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1. 发明授权

US07828453B2 Light emitting device and lamp-cover structure containing luminescent material 有权
标题翻译：含发光材料的发光装置和灯罩结构
公开(公告)号：US07828453B2
公开(公告)日：2010-11-09
申请号：US12462348
申请日：2009-08-03
申请人： Nguyen The Tran , Yongzhi He , Frank Shi
发明人： Nguyen The Tran , Yongzhi He , Frank Shi
IPC分类号： F21V9/16 , F21V5/04
CPC分类号： F21V9/08 , F21K9/64 , F21V3/08 , F21Y2115/10
摘要： An LED lamp cover structure containing luminescent material, its fabrication methods, and an LED package using the LED lamp cover are disclosed. The LED lamp cover is comprised of a first lens cap providing the outer surface of the lamp cover, a second lens cap providing the inner surface of the lamp cover, and an encapsulating layer sandwiched between the first and second lens caps. The lamp cover of the invention covering a color LED package such as blue color can provide white light output.
摘要翻译：公开了一种包含发光材料的LED灯罩结构，其制造方法和使用该LED灯罩的LED封装。 LED灯罩由提供灯罩的外表面的第一透镜盖，提供灯罩内表面的第二透镜盖和夹在第一和第二透镜盖之间的封装层组成。覆盖诸如蓝色的彩色LED封装的本发明的灯罩可以提供白光输出。

2. 发明授权

US08436391B2 Leadframe package for light emitting diode device 有权
标题翻译：用于发光二极管器件的引线框封装
公开(公告)号：US08436391B2
公开(公告)日：2013-05-07
申请号：US12768755
申请日：2010-04-28
申请人： Nguyen The Tran , Yongzhi He , Frank Shi
发明人： Nguyen The Tran , Yongzhi He , Frank Shi
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/54 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.
摘要翻译：公开了一种具有表面张力功能的LED引线框封装，能够通过使用分配方法制造具有凸透镜形状的LED封装。本发明的LED引线框封装是用于LED封装的PPA支撑封装室，具有金属基底，四个相同的金属电极和PPA塑料，用于将金属电极和散热基底固定在一起，具有尖锐边缘的四个环形结构，具有倾斜的内表面，并且在尖锐的边缘环形结构之间形成三个环形凹槽。

3. 发明授权

US08058667B2 Leadframe package for light emitting diode device 有权
标题翻译：用于发光二极管器件的引线框封装
公开(公告)号：US08058667B2
公开(公告)日：2011-11-15
申请号：US12381408
申请日：2009-03-10
申请人： Nguyen The Tran , Yongzhi He , Frank Shi
发明人： Nguyen The Tran , Yongzhi He , Frank Shi
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/54 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.
摘要翻译：公开了一种具有表面张力功能的LED引线框封装，能够通过使用分配方法制造具有凸透镜形状的LED封装。本发明的LED引线框封装是用于LED封装的PPA支撑封装室，具有金属基底，四个相同的金属电极和PPA塑料，用于将金属电极和散热基底固定在一起，具有尖锐边缘的四个环形结构，具有倾斜的内表面，并且在尖锐的边缘环形结构之间形成三个环形凹槽。

4. 发明授权

US08350453B2 Lamp cover including a phosphor mixed structure for light emitting device 有权
标题翻译：灯罩包括用于发光装置的荧光粉混合结构
公开(公告)号：US08350453B2
公开(公告)日：2013-01-08
申请号：US12786449
申请日：2010-05-25
申请人： Nguyen The Tran , Yongzhi He , Frank Shi
发明人： Nguyen The Tran , Yongzhi He , Frank Shi
IPC分类号： H01J5/16 , H01J61/40 , H01K1/26 , H01K1/30
CPC分类号： F21V3/00 , F21K9/64 , F21V9/30 , F21Y2115/10
摘要： A lamp cover containing phosphor for providing white light emission is disclosed. The lamp cover is comprised of a light-partial-reflective cap structure providing the outer surface of the lamp cover, wherein the light-partial-reflective cap structure is composed of a plurality of light transparent layers and a plurality of vacuum layers that are stacked in an alternating manner from outside to inside, a supporting transparent cap structure providing the inner surface of the lamp cover, and a phosphor mixed structure mechanically supported by the outer surface of the supporting transparent cap structure, wherein the outer surface of the phosphor mixed structure is adjacent to the most inner vacuum layer of the light-partial-reflective cap structure. Once the lamp cover is combined with a phosphor exciting light source, the light-partial-reflective cap structure partially prevents phosphor exciting light from escaping from the lamp cover by using Fresnel reflection.
摘要翻译：公开了一种含有用于提供白光发射的磷光体的灯罩。灯罩由提供灯罩外表面的光部分反射盖结构组成，其中光部分反射盖结构由多个透光层和多层叠层的真空层组成以外部至内部的交替方式设置提供灯罩内表面的支承透明帽结构，以及由支撑透明帽结构的外表面机械支撑的荧光粉混合结构，其中荧光粉混合结构的外表面与光部分反射盖结构的最内层真空层相邻。一旦灯罩与磷光体激发光源组合，则部分反光帽结构通过使用菲涅尔反射部分地防止磷光体激发光从灯罩逸出。

5. 发明授权

US07972023B2 Lamp-cover structure containing luminescent material 有权
标题翻译：包含发光材料的灯罩结构
公开(公告)号：US07972023B2
公开(公告)日：2011-07-05
申请号：US12381407
申请日：2009-03-10
申请人： Nguyen The Tran , Yongzhi He , Frank Shi
发明人： Nguyen The Tran , Yongzhi He , Frank Shi
IPC分类号： F21V9/16 , F21V5/00
CPC分类号： B29D11/00634 , F21K9/69 , F21V3/04 , F21V3/08 , F21V9/30 , F21Y2115/10 , H01L33/505 , H01L33/58
摘要： An LED lamp cover structure containing luminescent material and its fabrication methods are described. The LED lamp cover is comprised of a first lens cap providing the outer surface of the lamp cover, a second lens cap providing the inner surface of the lamp cover, and an encapsulating layer sandwiched between the lens cap providing the outer surface of the lamp cover and the lens cap providing the inner surface of the lamp cover, which is mixed with luminescent material for wavelength conversion.
摘要翻译：描述了含有发光材料的LED灯罩结构及其制造方法。 LED灯盖由提供灯罩外表面的第一透镜盖，提供灯罩内表面的第二透镜盖和夹在提供灯盖外表面的透镜盖之间的封装层组成并且所述透镜盖提供所述灯罩的内表面，其与用于波长转换的发光材料混合。

6. 发明申请

US20100230791A1 LEADFRAME PACKAGE FOR LIGHT EMITTING DIODE DEVICE 有权
标题翻译：用于发光二极管器件的LEADFRAME封装
公开(公告)号：US20100230791A1
公开(公告)日：2010-09-16
申请号：US12768755
申请日：2010-04-28
申请人： Nguyen The Tran , Yongzhi He , Frank Shi
发明人： Nguyen The Tran , Yongzhi He , Frank Shi
IPC分类号： H01L23/495
CPC分类号： H01L33/486 , H01L33/54 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.
摘要翻译：公开了一种具有表面张力功能的LED引线框封装，能够通过使用分配方法制造具有凸透镜形状的LED封装。本发明的LED引线框封装是用于LED封装的PPA支撑封装室，具有金属基底，四个相同的金属电极和PPA塑料，用于将金属电极和散热基底固定在一起，具有尖锐边缘的四个环形结构，具有倾斜的内表面，并且在尖锐的边缘环形结构之间形成三个环形凹槽。

7. 发明申请

US20100232133A1 Lamp-cover structure containing luminescent material 有权
标题翻译：包含发光材料的灯罩结构
公开(公告)号：US20100232133A1
公开(公告)日：2010-09-16
申请号：US12381407
申请日：2009-03-10
申请人： Nguyen The Tran , Yongzhi He , Frank Shi
发明人： Nguyen The Tran , Yongzhi He , Frank Shi
IPC分类号： F21V9/16 , G02B5/00
CPC分类号： B29D11/00634 , F21K9/69 , F21V3/04 , F21V3/08 , F21V9/30 , F21Y2115/10 , H01L33/505 , H01L33/58
摘要： An LED lamp cover structure containing luminescent material and its fabrication methods are described. The LED lamp cover is comprised of a first lens cap providing the outer surface of the lamp cover, a second lens cap providing the inner surface of the lamp cover, and an encapsulating layer sandwiched between the lens cap providing the outer surface of the lamp cover and the lens cap providing the inner surface of the lamp cover, which is mixed with luminescent material for wavelength conversion.
摘要翻译：描述了含有发光材料的LED灯罩结构及其制造方法。 LED灯盖由提供灯罩外表面的第一透镜盖，提供灯罩内表面的第二透镜盖和夹在提供灯盖外表面的透镜盖之间的封装层组成并且所述透镜盖提供所述灯罩的内表面，其与用于波长转换的发光材料混合。

8. 发明申请

US20110291548A1 LAMP COVER FOR LIGHT EMITTING DEVICE 有权
标题翻译：用于发光装置的灯罩
公开(公告)号：US20110291548A1
公开(公告)日：2011-12-01
申请号：US12786449
申请日：2010-05-25
申请人： Tran NGUYEN THE , Yongzhi He , Frank Shi
发明人： Tran NGUYEN THE , Yongzhi He , Frank Shi
IPC分类号： H01J1/62 , F21V13/10
CPC分类号： F21V3/00 , F21K9/64 , F21V9/30 , F21Y2115/10
摘要： A lamp cover containing phosphor for providing white light emission is disclosed. The lamp cover is comprised of a light-partial-reflective cap structure providing the outer surface of the lamp cover, wherein the light-partial-reflective cap structure is composed of a plurality of light transparent layers and a plurality of vacuum layers that are alternatively stacked from outside to inside, a supporting transparent cap structure providing the inner surface of the lamp cover, and a phosphor mixed structure mechanically supported by the outer surface of the supporting transparent cap structure, wherein the outer surface of the phosphor mixed structure is adjacent to the most inner vacuum layer of the light-partial-reflective cap structure. Once the lamp cover is combined with a phosphor exciting light source, the light-partial-reflective cap structure partially prevents phosphor exciting light from escaping from the lamp cover by using Fresnel reflection.
摘要翻译：公开了一种含有用于提供白光发射的磷光体的灯罩。灯罩由提供灯罩外表面的光部分反射盖结构组成，其中光部分反射盖结构由多个透光层和多个真空层构成从外部向内侧堆叠设置提供灯罩内表面的支撑透明帽结构，以及由支撑透明帽结构的外表面机械支撑的荧光粉混合结构，其中荧光体混合结构的外表面与光部分反射盖结构的最内层真空层。一旦灯罩与磷光体激发光源组合，则部分反光帽结构通过使用菲涅尔反射部分地防止磷光体激发光从灯罩逸出。

9. 发明授权

US08039862B2 White light emitting diode package having enhanced white lighting efficiency and method of making the same 有权
标题翻译：具有增强的白光照明效率的白色发光二极管封装及其制造方法
公开(公告)号：US08039862B2
公开(公告)日：2011-10-18
申请号：US12381409
申请日：2009-03-10
申请人： Nguyen The Tran , Yungzhi He , Frank Shi
发明人： Nguyen The Tran , Yungzhi He , Frank Shi
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/483 , H01L33/54 , H01L33/58 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A white light emitting diode (LED) package with multilayered encapsulation structure and the packaging methods are disclosed. The white LED package structure includes metal electrodes, a heat dissipation base, a PPA plastic for fixing the electrodes and the heat dissipation base together, at least one LED die, a die attaching material, gold wires for electrically connecting the LED die to the electrodes, a first type of silicone encapsulant, a second type of silicone encapsulant, and a phosphor containing layer. The invention utilizes a low-refractive index silicone (the second type of silicone encapsulant) to separate the phosphor containing layer away from the first type of silicone, which covers the LED die, to prevent/reduce emitted light going backward and hitting the LED die.
摘要翻译：公开了一种具有多层封装结构的白色发光二极管（LED）封装和封装方法。白色LED封装结构包括金属电极，散热基座，用于固定电极的PPA塑料和散热基底，至少一个LED管芯，管芯安装材料，用于将LED管芯电连接到电极的金线，第一类型的硅酮密封剂，第二类型的硅氧烷密封剂和含磷光体层。本发明利用低折射率硅氧烷（第二种类型的硅氧烷密封剂）将含荧光体层与第一种类型的覆盖LED芯片的硅树脂隔开，以防止/减少向后发射的光并击中LED芯片。

10. 发明授权

US08278415B2 Dimeric high affinity EGFR constructs and uses thereof 有权
标题翻译：二聚高亲和力EGFR构建体及其用途
公开(公告)号：US08278415B2
公开(公告)日：2012-10-02
申请号：US12514631
申请日：2007-12-20
申请人： Wang Bryan , Frank Shi , Juliane Mills
发明人： Wang Bryan , Frank Shi , Juliane Mills
IPC分类号： C07K14/00
CPC分类号： C07K14/71 , A61K38/00 , C07K2319/30
摘要： Polypeptides comprising EGFR extracellular domains I-III capable of forming dimeric EGF-binding proteins are provided. The dimeric construct of the invention is useful in applications where high affinity EGF binding is desired and can be used to select agents capable of binding to native EGFR in the presence of EGF.
摘要翻译：提供了包含能够形成二聚体EGF结合蛋白的EGFR细胞外结构域I-III的多肽。本发明的二聚体构建体可用于需要高亲和力EGF结合并可用于选择能在EGF存在下与天然EGFR结合的试剂的应用中。

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