在与正交于...的平面方向（正交方向）SD上的热导率系数≥4W/ m K 导热片1的厚度方向TD。该导热片1可以用于各种热辐射应用中，作为在面方向SD上的可操作性和导热性优异的导热片。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012036366A Thermally conductive adhesive sheet 有权
标题翻译：导热粘合片
公开(公告)号：JP2012036366A
公开(公告)日：2012-02-23
申请号：JP2011016926
申请日：2011-01-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IZUMITANI SEIJI , UCHIYAMA TOSHIE , FUKUOKA TAKAHIRO , HARA KAZUTAKA , HIRANO HITOTSUGU
IPC分类号： C09J7/02
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a thermally conductive adhesive sheet which is excellent in thermal conductivity in a surface direction, and also excellent in adhesiveness and in pressure-sensitive adhesiveness.SOLUTION: In the thermally conductive adhesive sheet 1, a thermally conductive layer 2 containing plate-like boron nitride particles 4 and having a thermal conductivity in the surface direction SD of the thermal conductive layer 2 of 4 W/mK or more, and an adhesive/pressure-sensitive adhesive layer 3 laminated at least on a surface of the thermally conductive layer 2 are provided. By using the thermally conductive adhesive sheet 1, heat from electronic components 8 can be dissipated along the surface direction SD while being able to adhere to, or pressure-sensitively adhere to, the electronic components 8 and a mounting substrate 7 with an excellent adhesion property.
摘要翻译：要解决的问题：提供一种表面导热性优异的导热性粘合片，并且粘合性和压敏粘合性也优异。解决方案：在导热粘合片1中，包含板状氮化硼颗粒4并且导热层2的表面方向SD的热导率为4W / mK以上的导热层2，并且设置至少在导热层2的表面上层合的粘合/压敏粘合剂层3。通过使用导热性粘合片1，可以沿着表面方向SD散发来自电子部件8的热量，同时能够粘附或压敏敏感地附着到电子部件8和具有优异的粘附性的安装基板7 。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2013166278A Stretchable organic base material 审中-公开
标题翻译：可拉伸的有机基材
公开(公告)号：JP2013166278A
公开(公告)日：2013-08-29
申请号：JP2012030086
申请日：2012-02-15
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAITO TOMOYA , KITAHARA TATSUYA , NAGASAKI KUNIO , SHIMURA AKIRA , MURAYAMA TSUNEKO , HIRANO HITOTSUGU
IPC分类号： B32B5/14 , B32B27/00
摘要： PROBLEM TO BE SOLVED: To provide a stretchable base material that has stretchability and a part whose shape is hardly changed even when stretched, and is excellent in gas barrier property.SOLUTION: A stretchable organic base material A includes a gas barrier layer 6 on at least one surface of a sheet-like organic base material having stretchability, in which a poorly stretchable section 3 is partially and integrally formed in a stretchable matrix 2, and satisfies one or both of provided formula [i] and [ii]. [i] the oxygen permeability of the thickness of 100 μm measured under the condition of 20°C and 70% RH according to a method of JISK7126-2 is 10 mL/m/0.1 MPa/day or less. [i]the water vapor permeability of the thickness of 100 μm measured under the condition of 40°C and 90% RH according to a method of JISK7129B is 10 g/m/0.1 MPa/day or less.
摘要翻译：要解决的问题：提供具有拉伸性的伸缩性基材和即使拉伸时形状几乎不变化的部分，并且阻气性优异。解决方案：可拉伸有机基材A包括在其上的阻气层6 具有拉伸性的片状有机基材的至少一个表面，其中难拉伸部分3部分地并且整体形成在可拉伸基体2中，并且满足所提供的式[i]和[ii]中的一个或两个。 [i]根据JISK7126-2的方法，在20℃，70％RH的条件下测定的厚度为100μm的透氧度为10mL / m / 0.1MPa /天以下。 [i]根据JISK7129B的方法在40℃，90％RH的条件下测定的厚度为100μm的水蒸汽渗透性为10g / m / 0.1MPa /天以下。

6. 发明专利

JP2012039065A Heat-conductive sheet 审中-公开
标题翻译：导热片
公开(公告)号：JP2012039065A
公开(公告)日：2012-02-23
申请号：JP2011016921
申请日：2011-01-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IZUMITANI SEIJI , UCHIYAMA HISAE , FUKUOKA TAKAHIRO , HARA KAZUTAKA , HIRANO HITOTSUGU
IPC分类号： H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide a heat conductive sheet that exhibits excellent thermoconductivity in the plane direction as well as excellent concealment properties.SOLUTION: The heat-conductive sheet 1 comprising plate-like boron nitride particles 2 has a coefficient of thermoconductivity of ≥4 W/m K in the plane direction SD of the heat-conductive sheet 1, and the heat-conductive sheet 1 having thickness of 300 μm has a transmission coefficient of ≤10% relative to light having a wavelength of 500nm. This heat-conductive sheet 1 exhibits excellent thermoconductivity in the plane direction SD as well as excellent concealment properties.
摘要翻译：要解决的问题：提供在平面方向上显示出优异的热传导性以及优异的隐藏性的导热片。解决方案：包含板状氮化硼颗粒2的导热片1在导热片1的平面方向SD上具有≥4W/ m K的导热系数，并且导热片 1相对于波长为500nm的光具有≤10％的透射系数。该导热片1在平面方向SD上表现出优异的导热性，并且具有优异的隐蔽性。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2012039061A Heat-conductive sheet 审中-公开
标题翻译：导热片
公开(公告)号：JP2012039061A
公开(公告)日：2012-02-23
申请号：JP2011016917
申请日：2011-01-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IZUMITANI SEIJI , UCHIYAMA HISAE , FUKUOKA TAKAHIRO , HARA KAZUTAKA , HIRANO HITOTSUGU
IPC分类号： H01L23/373 , C01B21/064 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a heat conductive sheet that exhibits excellent thermoconductivity in the plane direction and also excels in electric insulation.SOLUTION: The heat-conductive sheet 1 comprising plate-like boron nitride particles 2 has a coefficient of thermoconductivity of ≥4 W/m K in the plane direction SD of the heat-conductive sheet 1, and volume resistivity R of ≥1×10Ω cm. This heat-conductive sheet 1, when covering electronic elements, can protect the electronic elements, effectively conduct the heat of the electronic elements and prevent short circuit among the electronic elements.
摘要翻译：要解决的问题：提供在平面方向上显示优异的导热性并且还具有优异的电绝缘性的导热片。解决方案：包含板状氮化硼颗粒2的导热片1在导热片1的平面方向SD上的导热系数为≥4W/ m K，体积电阻率R为≥ 1×10 10 Ωcm。该导热片1在覆盖电子元件时可以保护电子元件，有效地传导电子元件的热量并防止电子元件之间的短路。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2012036364A Heat-conductive sheet 审中-公开
标题翻译：导热片
公开(公告)号：JP2012036364A
公开(公告)日：2012-02-23
申请号：JP2011016923
申请日：2011-01-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IZUMITANI SEIJI , UCHIYAMA TOSHIE , FUKUOKA TAKAHIRO , HARA KAZUTAKA , HIRANO HITOTSUGU
IPC分类号： C08J5/18
CPC分类号： C09K5/14
摘要： PROBLEM TO BE SOLVED: To provide a heat-conductive sheet excellent in surface-directional thermal conductivity, and excellent in heat resistance.SOLUTION: The heat-conductive sheet 1 contains a plate-like boron nitride particle 2, and has 4 W/mK or more of thermal conductivity along a surface direction (orthogonal direction) SD orthogonal to a thickness direction TD of the heat-conductive sheet 1, and 125°C or more of glass transition point determined as a peak value of tanδ obtained in dynamic viscoelastic measurement at 10 Hz of frequency. The heat-conductive sheet 1 is excellent in the surface-directional thermal conductivity along the surface direction orthogonal to the thickness direction, further reduces deformation under high temperatures, restrains separation, and is usable for various heat radiation applications, as the heat-conductive sheet 1 superior in handleability and superior in the surface-directional thermal conductivity.
摘要翻译：要解决的问题：提供表面方向导热性优异，耐热性优异的导热片。解决方案：导热片1包含板状氮化硼颗粒2，并且沿着与热的厚度方向TD正交的表面方向（正交方向）SD具有4W / mK或更高的热导率导电片1和125℃或更高的玻璃化转变点，其确定为在频率为10Hz的动态粘弹性测量中获得的tanδ的峰值。导热片1沿着与厚度方向正交的表面方向的表面方向导热性优异，进一步减少高温下的变形，抑制分离，可用于各种散热用途，作为导热片 1优异的可操作性和优异的表面方向热导率。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2013166276A Extensibility organic base material having flame retardancy 审中-公开
标题翻译：具有阻燃性的可扩展有机基材
公开(公告)号：JP2013166276A
公开(公告)日：2013-08-29
申请号：JP2012030041
申请日：2012-02-15
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KITAHARA TATSUYA , NAITO TOMOYA , NAGASAKI KUNIO , SHIMURA AKIRA , MURAYAMA TSUNEKO , HIRANO HITOTSUGU
IPC分类号： B32B27/18 , B32B3/22
摘要： PROBLEM TO BE SOLVED: To provide an extensibility base material having flame retardancy that has extensibility, and that has a part in which a shape hardly changes even if being extended.SOLUTION: An extensibility organic base material having flame retardancy is a sheet-like organic base material that has extensibility such that a hardly extending part is formed in an extensibility matrix partially and integrally, the sheet-like organic base material contains a flame retardant, and/or has a flame retardant layer on at least one side of the sheet-like organic base material. It is desirable to use at least one kind chosen from a halogen based compound, a phosphorus compound, an antimony based compound, and metal hydroxide as the flame retardant.
摘要翻译：要解决的问题：提供具有延展性的阻燃性的延展性基材，并且即使延伸，也具有形状几乎不变化的部分。解决方案：具有阻燃性的可延展性有机基材是片状有机物所述片状有机基材含有阻燃剂，和/或在所述片状有机基材的至少一面上具有阻燃层，所述基材具有延展性，像有机基材。期望使用选自卤素类化合物，磷化合物，锑基化合物和金属氢氧化物中的至少一种作为阻燃剂。

10. 发明专利

JP2012049102A Backlight, and liquid crystal display device 有权
标题翻译：背光和液晶显示装置
公开(公告)号：JP2012049102A
公开(公告)日：2012-03-08
申请号：JP2011016930
申请日：2011-01-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IZUMITANI SEIJI , HARA KAZUTAKA , FUKUOKA TAKAHIRO , UCHIYAMA TOSHIE , HIRANO HITOTSUGU
IPC分类号： F21S2/00 , F21Y101/02 , G02F1/13357
CPC分类号： G02F1/1336 , G02F2001/133628
摘要： PROBLEM TO BE SOLVED: To provide a backlight device capable of efficiently diffusing heat generated in an irradiating portion, and to provide a liquid crystal display device having excellent display performance.SOLUTION: The backlight 3 is provided with the irradiating portion 4 to irradiate light on a liquid crystal panel 2 and a thermal diffusion member 5 in contact with the irradiating portion 4. The thermal diffusion member 5 is composed of a thermally conductive sheet 11 containing plate-like boron nitride particles 17, and a thermal conductivity in a SD (a surface direction) of the thermally conductive sheet 11 is 4 W/(m.K) or more.

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