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1. 发明专利

JP2008248791A Sealed lash adjuster 审中-公开
标题翻译：密封缓冲器
公开(公告)号：JP2008248791A
公开(公告)日：2008-10-16
申请号：JP2007091262
申请日：2007-03-30
申请人： Nittan Valve Co Ltd , Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 日鍛バルブ株式会社 , 株式会社豊田中央研究所
发明人： KATSUMATA MASAJI , OSHIMA TADASHI , NAKANISHI KAZUYUKI , TACHIKAWA HIDEO , HOSAKA AKIHIKO
IPC分类号： F01L1/24
摘要： PROBLEM TO BE SOLVED: To provide a sealed lash adjuster capable of securing function under a harsh condition, of securing necessary lift loss under a low temperature condition, and of suitably inhibiting damage of working fluid due to heat generation of a sliding part and wear of the sliding part simultaneously.
SOLUTION: The sealed lash adjuster 100 includes methylphenylsilicone oil having predetermined functionally necessary kinematic viscosity as working fluid, and has diamond-like-carbon (DLC) coating formed on a sliding surface of a plunger 2. The methylphenylsilicone oil has kinematic viscosity characteristics of not less than 20 cst at 130°C and not greater than 2000 cst at -35°C as the predetermined kinematic viscosity characteristics. DLC coating contains Si. Si content is not less than 1 at.% and not greater than 20 at.%.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在恶劣条件下确保功能的密封的间隙调节器，在低温条件下确保必要的升力损失，并适当地抑制由于滑动部件的发热而导致的工作流体的损坏同时滑动部件的磨损。密封的间隙调节器100包括作为工作流体具有预定的功能性运动粘度的甲基苯基硅油，并且在柱塞2的滑动表面上形成类金刚石碳（DLC）涂层。甲基苯基硅油具有运动粘度特性在130℃下不低于20cst且在-35℃下不大于2000cst，作为预定的运动粘度特性。 DLC涂层含有Si。 Si含量不小于1原子％且不大于20原子％。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2013004309A Metal nanoparticle paste 审中-公开
标题翻译：金属纳米胶
公开(公告)号：JP2013004309A
公开(公告)日：2013-01-07
申请号：JP2011134381
申请日：2011-06-16
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： FURUKAWA MASASHI , SHIBATA YOSHINORI , KONISHI TOKUJIRO , ISHIZAKI TOSHITAKA , TAKAO HISAFUMI , OSHIMA TADASHI , GOMI RYOSUKE , YOSHIDA TAKASHI
IPC分类号： H01B1/22 , H01B13/00 , H05K3/12 , H05K3/32
CPC分类号： B23K35/025 , B23K35/365
摘要： PROBLEM TO BE SOLVED: To provide a metal nanoparticle paste having low viscosity while containing a high proportion of metal nanoparticles.SOLUTION: A metal nanoparticle paste contains metal nanoparticles, a phosphoric acid-based dispersant having a hydrophilic part, and a polar solvent. The content of the metal nanoparticles is 70 wt. % or more and less than 100 wt. %.
摘要翻译：待解决的问题：提供具有低粘度的金属纳米颗粒糊剂，同时含有高比例的金属纳米颗粒。解决方案：金属纳米颗粒糊包含金属纳米颗粒，具有亲水部分的磷酸基分散剂和极性溶剂。金属纳米粒子的含量为70wt。％以上且小于100重量％％。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2012082097A Metallization method and metallization apparatus for ceramics 审中-公开
标题翻译：用于陶瓷的金属化方法和金属化装置
公开(公告)号：JP2012082097A
公开(公告)日：2012-04-26
申请号：JP2010228664
申请日：2010-10-08
申请人： Aisin Seiki Co Ltd , Toyota Central R&D Labs Inc , Toyota Industries Corp , Toyota Motor Corp , アイシン精機株式会社 , トヨタ自動車株式会社 , 株式会社豊田中央研究所 , 株式会社豊田自動織機
发明人： GOMI RYOSUKE , KANO MITSUHIRO , INOUE TOSHIKI , SHIBATA YOSHINORI , KONISHI TOKUJIRO , FURUKAWA MASASHI , KASUYA SHIGETAKA , OSHIMA TADASHI , ITO HIROFUMI , TAKAO HISAFUMI , IKEHATA HIDEAKI , TAKAMIYA HIROYUKI
IPC分类号： C04B41/88 , B23K1/005 , B23K1/19
摘要： PROBLEM TO BE SOLVED: To provide a metallization method for a ceramics, which method is capable of forming a metallic layer on the surface of the ceramics by efficiently heating and melting a metal without generating arc discharge at the time of heating the metal.SOLUTION: When metallization of the ceramics is carried out, a work W with which a ceramics 21 and a metallic foil 22 are held in a housing body 20 made from a heat insulating material is arranged on a placing part 15 of a work, and then the work W is irradiated with a millimetric-wave from a millimetric-wave irradiating part 13 in a closed vessel 11 in an inert atmosphere. The housing body 20 is formed into a bottomed boxing, and its opening is covered with a cover 20a made of a heat insulating material. The cover 20a is laid on a metallic foil 22 by laminating a heating auxiliary agent 23, a junction preventing sheet 24, the ceramics 21, and the metallic foil 22 in this order from the basilar part side of the housing body 20.
摘要翻译：要解决的问题：为了提供一种陶瓷的金属化方法，该方法能够通过在加热金属时有效地加热和熔化金属而不产生电弧放电而在陶瓷的表面上形成金属层。解决方案：当进行陶瓷的金属化时，将陶瓷21和金属箔22保持在由绝热材料制成的壳体20中的工件W布置在工件的放置部分15上，然后在惰性气氛下，在密闭容器11中从毫米波照射部13用毫米波照射工件W. 壳体20形成为有底的拳击，其开口被覆盖有由绝热材料制成的盖20a。通过从壳体主体20的基底部侧依次层叠加热助剂23，接合防止片24，陶瓷21和金属箔22，将盖20a放置在金属箔22上。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2009279649A Joining material and calculating method of components of joining material 有权
标题翻译：接合材料的接合材料与计算方法
公开(公告)号：JP2009279649A
公开(公告)日：2009-12-03
申请号：JP2009074372
申请日：2009-03-25
申请人： Ebara Corp , Toyota Central R&D Labs Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社荏原製作所 , 株式会社豊田中央研究所
发明人： SHIBATA YOSHINORI , ISHIKAWA YOSHIMUNE , ICHIYANAGI TERUYOSHI , ISHIZAKI TOSHITAKA , OSHIMA TADASHI , SUDO EIICHI , KATO YUICHI , OSHIMA FUMIKO , HASEGAWA YORIKO , KONDO KAYO
IPC分类号： B23K35/363 , B23K35/14 , B23K35/22 , H05K3/32
CPC分类号： H05K3/321 , B23K35/0244 , B23K35/3006 , B23K35/3618 , H05K2201/0257 , H05K2203/1131 , H05K2203/125
摘要： PROBLEM TO BE SOLVED: To provide a joining material capable of achieving a short joining time and stabilizing joining strength. SOLUTION: Decomposition reaction of myristic acid is more activated by a synergetic effect of a reaction-promoting function by silver carbonate 24 and a reaction-promoting function by myristic acid (silver myristate 16 and myristic acid crystalline 26), namely, by promoting reduction of silver carbonate 24 by myristic acid to supply oxygen necessary for an organic decomposition reaction by heating and baking. This generates heat increase along an application range of the joining material 12 to improve joining strength and shorten the joining time. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够实现短的接合时间和稳定接合强度的接合材料。解决方案：肉豆蔻酸的分解反应通过反应促进功能与碳酸银24的协同作用和肉豆蔻酸（肉豆蔻酸十四烷酸和肉豆蔻酸晶体26）的反应促进作用，即通过通过肉豆蔻酸促进还原碳酸银24以通过加热和烘烤提供有机分解反应所需的氧。这样会沿接合材料12的应用范围产生热量增加，以提高接合强度并缩短接合时间。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2011021255A Three-metallic-component type composite nanometallic paste, method of bonding, and electronic component 审中-公开
标题翻译：三金属组分型复合纳米粒子，粘结方法和电子元件
公开(公告)号：JP2011021255A
公开(公告)日：2011-02-03
申请号：JP2009168210
申请日：2009-07-16
申请人： Aisin Seiki Co Ltd , Applied Nanoparticle Laboratory Corp , Toyota Central R&D Labs Inc , Toyota Industries Corp , Toyota Motor Corp , アイシン精機株式会社 , トヨタ自動車株式会社 , 株式会社応用ナノ粒子研究所 , 株式会社豊田中央研究所 , 株式会社豊田自動織機
发明人： KOMATSU AKIO , SHIBATA YOSHINORI , NAKAMURA HIDEO , FURUKAWA MASASHI , GOMI RYOSUKE , KANO MITSUHIRO , SUGIE TAKASHI , KASUYA SHIGETAKA , YAMAGUCHI SHUHEI , ISHIZAKI TOSHITAKA , OSHIMA TADASHI , TAKAO HISAFUMI , TOMINAGA NAOTOSHI
IPC分类号： B22F1/02 , B22F1/00 , B22F9/24 , B23K35/22 , C23C24/08 , H01B1/00 , H01B1/22
CPC分类号： H01B1/22 , B22F1/0062 , B22F1/0074 , B22F7/08 , B22F9/24 , B22F2999/00 , B23K35/025 , B23K35/3006 , B23K35/365 , Y10T428/2991 , Y10T428/2993 , Y10T428/2995 , Y10T428/2996 , Y10T428/2998 , Y10T428/31678 , B22F7/064 , B22F1/0014 , B22F1/0018
摘要： PROBLEM TO BE SOLVED: To provide a composite nanometallic paste which, when a layer of paste is sintered in an inert gas under non pressure until the layer turns to a metal layer, attains a shear bond strength between the upper and lower bodies of 10 MPa or higher. SOLUTION: The composite nanometallic paste contains, as metallic components, composite metallic nanoparticles comprising metal cores with an average particle diameter of X (nm) and an organic coating layer formed on the periphery thereof, metallic nanofiller particles having an average particle diameter of d (nm), and metallic filler particles having an average particle diameter of D (nm) as a metallic component, and satisfies the first relationship X COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种复合纳米金属糊料，当一层糊料在惰性气体中在非压力下烧结直到层转向金属层时，获得上下体之间的剪切粘合强度为10MPa以上。＆lt; P＆gt;解决方案：复合纳米金属糊作为金属成分含有包含平均粒径为X（nm）的金属芯和在其周围形成的有机被覆层的复合金属纳米粒子，其平均粒径 d（nm）的平均粒径和作为金属成分的平均粒径D（nm）的金属填料粒子，满足第一关系X

6. 发明专利

JP2012135816A Copper brazing filler metal 有权
标题翻译：铜制填充金属
公开(公告)号：JP2012135816A
公开(公告)日：2012-07-19
申请号：JP2011261568
申请日：2011-11-30
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： ITO KAZUHIKO , OSHIMA TADASHI , TAKAO HISAFUMI
IPC分类号： B23K35/30 , B22F3/10 , B22F7/06 , B23K1/19 , B23K35/40 , B23K103/02 , C22C9/05 , C22C9/06 , C22F1/00 , C22F1/08
CPC分类号： C22C9/06 , B23K35/0244 , B23K35/24 , B23K35/302 , B23K35/3033 , C22C1/0425 , C22C9/05 , C22C30/02
摘要： PROBLEM TO BE SOLVED: To provide a copper brazing filler metal that can keep high joining strength even when there is a variation in the surface conditions of a joined face like a green compact and a sintered body.SOLUTION: The copper brazing filler metal includes Ni in an amount of from 20 or more to 36% or less by mass, Mn in an amount from 19 or more to 30% or less by mass, Fe in an amount of from 0 or more to 16% or less by mass, Si in an amount of from more than 0 (not inclusive) to 2% or less by mass, B in an amount of from 0.1 or more to 0.5% or less by mass, and the balance copper (Cu) with inevitable impurities and/or a modifying element, when the entirety is taken as 100% by mass. Moreover, the copper brazing filler metal exhibits a ratio of the Ni content to the Mn content (i.e., (Ni content)/(Mn content)) that falls in a range of from 1.1 or more to 2 or less when being free from Fe.
摘要翻译：要解决的问题：即使当诸如生坯和烧结体的接合面的表面状态发生变化时，也可提供能够保持高接合强度的铜钎焊料。解决方案：铜钎焊料包含20质量％以上至36质量％以下的Ni，量为19质量％以上且30质量％以下的Mn，Fe量为 0以上16质量％以下，Si以上且0以下，不超过2质量％，B：0.1以上且0.5质量％以下，B：当全部为100质量％时，余量为不可避免的杂质的铜（Cu）和/或改性元素。此外，铜钎焊料在不含Fe的情况下，表现出Ni含量与Mn含量的比例（即，（Ni含量）/（Mn含量））为1.1以上2以下的范围。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2013198924A Bonded body, method for manufacturing the same and member to be bonded 有权
标题翻译：粘结体，制造方法和粘合方法
公开(公告)号：JP2013198924A
公开(公告)日：2013-10-03
申请号：JP2012068476
申请日：2012-03-23
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： OSHIMA TADASHI , TAKAO HISAFUMI , ITO HIROFUMI
IPC分类号： B23K20/10 , H01L21/60
CPC分类号： B23K20/10 , B32B7/04 , B32B15/01 , B32B2250/02 , B32B2311/24 , H01L24/80 , H01L24/81 , H01L24/83 , H01L2224/16227 , H01L2224/80205 , H01L2224/80365 , H01L2224/80385 , H01L2224/81205 , H01L2224/81365 , H01L2224/81385 , H01L2224/83205 , H01L2224/83365 , H01L2224/83385 , H01L2924/12042 , Y10T428/12472 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a bonded body having been solid-phase bonded at room temperature, the bonded body having a novel structure different from conventional bonded bodies.SOLUTION: A bonded body is formed by solid-phase bonding a first member to be bonded to a second member to be bonded, and has a bonding interface between the first member to be bonded and the second member to be bonded. This bonded body is characterized in that the average crystal grain size (ds) in a structure close to the interface, the structure constituting an area close to the interface the center of which is the bonding interface and which extends on both sides thereof with a total width of 20 μm, corresponds to 75 to 100% of the average crystal grain size (dm) in a structure surrounding the interface, the structure constituting areas surrounding the interface which are located on both outer sides of the area close to the interface. In the bonded body, the structure close to the interface after bonding is almost the same as the structure before bonding. Therefore, the bonded body can exert the characteristics inherent to the members to be bonded.
摘要翻译：要解决的问题：为了提供在室温下固相接合的接合体，该接合体具有与常规接合体不同的新型结构。解决方案：通过将第一构件固相接合而形成接合体以形成粘合到待接合的第二构件上，并且在待接合的第一构件和待接合的第二构件之间具有接合界面。该粘结体的特征在于，靠近界面的结构中的平均结晶粒径（ds），其结构构成接近其界面的界面，其中心是接合界面，并且其两侧总共延伸 20μm的宽度对应于界面周围的结构中的平均结晶粒径（dm）的75〜100％，构成围绕界面的区域的结构位于靠近界面的区域的两个外侧。在接合体中，接合后的界面附近的结构与接合前的结构几乎相同。因此，粘合体可以发挥要结合的构件固有的特性。

8. 发明专利

JP2014226686A 接合材、その製造方法、部材接合方法および接合部材有权
标题翻译：联合材料，其制造方法，会员联合方法和接头成员
公开(公告)号：JP2014226686A
公开(公告)日：2014-12-08
申请号：JP2013107526
申请日：2013-05-21
申请人：株式会社豊田中央研究所 , Toyota Central R&D Labs Inc
发明人： MAEJIMA TAKASHI , OSHIMA TADASHI , TANAKA KOJI , TAKAO HISAFUMI
IPC分类号： B23K20/00 , B23K35/30
摘要：【課題】短時間で強固な接合を行えると共に、被接合部材の組成によらず接合部における組成や組織の不均質化を抑制して、接合部材全体の機械的特性や信頼性等の向上を図れる接合材を提供する。【解決手段】本発明の接合材は、第一部材の第一鉄鋼材からなる第一端部と第二部材の第二鉄鋼材からなる第二端部との間に介在され、第一鉄鋼材および第二鉄鋼材の融点よりも低い接合温度で加熱されることにより第一部材と第二部材とを接合する接合材であって、Mnを含むセメンタイトである安定化セメンタイトからなることを特徴とする。この安定化セメンタイトは、さらにCrを含有すると好ましい。この際、Mn量:X、Cr量:YとしてY≧−0.53X+0.7を満たす範囲にあると、高温域まで安定なセメンタイト単相が得られて好ましい。【選択図】図1
摘要翻译：要解决的问题：为了提供一种能够在短时间内牢固地接合的接合材料，并且通过抑制接合中的组合物或组织的不均匀性，而不管接头的组成如何，可以提高整个接头构件的机械特性和可靠性物体构件。解决方案：本发明的接合材料，其是介于由第一构件的第一钢材构成的第一端和由第二构件的第二钢材制成的第二端之间的接合材料，并且接合第一通过在低于第一钢材和第二钢材的熔点的接合温度下加热第二构件，其特征在于由作为含Mn渗碳体的稳定渗碳体制成。该稳定性渗碳体优选进一步含有Cr。此时，如果Mn量为X，Cr量为Y，则满足Y≥-0.53X + 0.7的范围，则优选在高温范围内可获得稳定的渗碳体单相。

9. 发明专利

JP2010067637A Heat dissipation member, semiconductor device using the same, and methods of manufacturing the heat dissipation member and the semiconductor device 审中-公开
标题翻译：散热部件，使用该散热部件的半导体器件以及制造散热部件和半导体器件的方法
公开(公告)号：JP2010067637A
公开(公告)日：2010-03-25
申请号：JP2008229961
申请日：2008-09-08
申请人： Toyota Central R&D Labs Inc , Toyota Industries Corp , 株式会社豊田中央研究所 , 株式会社豊田自動織機
发明人： SAITO SATSUKI , KONDO TOSHIRO , KOISHI SHIGEKATSU , YAMADA YUKA , OSHIMA TADASHI
IPC分类号： H01L23/373 , C23C16/26 , C23C16/503 , H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide: a heat dissipation member which improves an adhesiveness of an amorphous carbon coat with a bad adhesiveness to have an excellent adhesive property to a member more simply bonded to a front surface of the amorphous carbon coat; a semiconductor device using the heat dissipation member; and, furthermore, methods of manufacturing the heat dissipation member and the semiconductor device.
SOLUTION: The heat dissipation member comprises: a thermally conductive base material; the insulating amorphous carbon coat which coats at least a part of a front surface of the base material, and includes carbon as a principal component and silicon largely residing on a surface part, opposite to a base material side, rather than the base material side; and a bonding layer which is fixed to the front surface of the amorphous carbon coat and consists of resin containing M (M=Si, Ti, Al, or Zr) in which bonds with silicon in the amorphous carbon coat via an Si-O-M binding.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决问题的方案：提供一种散热构件，其改善了粘合性差的非晶碳涂层的粘合性，使得与无定形碳涂层的前表面更简单地结合的构件具有优异的粘合性; 使用该散热构件的半导体装置; 以及制造散热构件和半导体装置的方法。散热构件包括：导热基材; 覆盖基材前表面的至少一部分的绝缘无定形碳涂层，其包含碳作为主要成分，硅主要存在于与基材侧相反的表面部分上，而不是基材侧; 和固定在无定形碳涂层前表面上的粘合层，由含有M（M = Si，Ti，Al或Zr）的树脂组成，其中通过Si-OM结合在无定形碳涂层中与硅键合。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2010046700A Bonded structure and method for manufacturing the same 有权
标题翻译：粘结结构及其制造方法
公开(公告)号：JP2010046700A
公开(公告)日：2010-03-04
申请号：JP2008214546
申请日：2008-08-22
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： YAMADA YUKA , SUZUKI KENICHI , NAKANISHI KAZUYUKI , OSHIMA TADASHI
IPC分类号： B23K1/19 , B23K35/26 , B23K101/40 , C22C13/00 , H01L23/373
摘要： PROBLEM TO BE SOLVED: To provide a novel bonded structure manufactured by bonding various kinds of carbon films and metal materials by soldering, and a method for manufacturing the same.
SOLUTION: The bonded structure is composed of a first member 1 and a second member 2, and has a bonding portion 3. The first member 1 includes a substrate 1s and a carbon film 1f which coats at least a part of the surface of the substrate 1s. At least a part of the second member 2 includes a metal material 2. The bond portion 3 is formed by bonding the carbon film 1f and the metal material 2 by soldering. The carbon film 1f contains oxygen in at least the bonded interface 1j. Tin solder 3j of the bond portion 3 contains tin as a main component and one or more selected from a group of zinc and rare-earth elements. The tin solder 3j of the bond portion 3 is chemically bonded to the oxygen contained in the carbon film 1f and also is diffusion-bonded to the metal material 2 or is chemically bonded to oxygen in an oxide formed on the surface of the metal material 2.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供通过焊接将各种碳膜和金属材料接合而制造的新型结合结构及其制造方法。解决方案：接合结构由第一构件1和第二构件2构成，并具有接合部3.第一构件1包括基板1s和覆盖表面的至少一部分的碳膜1f 的基板1s。第二构件2的至少一部分包括金属材料2.通过焊接将碳膜1f和金属材料2接合而形成接合部3。至少在粘合界面1j中，碳膜1f含有氧。接合部分3的锡焊料3j含有锡作为主要成分，并且选自一组锌和稀土元素中的一种或多种。接合部分3的锡焊料3j与碳膜1f中所含的氧化学键合，并且还与金属材料2扩散接合，或者在形成于金属材料2的表面上的氧化物中化学键合氧。版权所有（C）2010，JPO＆INPIT

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