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    • 1. 发明授权
    • Method for producing three-dimensional structures by means of an etching process
    • 通过蚀刻工艺制备三维结构的方法
    • US06663784B1
    • 2003-12-16
    • US09890080
    • 2002-02-04
    • Nils KummerRoland Mueller-FiedlerKlaus BreitschwerdtAndre MuellerFrauke DriewerAndreas Kern
    • Nils KummerRoland Mueller-FiedlerKlaus BreitschwerdtAndre MuellerFrauke DriewerAndreas Kern
    • H01L2100
    • B81C1/00412
    • A method is proposed for producing three-dimensional structures, especially microlenses, in a substrate using an etching process, at least one original shape having a known original surface shape being present initially on the substrate in a plurality of places. The etching process has at least one first etching removal rate a1 and a second etching removal rate a2 which are material-dependent, and of which at least one is changeable as a function of time. The original shape is converted to a target shape by the etching process, the original surface shape of the original shape and the target surface shape of the target shape to be reached being known before the beginning of the etching process. In order to achieve the target surface shape, at least one of the etching rates a2 or a1 is set by a change of at least one etching parameter calculated before the beginning of the etching process as a function of the etching time.
    • 提出了一种使用蚀刻工艺在衬底中制造三维结构,特别是微透镜的方法,至少一种具有已知原始表面形状的原始形状最初存在于多个位置的衬底上。 蚀刻工艺具有与材料有关的至少一个第一蚀刻去除速率a1和第二蚀刻去除速率a2,其中至少一个可随时间变化。 原始形状通过蚀刻处理转换为目标形状,原始形状的原始表面形状和待形成的目标形状的目标表面形状在蚀刻工艺开始之前是已知的。 为了实现目标表面形状,蚀刻速度a2或a1中的至少一个通过蚀刻工艺开始之前计算的至少一个蚀刻参数的变化来设定,作为蚀刻时间的函数。