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1. 发明授权

US08780581B2 Structures for forming conductive paths in antennas device and other electronic device structures 有权
标题翻译：用于在天线装置和其他电子装置结构中形成导电路径的结构
公开(公告)号：US08780581B2
公开(公告)日：2014-07-15
申请号：US13024300
申请日：2011-02-09
申请人： Nicholas G. L. Merz , Daniel W. Jarvis , Sawyer I. Cohen
发明人： Nicholas G. L. Merz , Daniel W. Jarvis , Sawyer I. Cohen
IPC分类号： H05K7/14 , H05K7/18
CPC分类号： H01Q1/50 , H01Q1/243 , H01Q1/48 , H01Q9/42 , H01Q13/10
摘要： Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member.
摘要翻译：可以提供包含导电路径的电子设备。导电路径可以由延伸穿过天线中的电介质间隙的细长金属构件形成。天线可以由形成天线接地的导电结构和作为电子设备中的外围导电外壳构件的一部分的导电结构形成。间隙可以将外围导电壳体构件与导电结构分离。也可以使用一个或多个弹簧形成导电路径。弹簧可以焊接到导电构件上，并且当弹簧被压缩时可以具有压靠附加的导电构件的插脚。尖头可能具有变窄的尖端，弯曲形状和毛刺，这有助于在弹簧插脚和附加导电构件之间形成令人满意的电接触。

2. 发明申请

US20120176279A1 STRUCTURES FOR FORMING CONDUCTIVE PATHS IN ANTENNAS AND OTHER ELECTRONIC DEVICE STRUCTURES 有权
标题翻译：在天线和其他电子设备结构中形成导电波纹的结构
公开(公告)号：US20120176279A1
公开(公告)日：2012-07-12
申请号：US13024300
申请日：2011-02-09
申请人： Nicholas G. L. Merz , Daniel W. Jarvis , Sawyer I. Cohen
发明人： Nicholas G. L. Merz , Daniel W. Jarvis , Sawyer I. Cohen
IPC分类号： H01Q1/12 , H02G3/00
CPC分类号： H01Q1/50 , H01Q1/243 , H01Q1/48 , H01Q9/42 , H01Q13/10
摘要： Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member.
摘要翻译：可以提供包含导电路径的电子设备。导电路径可以由延伸穿过天线中的电介质间隙的细长金属构件形成。天线可以由形成天线接地的导电结构和作为电子设备中的外围导电外壳构件的一部分的导电结构形成。间隙可以将外围导电壳体构件与导电结构分离。也可以使用一个或多个弹簧形成导电路径。弹簧可以焊接到导电构件上，并且当弹簧被压缩时可以具有压靠附加的导电构件的插脚。尖头可能具有变窄的尖端，弯曲形状和毛刺，这有助于在弹簧插脚和附加导电构件之间形成令人满意的电接触。

3. 发明授权

US09633247B2 Electronic device with shared near field communications and sensor structures 有权
公开(公告)号：US09633247B2
公开(公告)日：2017-04-25
申请号：US13409615
申请日：2012-03-01
申请人： Benjamin J. Pope , Daniel W. Jarvis , Nicholas G. L. Merz , Scott A. Myers
发明人： Benjamin J. Pope , Daniel W. Jarvis , Nicholas G. L. Merz , Scott A. Myers
IPC分类号： H04B7/00 , G06K9/00 , H04B5/00
CPC分类号： G06K9/00013 , G06F3/0416 , G06F3/044 , G06K9/0002 , H04B5/0012 , H04B5/0075
摘要： An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment.

4. 发明申请

US20130231046A1 Electronic Device With Shared Near Field Communications and Sensor Structures 有权
标题翻译：具有共享近场通信和传感器结构的电子设备
公开(公告)号：US20130231046A1
公开(公告)日：2013-09-05
申请号：US13409615
申请日：2012-03-01
申请人： Benjamin J. Pope , Daniel W. Jarvis , Nicholas G. L. Merz , Scott A. Myers
发明人： Benjamin J. Pope , Daniel W. Jarvis , Nicholas G. L. Merz , Scott A. Myers
IPC分类号： H04B5/00
CPC分类号： G06K9/00013 , G06F3/0416 , G06F3/044 , G06K9/0002 , H04B5/0012 , H04B5/0075
摘要： An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment.
摘要翻译：电子设备可以具有诸如传感器的电气部件。传感器可以具有使用导电结构收集传感器数据的传感器电路。传感器可以是使用导电结构形成电容式触摸传感器电极的触摸传感器，或者可以是使用具有指纹电极阵列的导电结构来处理指纹传感器信号的指纹传感器。近场通信电路可以包括在电子设备中。当在传感器模式下操作时，传感器电路可以使用导电结构来收集指纹或其他传感器数据。当在近场通信模式下操作时，近场通信电路可以使用导电结构来发射和接收电容耦合或电感耦合的近场通信信号。指纹传感器可以具有与外部设备通信的光学结构。

5. 发明授权

US09131135B2 Electronic device flash shutter 有权
标题翻译：电子装置闪光快门
公开(公告)号：US09131135B2
公开(公告)日：2015-09-08
申请号：US12481558
申请日：2009-06-09
申请人： Daniel W. Jarvis , Richard P. Howarth , David Tupman , Richard H. Tsai
发明人： Daniel W. Jarvis , Richard P. Howarth , David Tupman , Richard H. Tsai
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , H04N5/2256 , H04N5/2257
摘要： An electronic device may have a camera module for acquiring still and video digital images of a subject. A light source such as a light-emitting diode may serve as a flash for the camera module. A shutter may be mounted above the light-emitting diode. When the light-emitting diode is not being used to produce a flash of light for illuminating the subject, the shutter may be closed to block the light-emitting diode from view by a user. During image acquisition operations in which it is desired to illuminate the subject, the shutter may be opened to allow light from the light-emitting diode to exit the electronic device. The electronic device may have a touch screen display with an active region and an inactive region. The camera module and light source may be mounted under a portion of the inactive region of the display. The shutter may include a filter structure.
摘要翻译：电子设备可以具有用于获取被摄体的静止和视频数字图像的照相机模块。诸如发光二极管的光源可以用作相机模块的闪光灯。遮光板可以安装在发光二极管的上方。当发光二极管不被用于产生用于照亮被摄体的闪光时，可以关闭快门以阻止用户观察发光二极管。在期望照亮被摄体的图像获取操作期间，可以打开快门以允许来自发光二极管的光离开电子设备。电子设备可以具有具有活动区域和非活动区域的触摸屏显示。相机模块和光源可以安装在显示器的非活动区域的一部分下方。快门可以包括过滤器结构。

6. 发明授权

US08879266B2 Thin multi-layered structures providing rigidity and conductivity 有权
标题翻译：薄的多层结构提供刚性和导电性
公开(公告)号：US08879266B2
公开(公告)日：2014-11-04
申请号：US13480458
申请日：2012-05-24
申请人： Daniel W. Jarvis , Richard Hung Minh Dinh
发明人： Daniel W. Jarvis , Richard Hung Minh Dinh
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F1/182 , H05K1/0207 , H05K3/30 , H05K2201/0338
摘要： Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.
摘要翻译：公开了具有提供增强的导电性（热和/或导电性）的多层结构的电子器件。多层结构可以具有多个相邻的层。至少一层可以主要提供结构刚性，并且至少另一层可主要提供增强的导电性。高导电性层可用于为电子器件提供更大的分散产生的热量和/或提供可接近的电压电位（例如接地平面）的能力。有利地，多层结构可以使用另外需要的结构部件提供增强的导电性，而不需要增加厚度。

8. 发明授权

US08607444B2 Method for forming a housing of an electronic device 有权
标题翻译：电子设备外壳形成方法
公开(公告)号：US08607444B2
公开(公告)日：2013-12-17
申请号：US12895822
申请日：2010-09-30
申请人： Daniel W. Jarvis , Stephen Paul Zadesky , Pinida Jan Moolsintong , Tang Yew Tan
发明人： Daniel W. Jarvis , Stephen Paul Zadesky , Pinida Jan Moolsintong , Tang Yew Tan
IPC分类号： H05K3/36
CPC分类号： H05K5/0208 , B32B37/16 , H05K5/0017 , H05K5/02 , Y10T29/49126 , Y10T29/49128 , Y10T29/49158
摘要： Improved techniques for forming an electronic device housing in which an outer housing member can be assembled with one or more other housing members of the electronic device are disclosed. The one or more other housing members can together with a thin substrate layer (or thin substrate) form a frame to which the outer housing member can be secured. The thin substrate layer facilitates molding of the one or more other housing members adjacent to the outer housing member. In one embodiment, the outer housing member can be made of glass and the one or more other housing members can be made of a polymer, such as plastic. The substrate layer can, for example, be formed of a polymer or a metal. The resulting electronic device housing can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.
摘要翻译：公开了用于形成电子设备外壳的改进技术，其中外壳构件可以与电子设备的一个或多个其它外壳构件组装。一个或多个其它壳体构件可以与薄的衬底层（或薄衬底）一起形成框架，外壳构件可以固定到框架上。薄的衬底层有助于模制与外部壳体构件相邻的一个或多个其它壳体构件。在一个实施例中，外部壳体构件可以由玻璃制成，并且一个或多个其它壳体构件可以由诸如塑料的聚合物制成。衬底层可以例如由聚合物或金属形成。所得到的电子器件外壳可以是薄的，但足够坚固以适合用于诸如便携式电子设备的电子设备中。

9. 发明申请

US20130314875A1 THIN MULTI-LAYERED STRUCTURES PROVIDING RIGIDITY AND CONDUCTIVITY 有权
标题翻译：提供刚性和电导率的多层结构
公开(公告)号：US20130314875A1
公开(公告)日：2013-11-28
申请号：US13480458
申请日：2012-05-24
申请人： Daniel W. Jarvis , Richard Hung Minh Dinh
发明人： Daniel W. Jarvis , Richard Hung Minh Dinh
IPC分类号： H05K7/20 , H05K3/30
CPC分类号： G06F1/20 , G06F1/182 , H05K1/0207 , H05K3/30 , H05K2201/0338
摘要： Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.
摘要翻译：公开了具有提供增强的导电性（热和/或导电性）的多层结构的电子器件。多层结构可以具有多个相邻的层。至少一层可以主要提供结构刚性，并且至少另一层可主要提供增强的导电性。高导电性层可用于为电子器件提供更大的分散产生的热量和/或提供可接近的电压电位（例如接地平面）的能力。有利地，多层结构可以使用另外需要的结构部件提供增强的导电性，而不需要增加厚度。

10. 发明申请

US20100273530A1 PORTABLE ELECTRONIC DEVICE 有权
标题翻译：便携式电子设备
公开(公告)号：US20100273530A1
公开(公告)日：2010-10-28
申请号：US12429157
申请日：2009-04-23
申请人： Daniel W. Jarvis , Adam D. Mittleman , Ming Xu , Ching Yu John Tam
发明人： Daniel W. Jarvis , Adam D. Mittleman , Ming Xu , Ching Yu John Tam
IPC分类号： H04B1/38 , G01J1/00 , G06F3/041 , F16F1/18
CPC分类号： F21V33/0052 , F16F1/027 , F16F1/185 , G01J1/4204 , G02B6/0081 , G06F1/1626 , G06F1/1637 , G06F1/1671 , G06F1/1684 , G06F1/169
摘要： Portable electronic devices are provided. A device may include cover glass with a light mask. The light mask may be microperforated to allow light to pass through the light mask. The microperforations may allow light to pass through the light mask. The devices may include sensors and light emitters that receive and transmit light through the microperforations. The devices may include a variable cantilever spring as part of a button assembly. The spring may be flattened against itself without exceeding its elastic limit. The devices may include display modules. The display module may include structures that block light from leaking out of the module. The structures may include opaque tapes, opaque enclosures for the display module, and other suitable structures.
摘要翻译：提供便携式电子设备。装置可以包括具有光罩的玻璃罩。光罩可以是微穿孔的，以允许光穿过光罩。微穿孔可以允许光穿过光罩。这些装置可以包括传感器和发光器，其通过微穿孔接收和透射光。装置可以包括作为按钮组件的一部分的可变悬臂弹簧。弹簧可以在不超过其弹性极限的情况下自身平坦化。设备可以包括显示模块。显示模块可以包括阻挡光从模块中泄漏的结构。结构可以包括不透明带，用于显示模块的不透明外壳以及其它合适的结构。

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